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Ray Publish 0.1.0 9c41858 24d ago

L2N7002KLT1G-MS

MSKSEMI · MOSFETs · SOT-23

L2N7002KLT1G-MS from MSKSEMI, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; controls the channel, rated VGS ±20 V max, threshold 1 to 2.5 V, with embedded G-S ESD protection diode (ESD protected up to 2KV).
2 S passive Source; connects to the body diode anode and the G-S protection diode, continuous drain/source current 0.3 A.
3 D passive Drain; rated VDS 60 V, continuous drain current 0.3 A (0.8 A pulsed), RDS(ON) 2.2 Ω at VGS=10 V.

Key specifications

Parameter Value
Manufacturer MSKSEMI
Package SOT-23
Category Transistors/Thyristors
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage BVDSS 60 V VGS=0V , ID=250uA 3
Gate Threshold Voltage VGS(th) 1 1.6 2.5 V VGS=VDS , ID =250uA 3
Static Drain-Source On-Resistance RDS(ON) 2.2 2.8 Ω VGS=10V , ID=0.3A 3
Drain-Source Leakage Current IDSS 1 uA VDS=60V , VGS=0V , TJ=25℃ 3
Drain-Source Leakage Current IDSS 10 uA VDS=48V , VGS=0V , TJ=125℃ 3
Gate-Source Leakage Current IGSS -10 10 uA VGS= ±20V , VDS=0V 3
Diode Forward Voltage VSD 1 V VGS=0V , IS=1A , TJ=25℃ 3
Continuous Source Current IS 0.3 A VG=VD=0V , Force Current 3
Pulsed Source Current ISM 1.2 A 3
Total Gate Charge Qg 3.7 5.6 nC VDS=30V , VGS=10V , ID=1A 3
Gate-Source Charge Qgs 0.9 1.4 nC VDS=30V , VGS=10V , ID=1A 3
Gate-Drain Charge Qgd 0.4 0.6 nC VDS=30V , VGS=10V , ID=1A 3
Turn-On Delay Time Td(on) 3 6 ns VDD=30V ,VGS=10V , RG=6Ω, ID=0.2A 3
Rise Time Tr 5 10 ns VDD=30V ,VGS=10V , RG=6Ω, ID=0.2A 3
Turn-Off Delay Time Td(off) 14 27 ns VDD=30V ,VGS=10V , RG=6Ω, ID=0.2A 3
Fall Time Tf 9 17 ns VDD=30V ,VGS=10V , RG=6Ω, ID=0.2A 3
Input Capacitance Ciss 25.5 38 pF VDS=30V , VGS=0V , F=1MHz 3
Output Capacitance Coss 17 26 pF VDS=30V , VGS=0V , F=1MHz 3
Reverse Transfer Capacitance Crss 7.8 12 pF VDS=30V , VGS=0V , F=1MHz 3
Reverse Recovery Time trr 3.4 ns VGS=50V, IS=1A , dI/dt=100A/µs TJ=25℃ 3
Reverse Recovery Charge Qrr 0.7 nC VGS=50V, IS=1A , dI/dt=100A/µs TJ=25℃ 3
Forward Transconductance gfs 0.5 S VDS=10V , ID=0.3A 3
Drain-Source Voltage VDS 60 V 2
Gate-Source Voltage VGS -20 20 V 2
Drain Current, Continuous ID 0.3 A TC=25℃ 2
Drain Current, Continuous ID 0.1 A TC=100℃ 2
Drain Current, Pulsed IDM 0.8 A Pulsed (footnote 1: pulse width limited by max junction temperature) 2
Power Dissipation PD 0.35 W TC=25℃ 2
Power Dissipation, Derate above 25 ℃ 0.003 W/℃ derate above 25 ℃ 2
Storage Temperature Range TSTG -50 150 ℃ 2
Operating Junction Temperature Range TJ -50 150 ℃ 2
Thermal Resistance Junction to ambient RθJA 357 ℃/W 3

CAD (KiCad official)

  • Symbol: L2N7002KLT1G-MS
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: l2n7002klt1g-ms-etched.step / l2n7002klt1g-ms-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); l2n7002klt1g-ms.step / l2n7002klt1g-ms.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: MSKSEMI datasheet (7 pp, sha256 d6138db09f232395, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF