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Contents

README

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LBZX84C8V2LT1G

LRC · Zener Diodes · SOT-23

LBZX84C8V2LT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode terminal of the Zener regulator diode; the datasheet pinout lists pin 1 as Anode for the BZX84C series, and the forward voltage is VF = 0.90 V max at IF = 10 mA.
2 No Connection unconnected Pin 2 is not connected internally and is listed as No Connection in the datasheet pinout.
3 Cathode passive Cathode terminal of the Zener regulator diode; for the LBZX84C8V2LT1G (marking Z7) the nominal zener voltage is 8.2 V at IZT1 = 5 mA, with a range of 7.7 V to 8.7 V.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage VZ1 (IZT1 test) VZ1 7.7 8.2 8.7 V @ IZT1 = 5 mA (Note 3) 2
Zener voltage VZ2 (IZT2 test) VZ2 7.6 8.7 V @ IZT2 = 1 mA (Note 3) 2
Zener voltage VZ3 (IZT3 test) VZ3 7.7 8.8 V @ IZT3 = 20 mA (Note 3) 2
Maximum zener impedance ZZT1 ZZT1 15 Ω @ IZT1 = 5 mA 2
Maximum zener impedance ZZT2 ZZT2 80 Ω @ IZT2 = 1 mA 2
Maximum zener impedance ZZT3 ZZT3 6 Ω @ IZT3 = 20 mA 2
Maximum reverse leakage current IR 0.7 µA @ VR = 5 V 2
Zener voltage temperature coefficient VZ 3.2 6.2 mV/k @ IZT1 = 5 mA 2
Maximum diode capacitance C 135 pF @ VR = 0, f = 1 MHz 2
Total device dissipation, FR-5 board PD 225 mW TA = 25°C, FR-5 board (Note 1) 1
Derate above 25°C, FR-5 board 1.8 mW/°C Derate above 25°C (FR-5 board) 1
Thermal resistance junction to ambient, FR-5 board RθJA 556 °C/W FR-5 board (Note 1) 1
Total device dissipation, alumina substrate PD 300 mW TA = 25°C, alumina substrate (Note 2) 1
Derate above 25°C, alumina substrate 2.4 mW/°C Derate above 25°C (alumina substrate) 1
Thermal resistance junction to ambient, alumina substrate RθJA 417 °C/W Alumina substrate (Note 2) 1
Junction and storage temperature TJ, Tstg -55 150 °C 1
Maximum case temperature for soldering 260 °C 10 seconds 1

CAD (KiCad official)

  • Symbol: LBZX84C8V2LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: lbzx84c8v2lt1g-etched.step / lbzx84c8v2lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lbzx84c8v2lt1g.step / lbzx84c8v2lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (5 pp, sha256 dace3b89325bb5e5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF