← Commit history

orderable attributes: rebuild .lbr with adom-lbr 2.18.0 so MPN, MANUFACTURER and the distributor part numbers reach <technology> (DIGIKEY_PN 497-7772-2-ND, LCSC_PN C880081). The published library carried no attributes at all, so a BOM had nothing to buy from. Distributor PNs matched on exact MPN AND corroborating manufacturer.

Ray ·849d7005e1 · ·parent a6019d1
2 files changed +28−6
l78m15abdt-tr.lbr+21−2
@@ -57,6 +57,18 @@   <smd name="1" x="-5.0400" y="2.2800" dx="2.2000" dy="1.2000" layer="1"/>   <smd name="2" x="1.2600" y="-0.0000" dx="6.4000" dy="5.8000" layer="1"/>   <smd name="3" x="-5.0400" y="-2.2800" dx="2.2000" dy="1.2000" layer="1"/>+  <polygon width="0.1200" layer="21">+    <vertex x="-5.0400" y="3.1400"/>+    <vertex x="-5.3800" y="3.6100"/>+    <vertex x="-4.7000" y="3.6100"/>+  </polygon>+  <polygon width="0.1000" layer="51">+    <vertex x="3.1100" y="3.2500"/>+    <vertex x="3.1100" y="-3.2500"/>+    <vertex x="-3.1100" y="-3.2500"/>+    <vertex x="-3.1100" y="2.2500"/>+    <vertex x="-2.1100" y="3.2500"/>+  </polygon>   <wire x1="-3.3100" y1="3.4500" x2="-3.3100" y2="3.1800" width="0.1200" layer="21"/>   <wire x1="-3.3100" y1="-3.4500" x2="-3.3100" y2="-3.1800" width="0.1200" layer="21"/>   <wire x1="3.1100" y1="3.4500" x2="-3.3100" y2="3.4500" width="0.1200" layer="21"/>@@ -72,7 +84,7 @@   <wire x1="4.1100" y1="-2.7000" x2="3.1100" y2="-2.7000" width="0.1000" layer="51"/>   <text x="0" y="4.050" size="1.27" layer="25" align="bottom-center">&gt;NAME</text>   <text x="0" y="-4.050" size="1.27" layer="27" align="top-center">&gt;VALUE</text>-<!--adom-pin1--><polygon width="0.0500" layer="21"><vertex x="-5.0400" y="3.1400"/><vertex x="-5.3800" y="3.6100"/><vertex x="-4.7000" y="3.6100"/></polygon></package>+</package> </packages> <symbols> <symbol name="L78M15ABDT-TR">@@ -100,7 +112,14 @@         <connect gate="G$1" pin="GND" pad="2"/>         <connect gate="G$1" pin="OUTPUT" pad="3"/>       </connects>-      <technologies><technology name=""/></technologies>+      <technologies>+        <technology name="">+          <attribute name="MPN" value="L78M15ABDT-TR" constant="no"/>+          <attribute name="MANUFACTURER" value="STMicroelectronics" constant="no"/>+          <attribute name="DIGIKEY_PN" value="497-7772-2-ND" constant="no"/>+          <attribute name="LCSC_PN" value="C880081" constant="no"/>+        </technology>+      </technologies>     </device>   </devices> </deviceset>
page.json+7−4
@@ -26,13 +26,16 @@       "model_3d_step": "l78m15abdt-tr.step",       "lbr": "l78m15abdt-tr.lbr"     },-    "distributor_links": {},+    "distributor_links": {+      "digikey": "497-7772-2-ND",+      "lcsc": "C880081"+    },     "pins": [       {         "number": "1",         "name": "INPUT",         "type": "power_in",-        "description": "Unregulated DC input voltage (V_I). Absolute maximum 35 V for 5-18 V output variants. Should be bypassed to GND with a 0.33 µF ceramic if the device is more than a few centimetres from the reservoir cap."+        "description": "Unregulated DC input voltage (V_I). Absolute maximum 35 V for 5-18 V output variants. Should be bypassed to GND with a 0.33 \u00b5F ceramic if the device is more than a few centimetres from the reservoir cap."       },       {         "number": "2",@@ -44,13 +47,13 @@         "number": "3",         "name": "OUTPUT",         "type": "power_out",-        "description": "Regulated +15 V output (typ), guaranteed 14.55-15.45 V (2 %, AB grade). Delivers up to 500 mA with adequate heat-sinking; internally current-limited (~230 mA short-circuit, typ). Bypass to GND with 0.1 µF ceramic."+        "description": "Regulated +15 V output (typ), guaranteed 14.55-15.45 V (2 %, AB grade). Delivers up to 500 mA with adequate heat-sinking; internally current-limited (~230 mA short-circuit, typ). Bypass to GND with 0.1 \u00b5F ceramic."       },       {         "number": "TAB",         "name": "GND",         "type": "power_in",-        "description": "Exposed metal tab on the DPAK backside - same net as pin 2 (GND). Soldered to a copper pour that dissipates junction heat (R_thJC ≈ 8 °C/W, R_thJA ≈ 100 °C/W on standard footprint)."+        "description": "Exposed metal tab on the DPAK backside - same net as pin 2 (GND). Soldered to a copper pour that dissipates junction heat (R_thJC \u2248 8 \u00b0C/W, R_thJA \u2248 100 \u00b0C/W on standard footprint)."       }     ],     "provenance": {