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Contents

README

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L6205N

STMicroelectronics · Motor Driver ICs · PDIP-20

L6205N from STMicroelectronics, in a PDIP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 IN1A input Bridge A logic input 1, TTL/CMOS compatible (turn-on threshold 1.8V typ, turn-off 1.3V typ).
2 IN2A input Bridge A logic input 2, TTL/CMOS compatible (turn-on threshold 1.8V typ, turn-off 1.3V typ).
3 SENSEA passive Bridge A source pin, which must be connected to power ground directly or through a sensing power resistor (voltage range -1 to +4V absolute max).
4 OUT1A output Bridge A output 1, with 2.8A RMS output current capability.
5 GND power_in Signal ground terminal, also used for heat dissipation toward the PCB in the PowerDIP package.
6 GND power_in Signal ground terminal, also used for heat dissipation toward the PCB in the PowerDIP package.
7 OUT1B output Bridge B output 1, with 2.8A RMS output current capability.
8 SENSEB passive Bridge B source pin, which must be connected to power ground directly or through a sensing power resistor (voltage range -1 to +4V absolute max).
9 IN1B input Bridge B logic input 1, TTL/CMOS compatible (turn-on threshold 1.8V typ, turn-off 1.3V typ).
10 IN2B input Bridge B logic input 2, TTL/CMOS compatible (turn-on threshold 1.8V typ, turn-off 1.3V typ).
11 ENB bidirectional Bridge B enable: LOW switches OFF all Bridge B power MOSFETs; also the overcurrent/thermal protection open-drain output, so drive through a series resistor of 2.2kΩ-180kΩ (100kΩ recommended), or tie to +5V through a resistor if unused.
12 VBOOT passive Bootstrap voltage needed to drive the upper PowerMOSFETs of both Bridge A and Bridge B (max VS + 10V).
13 OUT2B output Bridge B output 2, with 2.8A RMS output current capability.
14 VSB power_in Bridge B power supply voltage (8 to 52V operating), which must be connected to the supply voltage together with pin VSA.
15 GND power_in Signal ground terminal, also used for heat dissipation toward the PCB in the PowerDIP package.
16 GND power_in Signal ground terminal, also used for heat dissipation toward the PCB in the PowerDIP package.
17 VSA power_in Bridge A power supply voltage (8 to 52V operating), which must be connected to the supply voltage together with pin VSB.
18 OUT2A output Bridge A output 2, with 2.8A RMS output current capability.
19 VCP output Charge pump oscillator output, a 600kHz (typ) square wave with 10V amplitude.
20 ENA bidirectional Bridge A enable: LOW switches OFF all Bridge A power MOSFETs; also the overcurrent/thermal protection open-drain output, so drive through a series resistor of 2.2kΩ-180kΩ (100kΩ recommended), or tie to +5V through a resistor if unused.

Key specifications

Parameter Value
Manufacturer STMicroelectronics
Package PDIP-20
Category Power Management ICs
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Turn-on Threshold VSth(ON) 6.6 7 7.4 V Tamb = 25 °C, Vs = 48V 5
Turn-off Threshold VSth(OFF) 5.6 6 6.4 V Tamb = 25 °C, Vs = 48V 5
Quiescent Supply Current IS 5 10 mA All Bridges OFF; Tj = -25°C to 125°C 5
High-Side Switch ON Resistance RDS(ON) 0.34 0.4 Ω Tj = 25 °C 5
High-Side Switch ON Resistance RDS(ON) 0.53 0.59 Ω Tj = 125 °C 5
Low-Side Switch ON Resistance RDS(ON) 0.28 0.34 Ω Tj = 25 °C 5
Low-Side Switch ON Resistance RDS(ON) 0.47 0.53 Ω Tj = 125 °C 5
Leakage Current IDSS 2 mA EN = Low; OUT = VS 5
Leakage Current IDSS -0.15 mA EN = Low; OUT = GND 5
Source Drain Diode Forward ON Voltage VSD 1.15 1.3 V ISD = 2.8A, EN = LOW 5
Low level logic input voltage VIL -0.3 0.8 V 5
High level logic input voltage VIH 2 7 V 5
Low Level Logic Input Current IIL -10 µA GND Logic Input Voltage 5
High Level Logic Input Current IIH 10 µA 7V Logic Input Voltage 5
Turn-on Input Threshold Vth(ON) 1.8 2 V 5
Turn-off Input Threshold Vth(OFF) 0.8 1.3 V 5
Input Threshold Hysteresis Vth(HYS) 0.25 0.5 V 5
Enable to out turn ON delay time tD(on)EN 100 250 400 ns ILOAD =2.8A, Resistive Load 5
Input to out turn ON delay time tD(on)IN 1.6 µs ILOAD =2.8A, Resistive Load (dead time included) 5
Output rise time tRISE 40 250 ns ILOAD =2.8A, Resistive Load 5
Enable to out turn OFF delay time tD(off)EN 300 550 800 ns ILOAD =2.8A, Resistive Load 5
Input to out turn OFF delay time tD(off)IN 600 ns ILOAD =2.8A, Resistive Load 6
Output Fall Time tFALL 40 250 ns ILOAD =2.8A, Resistive Load 6
Dead Time Protection tdt 0.5 1 µs 6
Charge pump frequency fCP 0.6 1 MHz -25°C<Tj <125°C 6
Input Supply Overcurrent Protection Threshold ISOVER 4 5.6 7.1 A Tj = -25°C to 125°C 6
Open Drain ON Resistance ROPDR 40 60 Ω I = 4mA 6
Thermal Shutdown Temperature Tj(OFF) 165 °C 5
Reverse Recovery Time trr 300 ns If = 2.8A 5
Forward Recovery Time tfr 200 ns 5
OCD Turn-on Delay Time tOCD(ON) 200 ns I = 4mA; CEN < 100pF 6
OCD Turn-off Delay Time tOCD(OFF) 100 ns I = 4mA; CEN < 100pF 6
Supply Voltage (abs max) VS 60 V VSA = VSB = VS 2
Differential Voltage between VSA.. and VSB.. VOD 60 V VSA = VSB = VS = 60V; VSENSEA = VSENSEB = GND 2
Bootstrap Peak Voltage VBOOT 10 V VSA = VSB = VS; printed as VS + 10 V 2
Input and Enable Voltage Range VIN,VEN -0.3 7 V 2
Voltage Range at pins SENSEA and SENSEB VSENSE -1 4 V 2
Pulsed Supply Current (each VS pin) IS(peak) 7.1 A VSA = VSB = VS; tPULSE < 1ms 2
RMS Supply Current (each VS pin) IS RMS 2.8 A VSA = VSB = VS 2
Storage and Operating Temperature Range Tstg, TOP -40 150 °C 2
Supply Voltage (recommended) VS 8 52 V VSA = VSB = VS 2
Differential Voltage (recommended) VOD 52 V VSA = VSB = VS; VSENSEA = VSENSEB 2
Sense Voltage Range (pulsed tW < trr) VSENSEA, VSENSEB -6 6 V pulsed tW < trr 2
Sense Voltage Range (DC) VSENSEA, VSENSEB -1 1 V DC 2
RMS Output Current IOUT 2.8 A 2
Operating Junction Temperature Tj -25 125 °C 2
Switching Frequency fsw 100 KHz 2
Thermal Resistance Junction-Pins Rth-j-pins 12 °C/W PowerDIP20 3
Thermal Resistance Junction-Ambient 1 Rth-j-amb1 40 °C/W PowerDIP20; multi-layer FR4 PCB, 6cm2 copper on bottom side (35µm) 3
Thermal Resistance Junction-Ambient 4 Rth-j-amb2 56 °C/W PowerDIP20; multi-layer FR4 PCB without any heat sinking surface 3

CAD (KiCad official)

  • Symbol: L6205N
  • Footprint: Package_DIP:DIP-20_W7.62mm
  • 3D model: PDIP-20 (KiCad packages3D, STEP)
  • 3D model files: l6205n-etched.step / l6205n-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); l6205n.step / l6205n.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: STMicroelectronics datasheet (21 pp, sha256 7c56e39dd8d3a140, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF