component
L78M05CDT-TR
Public Made by Adomby adom
STMicroelectronics Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, TO-252-2(DPAK). Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
← Commit history
page.json: fold the "TAB" entry into pin 2. On TO-252-2 the tab is not a separate pad - it is that lead - so nothing was ever unconnected, but the page listed it as its own pin and pads.json reported pin-not-in-symbol for a pin that cannot exist. Target chosen because net GROUND matches pin 2; the tab's description is merged into that pin rather than dropped.
2 files changed
+4−17
pads.json+2−9@@ -24,14 +24,7 @@ "3" ], "paste_apertures": 4,- "issues": [- {- "kind": "pin-not-in-symbol",- "pin": "TAB",- "name": "GROUND",- "detail": "page.json describes pin \"TAB\" (GROUND) from the datasheet, but the symbol has no such pin, so nothing can connect to it"- }- ],+ "issues": [], "pads": [ { "pad": "1",@@ -84,7 +77,7 @@ "pin": "2", "name": "GROUND", "type": "power_in",- "description": "Common ground reference. Internally connected to the exposed thermal tab of the DPAK package; both must be tied to the system ground plane for return current and heatsinking.",+ "description": "Common ground reference. Internally connected to the exposed thermal tab of the DPAK package; both must be tied to the system ground plane for return current and heatsinking. Also the package tab: exposed thermal pad on the back of the DPAK, electrically tied to the GROUND pin (pin 2). Must be soldered to a copper pour to remove heat (RthJC = 8 degC/W).", "is_pin1": false, "source": { "geometry": "TO-252-2.kicad_mod",
page.json+2−8@@ -15,7 +15,7 @@ "mpn": "L78M05CDT-TR", "manufacturer": "STMicroelectronics", "package": "TO-252-2(DPAK)",- "pin_count": 4,+ "pin_count": 3, "category": "PMIC", "subcategory": "Voltage Regulators - Linear, Low Drop Out (LDO) Regulators", "datasheet": "https://www.st.com/resource/en/datasheet/l78m05cdt-tr.pdf",@@ -41,19 +41,13 @@ "number": "2", "name": "GROUND", "type": "power_in",- "description": "Common ground reference. Internally connected to the exposed thermal tab of the DPAK package; both must be tied to the system ground plane for return current and heatsinking."+ "description": "Common ground reference. Internally connected to the exposed thermal tab of the DPAK package; both must be tied to the system ground plane for return current and heatsinking. Also the package tab: exposed thermal pad on the back of the DPAK, electrically tied to the GROUND pin (pin 2). Must be soldered to a copper pour to remove heat (RthJC = 8 degC/W)." }, { "number": "3", "name": "OUTPUT", "type": "power_out", "description": "Regulated +5 V output, 500 mA rated (higher with adequate heatsinking). Requires a 0.1 uF ceramic to GND close to the pin for transient response and stability."- },- {- "number": "TAB",- "name": "GROUND",- "type": "power_in",- "description": "Exposed thermal pad on the back of the DPAK, electrically tied to the GROUND pin (pin 2). Must be soldered to a copper pour to remove heat (RthJC = 8 degC/W)." } ], "provenance": {