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Ray Publish 0.1.0 30c2917 1d ago

LBSS139WT1G

LRC · MOSFETs · SC-70

LBSS139WT1G from LRC, in a SC-70. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Gate input Gate of the N-channel MOSFET, with VGS limited to ±20 V continuous and a threshold VGS(th) of 0.5 V to 1.5 V.
2 Source passive Source of the N-channel MOSFET; continuous drain current is 200 mA at TA = 25°C and pulsed is 800 mA.
3 Drain passive Drain of the N-channel MOSFET, with a maximum drain-source voltage VDSS of 60 V.

Key specifications

Parameter Value
Manufacturer LRC
Package SC-70
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage V(BR)DSS 60 V VGS = 0, ID = 250 μA 2
Gate Threshold Voltage VGS(th) 0.5 1.5 V VDS = VGS, ID = 1.0 mA 2
Forward Transconductance gfs 100 mS VDS = 25 V, ID = 200 mA, f = 1.0 MHz 2
Forward Voltage (Source-Drain Diode) VSD 1.3 V IS = 0.5 A, VGS = 0 V 2
Zero Gate Voltage Drain Current IDSS 0.1 μA VGS = 0, VDS = 25 V 2
Zero Gate Voltage Drain Current IDSS 10 μA VGS = 0, VDS = 50 V 2
Gate-Body Leakage Current, Forward IGSSF 0.1 μA VGS = 20 V 2
Gate-Body Leakage Current, Reverse IGSSR -10 μA VGS = -20 V 2
Static Drain-Source On-State Resistance RDS(on) 5.6 10 Ω VGS = 2.75 V, ID < 200 mA 2
Static Drain-Source On-State Resistance RDS(on) 1.5 3.5 Ω VGS = 5.0 V, ID = 200 mA 2
Drain-Source Voltage VDSS 60 V TA = 25°C 1
Gate-to-Source Voltage, Continuous VGS -20 20 V Continuous 1
Drain Current, Continuous ID 200 mA TA = 25°C 1
Drain Current, Pulsed IDM 800 mA tp ≤ 10 μs 1
Junction and Storage Temperature TJ,Tstg -55 150 °C 1
Maximum Lead Temperature for Soldering Purposes TL 260 °C for 10 seconds 1
Total Device Dissipation, FR-4 Board PD 150 mW TA = 25°C, FR-4 board (Note 1) 1
Derate above 25°C 1.2 mW/°C above 25°C 1
Thermal Resistance, Junction-to-Ambient RΘJA 833 °C/W FR-4 board (Note 1) 1

CAD (KiCad official)

  • Symbol: LBSS139WT1G
  • Footprint: Package_TO_SOT_SMD:SOT-323_SC-70
  • 3D model: SC-70 (KiCad packages3D, STEP)
  • 3D model files: lbss139wt1g-etched.step / lbss139wt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); lbss139wt1g.step / lbss139wt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: LRC datasheet (6 pp, sha256 e5945f7694d42448, retrieved 2026-11-07, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF