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LBZX84C2V4LT1G

LRC · Zener Diodes · SOT-23

LBZX84C2V4LT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the zener diode; the datasheet gives a forward voltage of 0.90 V max at IF = 10 mA.
2 NC unconnected No connection; the datasheet pinout lists pin 2 as No Connection.
3 Cathode passive Cathode of the zener diode; the LBZX84C2V4LT1G has VZ of 2.2 V min, 2.4 V nominal and 2.6 V max at IZT1 = 5 mA.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (VZ1) at IZT1 VZ1 2.2 2.4 2.6 V @ IZT1 = 5 mA; pulse test, TA = 25°C (Note 3) 2
Zener voltage (VZ2) at IZT2 VZ2 1.7 2.1 V @ IZT2 = 1 mA; pulse test, TA = 25°C (Note 3) 2
Zener voltage (VZ3) at IZT3 VZ3 2.6 3.2 V @ IZT3 = 20 mA; pulse test, TA = 25°C (Note 3) 2
Dynamic impedance (ZZT1) ZZT1 100 Ω @ IZT1 = 5 mA 2
Dynamic impedance (ZZT2) ZZT2 600 Ω @ IZT2 = 1 mA 2
Dynamic impedance (ZZT3) ZZT3 50 Ω @ IZT3 = 20 mA 2
Max reverse leakage current IR 50 µA @ VR = 1 V 2
Zener voltage temperature coefficient VZ -3.5 0 mV/k @ IZT1 = 5 mA 2
Zener diode capacitance C 450 pF @ VR = 0, f = 1 MHz 2
Forward voltage VF 0.9 V @ IF = 10 mA 2
Total device dissipation (FR-5 board) PD 225 mW TA = 25°C; FR-5 board (Note 1) 1
Derating above 25°C (FR-5 board) 1.8 mW/°C derate above TA = 25°C; FR-5 board (Note 1) 1
Thermal resistance junction to ambient (FR-5 board) RθJA 556 °C/W FR-5 board (Note 1) 1
Total device dissipation (alumina substrate) PD 300 mW TA = 25°C; alumina substrate (Note 2) 1
Derating above 25°C (alumina substrate) 2.4 mW/°C derate above TA = 25°C; alumina substrate (Note 2) 1
Thermal resistance junction to ambient (alumina substrate) RθJA 417 °C/W alumina substrate (Note 2) 1
Junction and storage temperature TJ, Tstg -55 150 °C 1
Maximum case temperature for soldering 260 °C for 10 seconds 1

CAD (KiCad official)

  • Symbol: LBZX84C2V4LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: lbzx84c2v4lt1g-etched.step / lbzx84c2v4lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lbzx84c2v4lt1g.step / lbzx84c2v4lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (5 pp, sha256 dace3b89325bb5e5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF