component
L78M15ABDT-TR
Public Made by Adomby adom
STMicroelectronics Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, DPAK. Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
← Commit history
page.json: fold the "TAB" entry into pin 2. On TO-252-2 the tab is not a separate pad - it is that lead - so nothing was ever unconnected, but the page listed it as its own pin and pads.json reported pin-not-in-symbol for a pin that cannot exist. Target chosen because net GND matches pin 2; the tab's description is merged into that pin rather than dropped.
2 files changed
+4−17
pads.json+2−9@@ -24,14 +24,7 @@ "3" ], "paste_apertures": 4,- "issues": [- {- "kind": "pin-not-in-symbol",- "pin": "TAB",- "name": "GND",- "detail": "page.json describes pin \"TAB\" (GND) from the datasheet, but the symbol has no such pin, so nothing can connect to it"- }- ],+ "issues": [], "pads": [ { "pad": "1",@@ -84,7 +77,7 @@ "pin": "2", "name": "GND", "type": "power_in",- "description": "Common ground reference for input and output. Electrically tied to the exposed thermal tab on DPAK, which also serves as the primary heat-transfer path to the PCB copper pour.",+ "description": "Common ground reference for input and output. Electrically tied to the exposed thermal tab on DPAK, which also serves as the primary heat-transfer path to the PCB copper pour. Also the package tab: exposed metal tab on the DPAK backside - same net as pin 2 (GND). Soldered to a copper pour that dissipates junction heat (R_thJC ≈ 8 °C/W, R_thJA ≈ 100 °C/W on standard footprint).", "is_pin1": false, "source": { "geometry": "TO-252-2.kicad_mod",
page.json+2−8@@ -15,7 +15,7 @@ "mpn": "L78M15ABDT-TR", "manufacturer": "STMicroelectronics", "package": "DPAK",- "pin_count": 4,+ "pin_count": 3, "category": "PMIC", "subcategory": "Voltage Regulators - Linear, Low Drop Out (LDO) Regulators", "datasheet": "https://www.st.com/resource/en/datasheet/l78m15abdt-tr.pdf",@@ -41,19 +41,13 @@ "number": "2", "name": "GND", "type": "power_in",- "description": "Common ground reference for input and output. Electrically tied to the exposed thermal tab on DPAK, which also serves as the primary heat-transfer path to the PCB copper pour."+ "description": "Common ground reference for input and output. Electrically tied to the exposed thermal tab on DPAK, which also serves as the primary heat-transfer path to the PCB copper pour. Also the package tab: exposed metal tab on the DPAK backside - same net as pin 2 (GND). Soldered to a copper pour that dissipates junction heat (R_thJC \u2248 8 \u00b0C/W, R_thJA \u2248 100 \u00b0C/W on standard footprint)." }, { "number": "3", "name": "OUTPUT", "type": "power_out", "description": "Regulated +15 V output (typ), guaranteed 14.55-15.45 V (2 %, AB grade). Delivers up to 500 mA with adequate heat-sinking; internally current-limited (~230 mA short-circuit, typ). Bypass to GND with 0.1 \u00b5F ceramic."- },- {- "number": "TAB",- "name": "GND",- "type": "power_in",- "description": "Exposed metal tab on the DPAK backside - same net as pin 2 (GND). Soldered to a copper pour that dissipates junction heat (R_thJC \u2248 8 \u00b0C/W, R_thJA \u2248 100 \u00b0C/W on standard footprint)." } ], "provenance": {