component
KSZ8463FRLI
Public Made by Adomby adom
Microchip Tech Interface - Specialized, LQFP-64(10x10). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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KSZ8463FRLI
Microchip Tech · Interface - Specialized · LQFP-64(10x10)
KSZ8463FRLI from Microchip Tech, in a LQFP-64(10x10). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RXM1 | bidirectional | Port 1 physical receive (MDI) or transmit (MDIX) signal, negative differential. |
| 2 | RXP1 | bidirectional | Port 1 physical receive (MDI) or transmit (MDIX) signal, positive differential. |
| 3 | AGND | power_in | Analog ground. |
| 4 | TXM1 | bidirectional | Port 1 physical transmit (MDI) or receive (MDIX) signal, negative differential. |
| 5 | TXP1 | bidirectional | Port 1 physical transmit (MDI) or receive (MDIX) signal, positive differential. |
| 6 | VDD_AL | power_in | Low-voltage analog power input; its source should be filtered with a ferrite bead and capacitors. |
| 7 | ISET | output | Sets physical transmit output current; pull down with a 6.49 kΩ (1%) resistor to ground. |
| 8 | AGND | power_in | Analog ground. |
| 9 | VDD_A3.3 | power_in | 3.3V analog VDD input supply; must be well decoupled. |
| 10 | RXM2 | bidirectional | Port 2 physical receive (MDI) or transmit (MDIX) signal, negative differential. |
| 11 | RXP2 | bidirectional | Port 2 physical receive (MDI) or transmit (MDIX) signal, positive differential. |
| 12 | AGND | power_in | Analog ground. |
| 13 | TXM2 | bidirectional | Port 2 physical transmit (MDI) or receive (MDIX) signal, negative differential. |
| 14 | TXP2 | bidirectional | Port 2 physical transmit (MDI) or receive (MDIX) signal, positive differential. |
| 15 | FXSD2 | input | Port 2 fiber signal detect input in 100BASE-FX mode; in copper mode it is unused and should be pulled to GND. |
| 16 | VDD_COL | power_in | Second low-voltage analog power input, to be filtered with a ferrite bead and capacitors. |
| 17 | PWRDN | input | Active-low full-chip power-down with internal pull-up (low = power-down, high or floating = normal operation); all I/O pins are tri-stated while low. |
| 18 | X1 | input | 25 MHz crystal or oscillator clock connection (±50 ppm); with an oscillator, X1 connects to a VDD_IO-tolerant oscillator. |
| 19 | X2 | output | 25 MHz crystal connection; no connect when an oscillator is used on X1. |
| 20 | DGND | power_in | Digital ground. |
| 21 | VDD_IO | power_in | 3.3V, 2.5V, or 1.8V digital VDD input for IO logic and the internal low-voltage regulator. |
| 22 | TX_EN | input | RMII transmit enable, active high indicates valid transmit data on TXD[1:0]; internal pull-down. |
| 23 | TXD3/EN_REFCLKO | input | In RMII mode EN_REFCLKO enables the REFCLK_O output on pin 32 when pulled up and disables it when pulled down; internal pull-down. |
| 24 | TXD2/NC | input | No connect and not used in RMII mode (unused MII signals may be tied to ground via a resistor); internal pull-down. |
| 25 | TXD1 | input | RMII transmit data bit[1], synchronous to the 50 MHz REFCLK; internal pull-down. |
| 26 | TXD0 | input | RMII transmit data bit[0], synchronous to the 50 MHz REFCLK; internal pull-down. |
| 27 | TX_CLK/REFCLK_I | input | RMII 50 MHz reference input clock; internal pull-down. |
| 28 | TX_ER/MII_BP | input | No connect and not used in RMII mode per the pin table, though TX_ER may connect to the RMII PHY RX_ER; internal pull-down. |
| 29 | DGND | power_in | Digital ground. |
| 30 | VDD_IO | power_in | 3.3V, 2.5V, or 1.8V digital VDD input for IO logic and the internal low-voltage regulator. |
| 31 | RX_DV | bidirectional | RMII receive data valid, active high indicates valid data on RXD[1:0]; latched at power-up/reset as a PHY/MAC MII mode strap (pull-up default). |
| 32 | RXD3/REFCLK_O | output | RMII 50 MHz REFCLK_O output (16 mA drive) when EN_REFCLKO (pin 23) is pulled up; internal pull-down during reset. |
| 33 | RXD2 | bidirectional | Not used in RMII mode; at power-up/reset a pull-up (default) selects high-speed SPI (up to 50 MHz) and a pull-down selects low-speed SPI (up to 12.5 MHz). |
| 34 | RXD1 | bidirectional | RMII receive data bit[1], synchronous to REFCLK (50 MHz); latched at power-up/reset with RXD0 to select the serial bus mode. |
| 35 | RXD0 | bidirectional | RMII receive data bit[0], synchronous to REFCLK (50 MHz); latched at power-up/reset with RXD1 to select the serial bus mode. |
| 36 | CRS/GPIO9_RLI | bidirectional | GPIO9 in RMII mode; internal pull-down. |
| 37 | COL/GPIO10_RLI | bidirectional | GPIO10 in RMII mode; internal pull-down. |
| 38 | RX_CLK/GPIO7_RLI | bidirectional | GPIO7 in RMII mode; internal pull-down. |
| 39 | DGND | power_in | Digital ground. |
| 40 | VDD_L | power_in | Low-voltage input if the internal regulator is not used, or low-voltage output if the internal regulator is used. |
| 41 | SPI_DO | bidirectional | SPI slave serial data output; at power-up/reset a pull-up (default) selects the 25 MHz X1/X2 clock and a pull-down selects the 50 MHz REFCLK_I input. |
| 42 | SPI_CSN | input | Active-low SPI slave chip select with internal pull-down; needs an external 4.7 kΩ pull-up when in use. |
| 43 | INTRN | output | Active-low interrupt output to the host CPU; needs an external 4.7 kΩ pull-up resistor. |
| 44 | SPI_SCLK/MDC | input | Serial clock input in SPI slave mode, or MDC clock input in MIIM mode; internal pull-up. |
| 45 | SPI_DI/MDIO | bidirectional | SPI slave serial data input or MIIM MDIO data input/output; needs an external 4.7 kΩ pull-up resistor. |
| 46 | GPIO8 | bidirectional | General purpose I/O 8 with internal pull-down. |
| 47 | GPIO11 | bidirectional | General purpose I/O 11 with internal pull-up. |
| 48 | GPIO0 | bidirectional | General purpose I/O 0 usable by the IEEE 1588 event trigger or time stamp units, synchronized to the internal 1588 clock; internal pull-up. |
| 49 | GPIO1 | bidirectional | General purpose I/O 1 with internal pull-up. |
| 50 | DGND | power_in | Digital ground. |
| 51 | VDD_L | power_in | Low-voltage input if the internal regulator is not used, or low-voltage output if the internal regulator is used. |
| 52 | GPIO2 | bidirectional | General purpose I/O 2 with internal pull-up. |
| 53 | GPIO3 | bidirectional | General purpose I/O 3 with internal pull-down. |
| 54 | GPIO4 | bidirectional | General purpose I/O 4 with internal pull-down. |
| 55 | GPIO5 | bidirectional | General purpose I/O 5 with internal pull-down. |
| 56 | VDD_IO | power_in | 3.3V, 2.5V, or 1.8V digital VDD input for IO logic and the internal low-voltage regulator. |
| 57 | DGND | power_in | Digital ground. |
| 58 | GPIO6 | bidirectional | General purpose I/O 6 with internal pull-up. |
| 59 | P1LED1/GPIO7_MLI | bidirectional | Port 1 LED1 output in RMII mode, active (ON) when low. |
| 60 | P1LED0 | bidirectional | Port 1 LED0 output, active (ON) when low. |
| 61 | P2LED1/GPIO9_MLI | bidirectional | Port 2 LED1 output in RMII mode, active (ON) when low. |
| 62 | P2LED0/GPIO10_MLI | bidirectional | Port 2 LED0 output in RMII mode, active (ON) when low. |
| 63 | RSTN | input | Active-low hardware reset input with internal pull-up; must be low for at least 10 ms after VDD_IO and 3.3V supplies are stable. |
| 64 | FXSD1 | input | Port 1 fiber signal detect input in 100BASE-FX mode; in copper mode it is unused and should be pulled to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Microchip Tech |
| Package | LQFP-64(10x10) |
| Category | Communication Interface Chip/UART/485/232 |
| Pins | 64 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage VDD_A3.3, VDD_IO (abs max) | -0.5 | 5 | V | 189 | |||
| Supply Voltage VDD_AL, VDD_L (abs max) | -0.5 | 1.8 | V | 189 | |||
| Input Voltage (All Inputs) | -0.5 | 5 | V | 189 | |||
| Output Voltage (All Outputs) | -0.5 | 5 | V | 189 | |||
| Lead Temperature (soldering, 10s) | 260 | °C | soldering, 10s | 189 | |||
| Storage Temperature | TS | -65 | 150 | °C | 189 | ||
| Maximum Junction Temperature | TJ | 125 | °C | 189 | |||
| HBM ESD Rating | 2 | kV | 189 | ||||
| Supply Voltage VDDA_3.3 | VDDA_3.3 | 3.135 | 3.465 | V | 189 | ||
| Supply Voltage VDD_L, VDD_AL, VDD_COL | VDD_L | 1.25 | 1.4 | V | 189 | ||
| VDD_IO (3.3V) | VDD_IO | 3.135 | 3.465 | V | 3.3V | 189 | |
| VDD_IO (2.5V) | VDD_IO | 2.375 | 2.625 | V | 2.5V | 189 | |
| VDD_IO (1.8V) | VDD_IO | 1.71 | 1.89 | V | 1.8V | 189 | |
| Ambient Operating Temperature (Industrial) | TA | -40 | 85 | °C | Industrial | 189 | |
| Junction-to-Ambient | ΘJA | 49 | °C/W | No heat spreader, air velocity 0m/s | 189 | ||
| Junction-to-Case | ΘJC | 19 | °C/W | No heat spreader, air velocity 0m/s | 189 | ||
| CMOS Input Current | IIN | -10 | 10 | µA | VIN = GND ~ VDD_IO | 191 | |
| X1 Input High Voltage | VIH | 2.1 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 191 | ||
| X1 Input Low Voltage | VIL | 0.9 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 191 | ||
| X1 Input Current | IIN | 10 | µA | 191 | |||
| PWRDN Input High Voltage | VIH | 1.1 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 191 | ||
| PWRDN Input Low Voltage | VIL | 0.3 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 192 | ||
| FXSD Input High Voltage | VIH | 2.1 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 192 | ||
| FXSD Input Low Voltage | VIL | 1.2 | V | VDD_A3.3 = 3.3V, VDD_IO = any | 192 | ||
| Output Tri-State Leakage | /IOZ/ | 10 | µA | 192 | |||
| 100BASE-TX Peak Differential Output Voltage | VO | -0.95 | 1.05 | V | 100Ω termination on the diff. output; printed ±0.95 to ±1.05 | 192 | |
| 100BASE-TX Output Voltage Imbalance | VIMB | 2 | % | 100Ω termination on the diff. output | 192 | ||
| 100BASE-TX Rise/Fall Time | tr/tf | 3 | 5 | ns | 192 | ||
| Rise/Fall Time Imbalance | 0 | 0.5 | ns | 192 | |||
| Duty Cycle Distortion | -0.25 | 0.25 | ns | 192 | |||
| Overshoot | 5 | % | 192 | ||||
| Output Jitter | 0.7 | 1.4 | ns | Peak-to-peak | 192 | ||
| 10BASE-T Transmit Peak Differential Output Voltage | VP | 2.2 | 2.5 | 2.8 | V | 100Ω termination on the differential output | 192 |
| 10BASE-T Jitter Added | 1.8 | 3.5 | ns | 100Ω termination on the differential output (peak-to-peak) | 192 | ||
| 1.8V Pull-Up Resistance | R1.8PU | 57 | 100 | 187 | kΩ | VDD_IO = 1.8V | 192 |
| 1.8V Pull-Down Resistance | R1.8PD | 55 | 100 | 190 | kΩ | VDD_IO = 1.8V | 192 |
| 2.5V Pull-Up Resistance | R2.5PU | 37 | 59 | 102 | kΩ | VDD_IO = 2.5V | 192 |
| 2.5V Pull-Down Resistance | R2.5PD | 35 | 60 | 110 | kΩ | VDD_IO = 2.5V | 192 |
| 3.3V Pull-Up Resistance | R3.3PU | 29 | 43 | 70 | kΩ | VDD_IO = 3.3V | 192 |
| 3.3V Pull-Down Resistance | R3.3PD | 27 | 43 | 76 | kΩ | VDD_IO = 3.3V | 192 |
| CMOS Input High Voltage (3.3V/2.5V/1.8V) | VIH | 2.1 | V | VDD_IO = 3.3V (2.1 / 1.7 / 1.3 for 3.3/2.5/1.8V) | 191 | ||
| CMOS Input Low Voltage (3.3V) | VIL | 0.9 | V | VDD_IO = 3.3V (0.9 / 0.9 / 0.6 for 3.3/2.5/1.8V) | 191 | ||
| CMOS Output High Voltage (3.3V) | VOH | 2.4 | V | IOH = -8 mA; VDD_IO = 3.3V (2.4 / 1.9 / 1.5 for 3.3/2.5/1.8V) | 192 | ||
| CMOS Output Low Voltage (3.3V) | VOL | 0.4 | V | IOL = 8 mA; VDD_IO = 3.3V (0.4 / 0.4 / 0.2 for 3.3/2.5/1.8V) | 192 | ||
| Internal LDO Output Voltage | VLDO | 1.32 | V | VDD_IO = 2.5V or 3.3V; internal regulator enabled; measured at pins 40 and 51 | 191 | ||
| Reference Voltage of ISET | VSET | 0.65 | V | Using 6.49 kΩ, 1% resistor | 192 | ||
| 10BASE-T Receive Squelch Threshold | VSQ | 400 | mV | 5 MHz square wave | 192 | ||
| LED Output Drive Current | ILED | 8 | mA | Each LED pin (P1/2LED0, P1/2LED1) | 192 | ||
| IVDD_A3.3, 100BASE-TX, regulator on | IVDD_A3.3 | 46 | mA | 100% traffic on both ports | 190 | ||
| IVDD_IO, 100BASE-TX, regulator on | IVDD_IO | 98 | mA | 100% traffic on both ports | 190 | ||
| Device power dissipation, 100BASE-TX, regulator on | PDISSDEVICE | 476 | mW | 100% traffic on both ports | 190 | ||
| Device power dissipation, hardware power-down | PDISSDEVICE | 4.6 | mW | PWDRN pin held low | 190 | ||
| Reference crystal frequency tolerance | -50 | 50 | ppm | 25 MHz crystal, maximum | 205 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | In copper mode, and on the KSZ8463ML and KSZ8463RL, the FXSD pins are unused and should be pulled low. | 18 |
CAD (KiCad official)
- Symbol:
KSZ8463FRLI - Footprint:
Package_QFP:LQFP-64_10x10mm_P0.5mm - 3D model: LQFP-64(10x10) (KiCad packages3D, STEP)
- 3D model files:
ksz8463frli-etched.step/ksz8463frli-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ksz8463frli.step/ksz8463frli.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Microchip Tech datasheet (213 pp, sha256
6e2255020c924402, retrieved 2026-10-31, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).