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LBZX84C3V3LT1G

LRC · Zener Diodes · SOT-23

LBZX84C3V3LT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode terminal of the BZX84C3V3LT1G zener diode; the datasheet pinout lists pin 1 as Anode for the SOT-23 package.
2 NC unconnected No internal connection; the datasheet pinout states pin 2 is No Connection.
3 Cathode passive Cathode terminal of the zener diode, which regulates at a nominal VZ of 3.3 V at IZT = 5 mA per the electrical table for the LBZX84C3V3LT1G.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (standard tolerance, IZT1 test) VZ1 3.1 3.3 3.5 V @ IZT1 = 5 mA (Note 3) 2
Zener voltage (IZT2 test) VZ2 2.3 2.9 V @ IZT2 = 1 mA (Note 3) 2
Zener voltage (IZT3 test) VZ3 3.6 4.2 V @ IZT3 = 20 mA (Note 3) 2
Zener dynamic impedance (IZT1 test) ZZT1 95 Ω @ IZT1 = 5 mA 2
Zener dynamic impedance (IZT2 test) ZZT2 600 Ω @ IZT2 = 1 mA 2
Zener dynamic impedance (IZT3 test) ZZT3 40 Ω @ IZT3 = 20 mA 2
Max reverse leakage current IR 5 µA @ VR = 1 V 2
Zener voltage temperature coefficient VZ -3.5 0 mV/k @ IZT1 = 5 mA 2
Forward voltage VF 0.9 V @ IF = 10 mA 2
Total device dissipation, FR-5 board (TA = 25°C) PD 225 mW FR-5 board (Note 1), TA = 25°C 1
Total device dissipation, alumina substrate (TA = 25°C) PD 300 mW Alumina substrate (Note 2), TA = 25°C 1
Thermal resistance junction to ambient, FR-5 board RθJA 556 °C/W FR-5 board (Note 1) 1
Thermal resistance junction to ambient, alumina substrate RθJA 417 °C/W Alumina substrate (Note 2) 1
Junction and storage temperature TJ, Tstg -55 150 °C 1

CAD (KiCad official)

  • Symbol: LBZX84C3V3LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: lbzx84c3v3lt1g-etched.step / lbzx84c3v3lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lbzx84c3v3lt1g.step / lbzx84c3v3lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (5 pp, sha256 dace3b89325bb5e5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF