# LBAS21HT1G

**LRC** · Switching Diodes · SOD-323

LBAS21HT1G from LRC, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CATHODE | passive | Cathode terminal of the high-voltage switching diode, rated for a continuous reverse voltage (VR) of 250 Vdc. |
| 2 | ANODE | passive | Anode terminal of the high-voltage switching diode, rated for a peak forward current of 200 mAdc and a peak forward surge current of 625 mAdc. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | LRC |
| Package | SOD-323 |
| Category | Diodes |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Continuous Reverse Voltage | VR |  |  | 250 | Vdc |  | 1 |
| Peak Forward Current | IF |  |  | 200 | mAdc |  | 1 |
| Peak Forward Surge Current | IFM(surge) |  |  | 625 | mAdc |  | 1 |
| Junction and Storage Temperature Range | TJ, Tstg | -55 |  | 150 | °C |  | 1 |
| Total Device Dissipation | PD |  |  | 200 | mW | FR-5 Board, TA = 25°C | 1 |
| Thermal Resistance Junction to Ambient | RθJA |  |  | 635 | °C/W |  | 1 |
| Reverse Voltage Leakage Current | IR |  |  | 100 | µAdc | VR = 200 Vdc, TJ = 150°C | 1 |
| Reverse Voltage Leakage Current | IR |  |  | 0.1 | µAdc | VR = 200 Vdc | 1 |
| Reverse Breakdown Voltage | V(BR) | 250 |  |  | Vdc | IBR = 100 µAdc | 1 |
| Forward Voltage | VF |  |  | 1000 | mV | IF = 100 mAdc | 1 |
| Forward Voltage | VF |  |  | 1250 | mV | IF = 200 mAdc | 1 |
| Diode Capacitance | CD |  |  | 5 | pF | VR = 0, f = 1.0 MHz | 1 |
| Reverse Recovery Time | trr |  |  | 50 | ns | IF = IR = 30 mAdc, RL = 100 Ω | 1 |

## CAD (KiCad official)

- Symbol: `LBAS21HT1G`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `lbas21ht1g-etched.step` / `lbas21ht1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `lbas21ht1g.step` / `lbas21ht1g.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [LRC datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8586172669834235904) (5 pp, sha256 `11d795877866c6da`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/lbas21ht1g-datasheet.pdf)