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Contents

README

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LBZX84C36LT1G

LRC · Zener Diodes · SOT-23

LBZX84C36LT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the zener diode, pin 1 per the datasheet pinout note '1-Anode'; the datasheet states no pin-specific electrical limits for this pin.
2 NC unconnected No connection on pin 2 per the datasheet pinout note '2-No Connection'.
3 Cathode passive Cathode of the zener diode, pin 3 per the datasheet pinout note '3-Cathode'; the datasheet states no pin-specific electrical limits for this pin.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (VZ1) VZ1 34 36 38 V @ IZT1 = 2 mA; pulse test at TA = 25°C (Note 3) 2
Zener voltage (VZ2) VZ2 33.8 38 V @ IZT2 = 0.1 mA 2
Zener voltage (VZ3) VZ3 34.1 38.4 V @ IZT3 = 10 mA 2
Zener voltage temperature coefficient VZ 30.4 37.4 mV/K @ IZT1 = 2 mA 2
Max reverse leakage current IR 0.05 µA @ VR = 25.2 V 2
Forward voltage VF 0.9 V @ IF = 10 mA 2
Zener impedance (ZZT1) ZZT1 90 Ω @ IZT1 = 2 mA 2
Zener impedance (ZZT2) ZZT2 350 Ω @ IZT4 = 0.5 mA 2
Zener impedance (ZZT3) ZZT3 60 Ω @ IZT3 = 10 mA 2
Diode capacitance C 70 pF @ VR = 0, f = 1 MHz 2
Total device dissipation, FR-5 board PD 225 mW TA = 25°C (Note 1) 1
Derate above 25°C, FR-5 board 1.8 mW/°C Derate above 25°C (FR-5 board, Note 1) 1
Thermal resistance junction to ambient, FR-5 board R QJA 556 °C/W FR-5 board (Note 1) 1
Total device dissipation, alumina substrate PD 300 mW Alumina substrate (Note 2), TA = 25°C 1
Derate above 25°C, alumina substrate 2.4 mW/°C Derate above 25°C (alumina substrate, Note 2) 1
Thermal resistance junction to ambient, alumina substrate R QJA 417 °C/W Alumina substrate (Note 2) 1
Junction and storage temperature TJ, Tstg -55 150 °C 1
Maximum case temperature for soldering 260 °C for 10 seconds 1

CAD (KiCad official)

  • Symbol: LBZX84C36LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: lbzx84c36lt1g-etched.step / lbzx84c36lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lbzx84c36lt1g.step / lbzx84c36lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (5 pp, sha256 dace3b89325bb5e5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF