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Contents

README

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LBZX84C33LT1G

LRC · Zener Diodes · SOT-23

LBZX84C33LT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode terminal of the zener diode; the datasheet pinout gives pin 1 as Anode.
2 No Connection unconnected Pin 2 is not connected internally and is listed as No Connection in the datasheet pinout.
3 Cathode passive Cathode terminal of the zener diode; the datasheet pinout gives pin 3 as Cathode.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Forward voltage VF 0.9 V IF = 10 mA 2
Zener voltage (test set 1) VZ1 31 33 35 V @ IZT1 = 2 mA 2
Zener voltage (test set 2) VZ2 30.8 35 V @ IZT2 = 0.1 mA 2
Zener voltage (test set 3) VZ3 31.1 35.4 V @ IZT3 = 10 mA 2
Zener dynamic impedance (test set 1) ZZT1 80 Ω @ IZT1 = 2 mA 2
Zener dynamic impedance (test set 2) ZZT2 325 Ω @ IZT4 = 0.5 mA (as printed) 2
Zener dynamic impedance (test set 3) ZZT3 55 Ω @ IZT3 = 10 mA 2
Maximum reverse leakage current IR 0.05 µA VR = 23.1 V 2
Zener voltage temperature coefficient VZ 27.4 33.4 mV/k @ IZT1 = 2 mA 2
Total device dissipation (FR-5 board) PD 225 mW TA = 25°C, FR-5 board (Note 1) 1
Thermal resistance junction to ambient (FR-5 board) RθJA 556 °C/W FR-5 board (Note 1) 1
Total device dissipation (alumina substrate) PD 300 mW TA = 25°C, alumina substrate (Note 2) 1
Thermal resistance junction to ambient (alumina substrate) RθJA 417 °C/W alumina substrate (Note 2) 1
Junction and storage temperature TJ, Tstg -55 150 °C 1

CAD (KiCad official)

  • Symbol: LBZX84C33LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: lbzx84c33lt1g-etched.step / lbzx84c33lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lbzx84c33lt1g.step / lbzx84c33lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (5 pp, sha256 dace3b89325bb5e5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF