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Contents

README

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LBZX84C22LT1G

LRC · Zener Diodes · SOT-23

LBZX84C22LT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the zener diode; forward voltage VF is 0.90 V max at IF = 10 mA.
2 NC unconnected No connection.
3 Cathode passive Cathode of the zener diode; for the 22 V part (LBZX84C22LT1G) VZ is 20.8 V min to 23.3 V max at IZT = 5 mA.

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage 1 VZ1 20.8 22 23.3 V IZT1 = 5 mA, TA = 25°C 2
Zener Voltage 2 VZ2 20.7 23.2 V IZT2 = 1 mA, TA = 25°C 2
Zener Voltage 3 VZ3 20.9 23.4 V IZT3 = 20 mA, TA = 25°C 2
Dynamic Impedance 1 ZZT1 55 Ω IZT1 = 5 mA 2
Dynamic Impedance 2 ZZT2 250 Ω IZT2 = 1 mA 2
Dynamic Impedance 3 ZZT3 25 Ω IZT3 = 20 mA 2
Max Reverse Leakage Current IR 0.05 µA VR = 15.4 V 2
Zener Voltage Temperature Coefficient VZ 16.4 20 mV/k IZT1 = 5 mA 2
Capacitance C 85 pF VR = 0, f = 1 MHz 2
Forward Voltage VF 0.9 V IF = 10 mA 2
Total Device Dissipation FR-5 Board PD 225 mW TA = 25°C, FR-5 board (Note 1) 1
Total Device Dissipation Alumina Substrate PD 300 mW TA = 25°C, Alumina substrate (Note 2) 1
Thermal Resistance Junction to Ambient (FR-5) RθJA 556 °C/W FR-5 board 1
Thermal Resistance Junction to Ambient (Alumina) RθJA 417 °C/W Alumina substrate 1
Junction and Storage Temperature TJ, Tstg -55 150 °C 1
Derating above 25°C (FR-5) 1.8 mW/°C FR-5 board, TA > 25°C 1
Derating above 25°C (Alumina) 2.4 mW/°C Alumina substrate, TA > 25°C 1
Maximum Case Temperature for Soldering 260 °C 10 seconds 1

CAD (KiCad official)

  • Symbol: LBZX84C22LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: lbzx84c22lt1g-etched.step / lbzx84c22lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lbzx84c22lt1g.step / lbzx84c22lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (5 pp, sha256 dace3b89325bb5e5, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF