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LBZX84C13LT1G

LRC · Zener Diodes · SOT-23

LBZX84C13LT1G from LRC, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the Zener diode; the datasheet's pinout note identifies pin 1 as Anode for the BZX84CxxxLT1 series.
2 NC unconnected No Connection per the datasheet pinout note; this pin is not connected to the Zener diode.
3 Cathode passive Cathode of the Zener diode, the terminal that is reverse-biased for voltage regulation (13 V nominal VZ for this part, 12.4 V min to 14.1 V max at IZT1 = 5 mA).

Key specifications

Parameter Value
Manufacturer LRC
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (VZ1), standard tolerance VZ1 12.4 13 14.1 V @ IZT1 = 5 mA (Note 3) 2
Zener voltage (VZ2) VZ2 12.3 14 V @ IZT2 = 1 mA (Note 3) 2
Zener voltage (VZ3) VZ3 12.5 14.2 V @ IZT3 = 20 mA (Note 3) 2
Max reverse leakage current IR 0.1 µA @ VR = 8 V 2
Zener voltage temperature coefficient VZ 7 11 mV/k @ IZT1 = 5 mA 2
Forward voltage VF 0.9 V @ IF = 10 mA 2
Dynamic impedance (ZZT1) ZZT1 30 Ω @ IZT1 = 5 mA 2
Dynamic impedance (ZZT2) ZZT2 170 Ω @ IZT2 = 1 mA 2
Dynamic impedance (ZZT3) ZZT3 15 Ω @ IZT3 = 20 mA 2
Capacitance C 120 pF @ VR = 0, f = 1 MHz 2
Total device dissipation, FR-5 board PD 225 mW TA = 25°C (Note 1) 1
Thermal resistance junction to ambient, FR-5 board RθJA 556 °C/W FR-5 board (Note 1) 1
Total device dissipation, alumina substrate PD 300 mW Alumina substrate (Note 2), TA = 25°C 1
Thermal resistance junction to ambient, alumina substrate RθJA 417 °C/W Alumina substrate (Note 2) 1
Junction and storage temperature TJ, Tstg -55 150 °C 1

CAD (KiCad official)

  • Symbol: LBZX84C13LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: lbzx84c13lt1g-etched.step / lbzx84c13lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lbzx84c13lt1g.step / lbzx84c13lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (5 pp, sha256 dace3b89325bb5e5, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF