component
KSZ8873MLL
Public Made by Adomby adom
Microchip Tech Interface - Specialized, LQFP-64(10x10). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownKSZ8873MLL
Microchip Tech · Interface - Specialized · LQFP-64(10x10)
KSZ8873MLL from Microchip Tech, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RXM1 | bidirectional | Physical receive or transmit signal (negative differential) for port 1. |
| 2 | RXP1 | bidirectional | Physical receive or transmit signal (positive differential) for port 1. |
| 3 | AGND | power_in | Analog ground. |
| 4 | TXM1 | bidirectional | Physical transmit or receive signal (negative differential) for port 1. |
| 5 | TXP1 | bidirectional | Physical transmit or receive signal (positive differential) for port 1. |
| 6 | VDDA_3.3 | power_in | 3.3V analog VDD for the transceiver. |
| 7 | AGND | power_in | Analog ground. |
| 8 | ISET | output | Sets the physical transmit output current; pull down with an 11.8 kohm 1% resistor to ground. |
| 9 | VDDA_1.8 | power_in | 1.8V analog core power input from VDDCO (pin 56). |
| 10 | RXM2 | bidirectional | Physical receive or transmit signal (negative differential) for port 2. |
| 11 | RXP2 | bidirectional | Physical receive or transmit signal (positive differential) for port 2. |
| 12 | AGND | power_in | Analog ground. |
| 13 | TXM2 | bidirectional | Physical transmit or receive signal (negative differential) for port 2. |
| 14 | TXP2 | bidirectional | Physical transmit or receive signal (positive differential) for port 2. |
| 15 | FXSD2 | input | MLL/RLL: connect to analog ground by pull-down resistor; FLL: fiber signal detect / factory test pin. |
| 16 | PWRDN | input | Chip power-down input, active-low, with internal pull-up. |
| 17 | X1 | input | 25 MHz or 50 MHz crystal/oscillator clock input; clock is +/-50 ppm and must be applied before reset voltage goes high. |
| 18 | X2 | output | Crystal connection for X1; NC when an oscillator drives X1. |
| 19 | SMTXEN3 | input | Switch MII transmit enable for port 3, with internal pull-up. |
| 20 | SMTXD33/EN_REFCLKO_3 | input | MLL/FLL: switch MII transmit data bit 3; RLL: strap for RMII REFCLKO_3 output enable (pull-up enables, pull-down disables). |
| 21 | SMTXD32/NC | input | MLL/FLL: switch MII transmit data bit 2 with internal pull-up; RLL: no connection. |
| 22 | SMTXD31 | input | Switch MII/RMII transmit data bit 1, with internal pull-up. |
| 23 | SMTXD30 | input | Switch MII/RMII transmit data bit 0, with internal pull-up. |
| 24 | GND | power_in | Digital ground. |
| 25 | VDDIO | power_in | 3.3V, 2.5V, or 1.8V digital IO supply input; requires well-decoupled capacitors. |
| 26 | SMTXC3/REFCLKI_3 | bidirectional | MII transmit clock (output in PHY and SNI mode, input in MAC MII and RMII mode); RLL: RMII reference clock input. |
| 27 | SMTXER3/MII_LINK_3 | input | MII transmit error in MII mode; doubles as MII link indicator from host (high = no link) for bypass mode, with internal pull-down. |
| 28 | SMRXDV3 | bidirectional | Switch MII receive data valid; strap selects PHY mode (pull-up) or MAC mode (pull-down). |
| 29 | SMRXD33/REFCLKO_3 | bidirectional | MLL/FLL: switch MII receive data bit 3; RLL: 50 MHz reference clock output in RMII mode; strap enables P2ANEN. |
| 30 | SMRXD32 | bidirectional | Switch MII receive data bit 2; strap forces port 2 speed (pull-up 100BT, pull-down 10BT when P2ANEN=0). |
| 31 | SMRXD31 | bidirectional | Switch MII/RMII receive data bit 1; strap sets port 2 duplex mode (P2DPX). |
| 32 | GND | power_in | Digital ground. |
| 33 | SMRXD30 | bidirectional | Switch MII/RMII receive data bit 0; strap forces port 2 flow control (P2FFC). |
| 34 | SCRS3/NC | bidirectional | MLL/FLL: switch MII carrier sense; RLL: no connection with internal pull-up. Pull down with 1 kohm if only full-duplex is used. |
| 35 | SCOL3/NC | bidirectional | MLL/FLL: switch MII collision detect; RLL: no connection with internal pull-up. |
| 36 | SMRXC3/NC | bidirectional | MLL/FLL: switch MII receive clock (output in PHY mode, input in MAC mode); RLL: no connection. |
| 37 | GND | power_in | Digital ground. |
| 38 | VDDC | power_in | 1.8V digital core power input from VDDCO (pin 56). |
| 39 | SPIQ | bidirectional | SPI slave serial data output (needs external pull-up when used); strap selects XCLK frequency (pull-up 25 MHz, pull-down 50 MHz). |
| 40 | SPISN | input | SPI slave chip select, active-low; high deselects the device and tri-states SPIQ. Needs external pull-up when used. |
| 41 | INTRN | output | Active-low interrupt output to the host CPU, signalling a status bit set on lost link (see registers 187 and 188). |
| 42 | SCL_MDC | bidirectional | SPI/I2C slave clock input, I2C master clock output, or MIIM clock input depending on mode. |
| 43 | SDA_MDIO | bidirectional | SPI slave data input, I2C data I/O, or MIIM data I/O depending on mode; needs external pull-up when used. |
| 44 | NC | unconnected | Unused pin; the only NC pin that may be pulled down by a resistor for better EMI. |
| 45 | P1ANEN | bidirectional | Strap: pull-up enables auto-negotiation on port 1, pull-down disables it. |
| 46 | P1SPD | bidirectional | Strap: pull-up forces port 1 to 100BT and pull-down forces 10BT when P1ANEN=0. |
| 47 | P1DPX | bidirectional | Strap: sets port 1 duplex default if auto-negotiation fails (pull-up full, pull-down half) or forces duplex when P1ANEN=0. |
| 48 | GND | power_in | Digital ground. |
| 49 | VDDC | power_in | 1.8V digital core power input from VDDCO (pin 56). |
| 50 | P1FFC | bidirectional | Strap: pull-up always enables port 1 flow control; pull-down lets auto-negotiation decide. |
| 51 | P3SPD | bidirectional | Strap: pull-up forces port 3 to 10BT; pull-down forces 100BT (default). |
| 52 | NC | unconnected | Unused pin; no external connection. |
| 53 | NC | unconnected | Unused pin; no external connection. |
| 54 | VDDIO | power_in | 3.3V, 2.5V or 1.8V digital IO supply input; requires well-decoupled capacitors. |
| 55 | GND | power_in | Digital ground. |
| 56 | VDDCO | power_out | 1.8V core output from the internal LDO, supplying VDDA_1.8 and VDDC; do not connect an external supply. |
| 57 | NC | unconnected | Unused pin; no external connection. |
| 58 | P1LED1 | bidirectional | Port 1 LED indicator (speed by default); strap sets port 3 flow control (P3FFC), pull-up enables it. |
| 59 | P1LED0 | bidirectional | Port 1 LED indicator (link/activity by default); strap sets port 3 duplex (P3DPX), pull-up selects half-duplex; recommend external 0.5 kohm pull-down. |
| 60 | P2LED1 | bidirectional | Port 2 LED indicator (speed by default); with P2LED0 selects the serial bus configuration mode. |
| 61 | P2LED0 | bidirectional | Port 2 LED indicator (link/activity by default); with P2LED1 selects I2C master, I2C slave, SPI slave, or SMI/MIIM mode. |
| 62 | RSTN | input | Hardware reset input, active-low, with internal pull-up. |
| 63 | FXSD1 | input | MLL/RLL: connect to analog ground by pull-down resistor; FLL: fiber signal detect input. |
| 64 | VDDA_1.8 | power_in | 1.8V analog VDD input from VDDCO (pin 56) through an external ferrite bead and capacitors. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | LQFP-64(10x10) |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 64 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage (VDDA_1.8, VDDC) | 1.66 | 1.94 | V | 74 | |||
| Supply Voltage (VDDA_3.3) | 2.5 | 3.465 | V | 74 | |||
| Supply Voltage (VDDIO) | 1.71 | 3.465 | V | 74 | |||
| Ambient Temperature (Commercial) | TA | 0 | 70 | °C | 74 | ||
| Ambient Temperature (Industrial) | TA | -40 | 85 | °C | 74 | ||
| Junction Temperature (TJ) | TJ | 125 | °C | 74 | |||
| Supply Voltage (VDDA_1.8, VDDC) | VIN | -0.5 | 2.4 | V | 74 | ||
| Supply Voltage (VDDA_3.3, VDDIO) | VIN | -0.5 | 4 | V | 74 | ||
| Input Voltage | VIN | -0.5 | 4 | V | 74 | ||
| Output Voltage | -0.5 | 4 | V | 74 | |||
| Lead Temperature (soldering, 10s) | 260 | °C | soldering, 10s | 74 | |||
| Storage Temperature | TS | -55 | 150 | °C | 74 | ||
| HBM ESD Rating | -3 | 3 | kV | 74 | |||
| Thermal Resistance LQFP (ΘJA) | ΘJA | 47.24 | °C/W | Note 5-1 No heat spreader (HS) in this package | 74 | ||
| Thermal Resistance LQFP (ΘJC) | ΘJC | 19.37 | °C/W | Note 5-1 No heat spreader (HS) in this package | 74 | ||
| CMOS Input High Voltage | VIH | 2 | V | VDDIO = 3.3V | 75 | ||
| CMOS Input High Voltage | VIH | 1.8 | V | VDDIO = 2.5V | 75 | ||
| CMOS Input High Voltage | VIH | 1.3 | V | VDDIO = 1.8V | 75 | ||
| CMOS Input Low Voltage | VIL | 0.8 | V | VDDIO = 3.3V | 75 | ||
| CMOS Input Low Voltage | VIL | 0.7 | V | VDDIO = 2.5V | 75 | ||
| CMOS Input Low Voltage | VIL | 0.5 | V | VDDIO = 1.8V | 75 | ||
| Input Current | IIN | -10 | 10 | µA | VIN = GND ~ VDDIO | 75 | |
| CMOS Output High Voltage | VOH | 2.4 | V | IOH = -8 mA, VDDIO = 3.3V | 75 | ||
| CMOS Output High Voltage | VOH | 2 | V | IOH = -8 mA, VDDIO = 2.5V | 75 | ||
| CMOS Output High Voltage | VOH | 1.5 | V | IOH = -8 mA, VDDIO = 1.8V | 75 | ||
| CMOS Output Low Voltage | VOL | 0.4 | V | VIOL = 8 mA, VDDIO = 3.3V | 75 | ||
| CMOS Output Low Voltage | VOL | 0.3 | V | VIOL = 8 mA, VDDIO = 1.8V | 75 | ||
| Output Tri-State Leakage | /IOZ/ | 10 | µA | 75 | |||
| Peak Differential Output Voltage | VO | 0.95 | 1.05 | V | 100Ω termination across differential output | 75 | |
| Output Voltage Imbalance | VIMB | 2 | % | 100Ω termination across differential output | 76 | ||
| Rise/Fall Time | tr/tf | 3 | 5 | ns | 76 | ||
| Rise/Fall Time Imbalance | 0 | 0.5 | ns | 76 | |||
| Duty Cycle Distortion | -0.5 | 0.5 | ns | 76 | |||
| Overshoot | 5 | % | 76 | ||||
| Output Jitter (100BASE-TX) | 0.7 | 1.4 | ns | Peak-to-peak | 76 | ||
| Output Jitter (10BASE-T) | 1.4 | 11 | ns | Peak-to-peak | 76 | ||
| EEPROM Setup time | ts1 | 20 | ns | 77 | |||
| EEPROM Hold time | th1 | 20 | ns | 77 | |||
| EEPROM Output valid | tov1 | 4096 | 4112 | 4128 | ns | 77 |
CAD (KiCad official)
- Symbol:
KSZ8873MLL - Footprint:
Package_QFP:LQFP-64_10x10mm_P0.5mm - 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
- 3D model files:
ksz8873mll-etched.step/ksz8873mll-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ksz8873mll.step/ksz8873mll.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (95 pp, sha256
5bfa1107d97e8afb, retrieved 2026-10-28, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).