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KY485LEEN

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Keysemi RS-485/RS-422 ICs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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KY485LEEN

Keysemi · RS-485/RS-422 ICs · SOIC-8

KY485LEEN from Keysemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 RO output Receiver output: RO goes high when A−B ≥ −50mV and low when A−B ≤ −200mV, while RE is low.
2 RE input Receiver output enable: driving RE low enables RO and RE high makes RO high-impedance; RE high with DE low enters low-power shutdown, and RE is a hot-swap input.
3 DE input Driver output enable: driving DE high enables the driver outputs, which are high-impedance when DE is low; DE low with RE high enters low-power shutdown, and DE is a hot-swap input.
4 DI input Driver input: with DE high, a low on DI forces the non-inverting output low and the inverting output high, and a high on DI forces the reverse.
5 GND power_in Ground reference for all device voltages.
6 A bidirectional Non-inverting receiver input and non-inverting driver output; voltages on A and B are limited to −8V to +13V referenced to GND.
7 B bidirectional Inverting receiver input and inverting driver output; voltages on A and B are limited to −8V to +13V referenced to GND.
8 VCC power_in Positive supply, VCC = +5V ±5%, with VCC bypassed to GND by a 0.1µF capacitor; absolute maximum supply is +6V.

Key specifications

Parameter Value
Manufacturer Keysemi
Package SOIC-8
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC -5 5 % VCC = +5V ±5% 2
Supply Voltage VCC 6 V All voltages referenced to GND 1
DE, RE-, DI voltage DE, RE-, DI -0.3 6 V All voltages referenced to GND 1
A, B voltage A, B -8 13 V All voltages referenced to GND 1
Operating temperature range -40 125 °C 1
Junction temperature 150 °C 1
Storage temperature range -65 150 °C 1
Lead temperature 300 °C soldering 10s 1
Differential Driver Output (RS-422) VOD2 2 V Figure1, R = 50Ω (RS-422) 2
Differential Driver Output (RS-485) VOD2 1.5 V Figure1, R = 27Ω (RS-485) 2
Change in Magnitude of Differential Output Voltage ∆VOD 0.2 V Figure1, R =50Ω or R= 27Ω 2
Driver Common-Mode Output Voltage VOC 3 V Figure1, R=50Ω or R = 27Ω 2
Change in Magnitude of Common-Mode Voltage ∆VOC 0.2 V Figure1, R=50Ω or R = 27Ω 2
Input High Voltage VIH1 2 V DE, DI, RE 2
Input Low Voltage VIL1 0.8 V DE, DI, RE 2
Input Current IIN1 -2 2 µA DE, DI, RE 2
Input Current (A and B) IIN4 125 µA DE = GND, VCC=GND or 5.25V, VIN=12V 2
Input Current (A and B) IIN4 -75 µA DE = GND, VCC=GND or 5.25V, VIN = -7V 2
Driver Short-Circuit Output Current VOD1 -250 mA -7V ≤ VOUT ≤ VCC 2
Driver Short-Circuit Output Current VOD1 250 mA 0V ≤ VOUT ≤ 12V 2
Driver Short-Circuit Output Current VOD1 -25 25 mA 0V ≤ VOUT ≤ VCC 2
Receiver Differential Threshold Voltage VTH -200 -125 -50 mV -7V ≤ VCM ≤ +12V 2
Receiver Output Low Voltage VOL 0.4 V IO = -4mA, VID = -50mV 2
Three-State Output Current at Receiver IOZR -1 1 µA 0.4V ≤ VO ≤ 2.4V 2
Supply Current ICC 530 900 µA No load, RE- =DI=GND or VCC, DE = VCC 2
Supply Current ICC 500 600 µA No load, RE- =DI=GND or VCC, DE = GND 2
Supply Current in Shutdown Mode ISHDN 2.5 10 µA DE = GND, VRE- = VCC 2
ESD Protection (A,B) Air Gap Discharge -16 16 KV IEC 61000-4-2 2
ESD Protection (A,B) Human Body Model -8 8 KV Human Body Model 2
ESD Protection (all other pins) Human Body Model -5 5 KV Human Body Model 2
Driver Input to Output (tDPLH) tDPLH 250 720 1000 ns Figures 3 and 5, RDIFF = 54Ω, CL1 = CL2 = 100pF 3
Driver Input to Output (tDPHL) tDPHL 250 720 1000 ns Figures 3 and 5, RDIFF = 54Ω, CL1 = CL2 = 100pF 3
Driver Output Skew / tDPLH - tDPHL / tDSKEW -100 -3 100 ns Figures 3 and 5, RDIFF = 54Ω, CL1 = CL2 = 100pF 3
Driver Rise or Fall Time tDR, tDF 200 530 750 ns Figures 3 and 5, RDIFF = 54Ω, CL1 = CL2 = 100pF 3
Driver Enable to Output High tDZH 2500 ns Figures 4 and 6, CL = 100pF, S2 closed 3
Driver Enable to Output Low tDZL 2500 ns Figures 4 and 6, CL = 100pF, S1 closed 3
Driver Disable Time from Low tDLZ 100 ns Figures 4 and 6, CL = 15pF, S1 closed 3
Driver Disable Time from High tDHZ 100 ns Figures 4 and 6, CL = 15pF, S2 closed 3
Differential Receiver Skew / tRPLH - tRPHL / tRSKD -30 3 30 ns Figures 7 and 9; / VID / ≥ 2.0V; rise and fall time of VID ≤ 15ns 3
Time to Shutdown tSHDN 50 200 600 ns (Note 4) 3
Driver Enable from Shutdown to Output High tDZH(SHDN) 4500 ns Figures 4 and 6, CL = 15pF, S2 closed 3
Driver Enable from Shutdown to Output Low tDZL(SHDN) 4500 ns Figures 4 and 6, CL = 15pF, S1 closed 3
Receiver Enable from Shutdown to Output High tRZH(SHDN) 3500 ns Figures 2 and 8, CL = 100pF, S2 closed 3
Receiver Enable from Shutdown to Output Low tRZL(SHDN) 3500 ns Figures 2 and 8, CL = 100pF, S1 closed 3

CAD (KiCad official)

  • Symbol: KY485LEEN
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ky485leen-etched.step / ky485leen-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ky485leen.step / ky485leen.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Keysemi datasheet (8 pp, sha256 6cfba6f713b932ba, retrieved 2026-10-29, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF