component
L78M05ACDT-TR
Public Made by Adomby adom
STMicroelectronics Voltage Regulators - Linear, Low Drop Out (LDO) Regulators, TO-252-2(DPAK). Pinout extracted from the datasheet, KiCad symbol/footprint/3D.
← Commit history
page.json: fold the "TAB" entry into pin 2. On TO-252-2 the tab is not a separate pad - it is that lead - so nothing was ever unconnected, but the page listed it as its own pin and pads.json reported pin-not-in-symbol for a pin that cannot exist. Target chosen because net GND matches pin 2; the tab's description is merged into that pin rather than dropped.
2 files changed
+4−17
pads.json+2−9@@ -24,14 +24,7 @@ "3" ], "paste_apertures": 4,- "issues": [- {- "kind": "pin-not-in-symbol",- "pin": "TAB",- "name": "GND",- "detail": "page.json describes pin \"TAB\" (GND) from the datasheet, but the symbol has no such pin, so nothing can connect to it"- }- ],+ "issues": [], "pads": [ { "pad": "1",@@ -84,7 +77,7 @@ "pin": "2", "name": "GND", "type": "power_in",- "description": "Ground / common reference for input and output. On the DPAK package the GND pin is electrically and thermally common with the exposed metal tab, which serves as the primary heat-sinking surface (RthJC = 8 °C/W, RthJA = 100 °C/W).",+ "description": "Ground / common reference for input and output. On the DPAK package the GND pin is electrically and thermally common with the exposed metal tab, which serves as the primary heat-sinking surface (RthJC = 8 °C/W, RthJA = 100 °C/W). Also the package tab: exposed DPAK metal tab, internally connected to pin 2 (GND). Provides the primary thermal path to the PCB copper pour for heat dissipation.", "is_pin1": false, "source": { "geometry": "TO-252-2.kicad_mod",
page.json+2−8@@ -15,7 +15,7 @@ "mpn": "L78M05ACDT-TR", "manufacturer": "STMicroelectronics", "package": "TO-252-2(DPAK)",- "pin_count": 4,+ "pin_count": 3, "category": "PMIC", "subcategory": "Voltage Regulators - Linear, Low Drop Out (LDO) Regulators", "datasheet": "https://www.st.com/resource/en/datasheet/l78m05acdt-tr.pdf",@@ -42,19 +42,13 @@ "number": "2", "name": "GND", "type": "power_in",- "description": "Ground / common reference for input and output. On the DPAK package the GND pin is electrically and thermally common with the exposed metal tab, which serves as the primary heat-sinking surface (RthJC = 8 \u00b0C/W, RthJA = 100 \u00b0C/W)."+ "description": "Ground / common reference for input and output. On the DPAK package the GND pin is electrically and thermally common with the exposed metal tab, which serves as the primary heat-sinking surface (RthJC = 8 \u00b0C/W, RthJA = 100 \u00b0C/W). Also the package tab: exposed DPAK metal tab, internally connected to pin 2 (GND). Provides the primary thermal path to the PCB copper pour for heat dissipation." }, { "number": "3", "name": "OUTPUT", "type": "power_out", "description": "Regulated +5 V output, 4.8 V to 5.2 V over line/load/temperature. Delivers up to 500 mA (guaranteed 350 mA test condition) with internal short-circuit current limit (~300 mA typ, 700 mA peak). A 0.1 \u00b5F ceramic capacitor to GND improves transient response."- },- {- "number": "TAB",- "name": "GND",- "type": "power_in",- "description": "Exposed DPAK metal tab, internally connected to pin 2 (GND). Provides the primary thermal path to the PCB copper pour for heat dissipation." } ], "provenance": {