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L297DM

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HGSEMI Stepper Motor Driver, SOP-20-300mil. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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L297DM

HGSEMI · Stepper Motor Driver · SOP-20-300mil

L297DM from HGSEMI, in a SOP-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 SYNC bidirectional Output of the on-chip chopper oscillator; SYNC pins of synchronized L297s are tied together with the oscillator components on only one device, and an external clock may be injected here (VSYNC high 3.3 V min and low 0.8 V max at Io = 5 mA).
2 GND power_in Ground connection.
3 HOME output Open-collector output that indicates the initial translator state (ABCD = 0101) when active, with leakage of 1 µA max at VCE = 7 V and saturation voltage of 0.4 V max at 5 mA.
4 A output Motor phase A drive signal for the power stage, with output low 0.4 V max at 10 mA and output high 3.9 V min at 5 mA.
5 INH1 output Active-low inhibit output for the driver stages of phases A and B, used for fast load-current decay in a bipolar bridge and by the chopper to regulate current when CONTROL is low; inhibit output low 0.4 V max at 10 mA and high 3.9 V min at 5 mA.
6 B output Motor phase B drive signal for the power stage, with output low 0.4 V max at 10 mA and output high 3.9 V min at 5 mA.
7 C output Motor phase C drive signal for the power stage, with output low 0.4 V max at 10 mA and output high 3.9 V min at 5 mA.
8 INH2 output Active-low inhibit output for the driver stages of phases C and D, with the same function as INH1; inhibit output low 0.4 V max at 10 mA and high 3.9 V min at 5 mA.
9 D output Motor phase D drive signal for the power stage, with output low 0.4 V max at 10 mA and output high 3.9 V min at 5 mA.
10 ENABLE input Chip enable input; when low (inactive) INH1, INH2, A, B, C and D are forced low, with input low max 1.3 V and high min 2 V.
11 CONTROL input Control input defining the chopper action: when low the chopper acts on INH1 and INH2, when high it acts on phase lines ABCD; input low max 0.6 V and high min 2 V.
12 Vs power_in 5 V supply input, specified at 4.75 V min to 7 V max with a quiescent supply current of 50 mA typ and 80 mA max (outputs floating); absolute maximum 10 V.
13 SENS2 input Load current sense voltage input from the power stages of phases C and D, with comparator offset of 5 mV max at Vref = 1 V and bias current of -100 to 10 µA.
14 SENS1 input Load current sense voltage input from the power stages of phases A and B, with comparator offset of 5 mV max at Vref = 1 V and bias current of -100 to 10 µA.
15 Vref power_in Reference voltage for the chopper circuit that sets the peak load current, specified over 0 V to 3 V.
16 OSC passive Connection for an RC network (R to VCC, C to ground) that sets the chopper rate with f ≅ 1/0.69RC; grounded on all devices except the one carrying the oscillator in synchronized multi-L297 configurations.
17 CW/CCW input Clockwise/counterclockwise direction control input, internally synchronized so direction can be changed at any time; input low max 0.6 V and high min 2 V.
18 CLOCK input Step clock input that advances the motor one increment on the rising edge of an active-low pulse, with minimum clock time tCLK of 0.5 µs; input low max 0.6 V and high min 2 V.
19 HALF/FULL input Half/full step select input: high selects half-step operation and low selects full-step operation; input low max 0.6 V and high min 2 V.
20 RESET input Active-low reset input that restores the translator to the home position (state 1, ABCD = 0101); reset time tR of 1 µs min and reset-to-clock delay of 1 µs min apply.

Key specifications

Parameter Value
Manufacturer HGSEMI
Package SOP-20-300mil
Category Motor Driver ICs
Pins 20

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage (pin 12) Vs 4.75 7 V 6
Quiescent supply current (pin 12) Is 50 80 mA Outputs floating 6
Input voltage low (pins 11, 17, 18, 19, 20) Vi 0.6 V Low 6
Input voltage high (pins 11, 17, 18, 19, 20) Vi 2 V High 6
Input current (pins 11, 17, 18, 19, 20) Ii 100 µA Vi = L 6
Input current (pins 11, 17, 18, 19, 20) Ii 10 µA Vi = H 6
Enable input voltage low (pin 10) Ven 1.3 V Low 6
Enable input voltage high (pin 10) Ven 2 V High 6
Enable input current (pin 10) Ien 100 µA Ven = L 6
Enable input current (pin 10) Ien 10 µA Ven = H 6
Phase output voltage low (pins 4, 6, 7, 9) VOL 0.4 V Io = 10mA 6
Phase output voltage high (pins 4, 6, 7, 9) VOH 3.9 V Io = 5mA 6
Inhibit output voltage low (pins 5, 8) Vinh L 0.4 V Io = 10mA 6
Inhibit output voltage high (pins 5, 8) Vinh H 3.9 V Io = 5mA 6
Sync output voltage high (pin 1) VSYNC H 3.3 V Io = 5mA 6
Sync output voltage low (pin 1) VSYNC L 0.8 V Io = 5mA 6
Leakage current (pin 3) Ileak 1 µA VCE = 7V 7
Saturation voltage (pin 3) Vsat 0.4 V I = 5 mA 7
Comparators offset voltage (pins 13, 14, 15) Voff 5 mV Vref = 1 V 7
Comparator bias current (pins 13, 14, 15) Io -100 10 µA 7
Input reference voltage (pin 15) Vref 0 3 V 7
Clock time tCLK 0.5 µs 7
Set up time tS 1 µs 7
Hold time tH 4 µs 7
Reset time tR 1 µs 7
Reset to clock delay tRCLK 1 µs 7
Supply voltage (pin 12) Vs 10 V 1
Input signals Vi 7 V 1
Total power dissipation Ptot 1 W Tamb = 70°C 1
Storage and junction temperature Tstg, Tj -40 150 °C 1
Thermal resistance junction-ambient (SO20) Rth-j-amb 100 °C/W 4

CAD (KiCad official)

  • Symbol: L297DM
  • Footprint: Package_SO:SOP-20_7.5x12.8mm_P1.27mm
  • 3D model: SOP-20-300mil, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 2.65 mm nominal SOIC height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: l297dm-etched.step / l297dm-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); l297dm.step / l297dm.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HGSEMI datasheet (8 pp, sha256 bbdff7f0738894f2, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF