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README

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L6984ATR

STMicroelectronics · DC-DC Converters · DFN-10-EP(3x3)

L6984ATR from STMicroelectronics, in a DFN-10-EP(3x3). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 PGOOD output Open collector output driven low when the FB voltage is below the VPGD L threshold, with PGOOD low impedance when FB falls to 88 % of VREF (typical).
2 FB input Inverting input of the error amplifier, with an absolute maximum range of -0.3 V to VCC + 0.3 V.
3 TON input A resistor connected between this pin and VIN sets the switching frequency, adjustable from 250 kHz to 600 kHz.
4 EN input Enable pin where a logic active high signal enables the device; connect to VIN if not used, with thresholds of 1.1 V (inhibited) and 2.6 V (enabled).
5 GND power_in Power ground of the regulator.
6 LX output Switching node, with an absolute maximum range of -0.3 V to VIN + 0.3 V.
7 VIN power_in DC input voltage, operating from 4.5 V to 36 V with an absolute maximum of 40 V.
8 VCC power_out Embedded regulator output supplying the main switching controller, requiring an external 1 µF capacitor and regulating 3.3 V when VBIAS is below 2.4 V.
9 VBIAS power_in Typically connected to the regulated output voltage; an external voltage reference can supply the analog circuitry to increase light load efficiency, and it must be connected to GND if not used.
10 LNM input Connect to VCC for low noise mode (LNM) operation or to GND for low consumption mode (LCM) operation.
11 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package DFN-10-EP(3x3)
Category Power Management ICs
Pins 11

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Operating input voltage range VIN 4.5 36 V TJ = 25 °C, VIN = VEN = 12 V, VBIAS = 3.3 V 7
UVLO rising edge VIN_UVLO 3.1 3.8 4.5 V rising edge VCC regulator, VBIAS = GND 7
UVLO falling edge VIN_UVLO 2.9 3.6 4.3 V falling edge VCC regulator, VBIAS = GND 7
Fixed output voltage valley regulation VOUT 3.23 3.3 3.37 V FB = VCC, no load 7
Adjustable output voltage valley regulation VFB 0.88 0.9 0.92 V No load, VBIAS = 3.3 V 7
High-side RDSON RDSON HS 0.9 1.3 1.7 Ω ISW = 0.1 A 7
Low-side RDSON RDSON LS 0.6 1 1.4 Ω ISW = 0.1 A 7
Minimum Low-side conduction time TOFF 100 300 400 ns VIN = VEN = 4.5 V 7
Valley current limit IVY 350 400 470 mA 7
Zero crossing current threshold IZCD 12 27 46 mA 7
VCC voltage VCC 3 3.8 4.6 V VFB = 1 V, VBIAS = GND 7
VBIAS falling threshold VBIAS 2.4 2.6 2.8 V 7
VBIAS rising threshold VBIAS 2.6 2.9 3.2 V 7
Shutdown current from VIN ISHTDWN 3 13 22 µA EN = GND 7
Quiescent current from VIN, LCM - SWO IQ OPVIN 11 26 41 µA VREF < VFB < VOVP (SLEEP), VBIAS = 3.3 V 8
Quiescent current from VIN, LCM - NO SWO IQ OPVIN 90 160 230 µA VREF < VFB < VOVP (SLEEP), VBIAS = GND 8
Quiescent current from VIN, LNM - SWO IQ OPVIN 11 26 42 µA VREF < VFB < VOVP, VBIAS = 3.3 V 8
Quiescent current from VIN, LNM - NO SWO IQ OPVIN 200 320 440 µA VREF < VFB < VOVP, VBIAS = GND 8
Quiescent current from VBIAS, LCM - SWO IQ OPVBIAS 80 150 200 µA VREF < VFB < VOVP (SLEEP), VBIAS = 3.3 V 8
Quiescent current from VBIAS, LNM - SWO IQ OPVBIAS 180 300 390 µA VREF < VFB < VOVP, VBIAS = 3.3 V 8
Overvoltage trip (VOVP/VREF) VOVP 18 23 28 % Rising edge 8
Power Good LOW threshold, VFB falling edge VPGD L 84 88 92 % VFB falling edge (PGOOD low impedance) 8
Power Good HIGH threshold, internal FB rising edge VPGD H 118 123 128 % Internal FB rising edge (PGOOD low impedance), VFB = VCC 8
PGOOD output low, 4 mA sink VPGOOD 0.6 V VIN > VIN_UVLO_H, VFB=GND, 4 mA sinking load 8
PGOOD output low, 100 µA sink VPGOOD 0.6 V 2.9 < VIN < VIN_UVLO_H, 100 µA sinking load 8
EN threshold, device inhibited EN 1.1 V Device inhibited 8
EN threshold, device enabled EN 2.6 V Device enabled 8
EN hysteresis 650 mV Not tested in production 8
Power Good LOW threshold, VFB rising edge VPGD L 90 % VFB rising edge (PGOOD high impedance) 8
Power Good HIGH threshold, internal FB falling edge VPGD H 100 % Internal FB falling edge (PGOOD high impedance), VFB = VCC 8
Thermal shutdown temperature TSHDWN 150 °C Not tested in production 9
Thermal shutdown hysteresis THYS 20 °C Not tested in production 9
Input slew rate dVIN/dt 0.1 V/µs 5
VIN, EN, TON, VBIAS, PGOOD, LNM voltage VIN -0.3 40 V VIN pin (group with EN, TON, VBIAS, PGOOD, LNM per table layout) 5
LX voltage LX -0.3 V max VIN + 0.3 5
VCC voltage VCC -0.3 6 V 5
FB voltage FB -0.3 V max VCC + 0.3 5
Operating temperature range TJ -40 150 °C 5
Storage temperature range TSTG -55 150 °C 5
Lead temperature TLEAD 260 °C soldering 10 sec. 5
High-side RMS switch current IHS 420 mA 5
Low-side RMS switch current ILS 500 mA 5
Thermal resistance junction ambient RthJA 50 °C/W device soldered on the STMicroelectronics evaluation board 5
ESD HBM ESD 2 kV HBM 6
ESD MM ESD 200 V MM 6
ESD CDM ESD 500 V CDM 6

CAD (KiCad official)

  • Symbol: L6984ATR
  • Footprint: Package_DFN_QFN:DFN-10-1EP_3x3mm_P0.5mm_EP1.55x2.48mm
  • 3D model: DFN-10-EP(3x3) (KiCad packages3D, STEP)
  • 3D model files: l6984atr-etched.step / l6984atr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); l6984atr.step / l6984atr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (47 pp, sha256 9a7f76997b209e2b, retrieved 2026-10-31, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF