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LIS2DU12TR

Public Made by Adom

by adom

STMICROELECTRONICS Global Sourcing Parts, LGA-12(2x2). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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LIS2DU12TR

STMICROELECTRONICS · Global Sourcing Parts · LGA-12(2x2)

LIS2DU12TR from STMICROELECTRONICS, in a LGA-12(2x2). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SCL/SPC input I²C/MIPI I3C serial clock (SCL) and SPI serial port clock (SPC); default input without pull-up.
2 CS input SPI/I²C/MIPI I3C mode selection (1: SPI idle, I²C/I3C enabled; 0: SPI enabled, I²C/I3C disabled); internal pull-up that can be disconnected via CS_PU_DIS.
3 SDO/SA0 bidirectional SPI serial data output (SDO) and I²C device address LSB (SA0); internal pull-up that can be disconnected via SDO_PU_DIS.
4 SDA/SDI/SDO bidirectional I²C/MIPI I3C serial data (SDA), SPI serial data input (SDI) and 3-wire interface serial data output (SDO); default input without pull-up.
5 NC unconnected Internally not connected; can be tied to Vdd, Vdd_IO, or GND.
6 GND power_in 0 V supply.
7 RES input Reserved pin; must be connected to GND.
8 GND power_in 0 V supply.
9 Vdd power_in Power supply for the device core (1.62 to 3.6 V operational range); decoupling capacitors placed close to this pin.
10 Vdd_IO power_in Power supply for the I/O pins.
11 INT2 bidirectional Interrupt pin 2, or clock input when selected in single data conversion on demand; default input with internal pull-down that can be disabled via PD_DIS_INT2.
12 INT1 bidirectional Interrupt pin 1; default input with internal pull-down that can be disabled via PD_DIS_INT1.

Key specifications

Parameter Value
Manufacturer STMICROELECTRONICS
Package LGA-12(2x2)
Category Global Sourcing Parts
Pins 12

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage Vdd 1.62 1.8 3.6 V 6
I/O pins supply voltage Vdd_IO 1.62 V max printed as Vdd + 0.1 V 6
Digital low-level output voltage VOL 0.2 V IOL = 4 mA 6
Temperature offset Toff -15 15 °C 6
Operating temperature range Top -40 85 °C 6
Self-test positive difference X-axis ST 50 700 mg X-axis 5
Self-test positive difference Y-axis ST 50 700 mg Y-axis 5
Self-test positive difference Z-axis ST 200 1200 mg Z-axis 5
SPI clock cycle tc(SPC) 100 ns 7
SPI clock frequency fc(SPC) 10 MHz 7
CS setup time tsu(CS) 6 ns 7
CS hold time th(CS) 40 ns 7
SDI input setup time tsu(SI) 12 ns 7
SDI input hold time th(SI) 15 ns 7
SDO valid output time tv(SO) 50 ns 7
SDO output hold time th(SO) 9 ns 7
SDO output disable time tdis(SO) 50 ns 7
SCL clock frequency (fast mode) f(SCL) 0 400 kHz I²C fast mode 8
SCL clock frequency (fast mode plus) f(SCL) 0 1000 kHz I²C fast mode plus 8
Capacitive load for each bus line (fast mode) CB 400 pF I²C fast mode 8
Capacitive load for each bus line (fast mode plus) CB 550 pF I²C fast mode plus 8
Supply voltage Vdd -0.3 4.3 V 9
I/O pins supply voltage Vdd_IO -0.3 4.3 V 9
Input voltage on any control pin Vin -0.3 V max printed as Vdd_IO+0.3 V 9
Acceleration powered, 0.5 ms APOW 3000 g any axis, powered, Vdd = 1.8 V, 0.5 ms 9
Acceleration powered, 0.2 ms APOW 10000 g any axis, powered, Vdd = 1.8 V, 0.2 ms 9
Acceleration unpowered, 0.5 ms AUNP 3000 g any axis, unpowered, 0.5 ms 9
Acceleration unpowered, 0.2 ms AUNP 10000 g any axis, unpowered, 0.2 ms 9
Operating temperature range TOP -40 85 °C 9
Storage temperature range TSTG -40 125 °C 9
Electrostatic discharge protection ESD 2 kV HBM 9
Current consumption in normal mode IddNM 6.1 µA FS = ±8 g, ODR = 800 Hz, BW = ODR/2 with anti-aliasing filter 6
Current consumption in ultralow-power mode IddULP 0.47 µA FS = ±8 g, ODR = 1.6 Hz, BW = ODR/2 6
Current consumption in power-down Idd_PD 20 nA 6
Noise density - normal mode An 287 µg/√Hz @ FS ±8 g, ODR = 800 Hz, BW = ODR/2 5
Zero-g level offset accuracy TyOff 11 mg printed ±11 5
Zero-g offset change vs. temperature TCO 1 mg/°C printed ±1 5
Sensitivity change vs. temperature TCS 0.035 %/°C printed ±0.035 5
Sensitivity So 0.976 mg/digit @ FS ±2 g 5
Temperature sensor output change vs. temperature TSDr 0.045 °C/LSB 12-bit resolution 6

CAD (KiCad official)

  • Symbol: LIS2DU12TR
  • Footprint: Package_LGA:LGA-12_2x2mm_P0.5mm
  • 3D model: LGA-12(2x2) (KiCad packages3D, STEP)
  • 3D model files: lis2du12tr-etched.step / lis2du12tr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lis2du12tr.step / lis2du12tr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMICROELECTRONICS datasheet (56 pp, sha256 32528fafab2040e5, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF