component
KSRV05-4MR6T1G
Public Made by Adomby adom
KUU ESD Protection Devices, SOT-23-6L. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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KSRV05-4MR6T1G
KUU · ESD Protection Devices · SOT-23-6L
KSRV05-4MR6T1G from KUU, in a SOT-23-6L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O | bidirectional | Each I/O pin withstands ±8KV contact ESD per IEC 61000-4-2 and has 0.20pF typical I/O-to-I/O capacitance, with 5.0V reverse working voltage to GND. |
| 2 | GND | power_in | Ground reference for the ESD protection array, to which the I/O and Vcc clamping and reverse working voltages are specified. |
| 3 | I/O | bidirectional | Each I/O pin withstands ±8KV contact ESD per IEC 61000-4-2 and has 0.20pF typical I/O-to-I/O capacitance, with 5.0V reverse working voltage to GND. |
| 4 | I/O | bidirectional | Each I/O pin withstands ±8KV contact ESD per IEC 61000-4-2 and has 0.20pF typical I/O-to-I/O capacitance, with 5.0V reverse working voltage to GND. |
| 5 | Vcc | power_in | Vcc pin is clamped to GND at 15V for IPP = 8A (8/20μs) and has 0.80pF typical capacitance to GND. |
| 6 | I/O | bidirectional | Each I/O pin withstands ±8KV contact ESD per IEC 61000-4-2 and has 0.20pF typical I/O-to-I/O capacitance, with 5.0V reverse working voltage to GND. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | KUU |
| Package | SOT-23-6L |
| Category | Circuit Protection |
| Pins | 6 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power | PPP | 60 | W | 8/20μs | 2 | ||
| ESD per IEC 61000-4-2 (Contact) | VESD | -20 | 20 | kV | ESD per IEC 61000-4-2 (Contact) | 2 | |
| ESD per IEC 61000-4-2 (Air) | VESD | -25 | 25 | kV | ESD per IEC 61000-4-2 (Air) | 2 | |
| Operating Temperature | TOPT | -55 | 125 | C | 2 | ||
| Storage Temperature | TSTG | -55 | 150 | C | 2 | ||
| Reverse Working Voltage | VRWM | 5 | V | Any I/O pin to GND | 2 | ||
| Reverse Breakdown Voltage | VBR | 6 | 9 | V | IT = 1mA, Any I/O pin to GND | 2 | |
| Reverse Leakage Current | IR | 1 | μA | VRWM = 5V, Any I/O pin to GND | 2 | ||
| Clamping Voltage | VC | 10 | V | IPP = 1A, tp = 8/20μs, Any I/O pin to GND | 2 | ||
| Clamping Voltage | VC | 15 | V | IPP = 4A, tp = 8/20μs, Any I/O pin to GND | 2 | ||
| Parasitic Capacitance | CESD | 0.2 | 0.3 | pF | VR = 0V, f = 1MHz, Between I/O and I/O | 2 | |
| Parasitic Capacitance | CESD | 0.45 | 0.5 | pF | VR = 0V, f = 1MHz, Between I/O and GND | 2 | |
| Parasitic Capacitance | CESD | 0.8 | pF | VR = 0V, f = 1MHz, Between Vcc and GND | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | Terminal: Matte tin plated. High temperature soldering guaranteed: | 1 |
CAD (KiCad official)
- Symbol:
KSRV05-4MR6T1G - Footprint:
Package_TO_SOT_SMD:SOT-23-6 - 3D model: SOT-23-6L (KiCad packages3D, STEP)
- 3D model files:
ksrv05-4mr6t1g-etched.step/ksrv05-4mr6t1g-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ksrv05-4mr6t1g.step/ksrv05-4mr6t1g.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: KUU datasheet (4 pp, sha256
c6d8227217c8f418, retrieved 2026-10-27, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# KSRV05-4MR6T1G
**KUU** · ESD Protection Devices · SOT-23-6L
KSRV05-4MR6T1G from KUU, in a SOT-23-6L. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | I/O | bidirectional | Each I/O pin withstands ±8KV contact ESD per IEC 61000-4-2 and has 0.20pF typical I/O-to-I/O capacitance, with 5.0V reverse working voltage to GND. |
| 2 | GND | power_in | Ground reference for the ESD protection array, to which the I/O and Vcc clamping and reverse working voltages are specified. |
| 3 | I/O | bidirectional | Each I/O pin withstands ±8KV contact ESD per IEC 61000-4-2 and has 0.20pF typical I/O-to-I/O capacitance, with 5.0V reverse working voltage to GND. |
| 4 | I/O | bidirectional | Each I/O pin withstands ±8KV contact ESD per IEC 61000-4-2 and has 0.20pF typical I/O-to-I/O capacitance, with 5.0V reverse working voltage to GND. |
| 5 | Vcc | power_in | Vcc pin is clamped to GND at 15V for IPP = 8A (8/20μs) and has 0.80pF typical capacitance to GND. |
| 6 | I/O | bidirectional | Each I/O pin withstands ±8KV contact ESD per IEC 61000-4-2 and has 0.20pF typical I/O-to-I/O capacitance, with 5.0V reverse working voltage to GND. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | KUU |
| Package | SOT-23-6L |
| Category | Circuit Protection |
| Pins | 6 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak Pulse Power | PPP | | | 60 | W | 8/20μs | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -20 | | 20 | kV | ESD per IEC 61000-4-2 (Contact) | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD | -25 | | 25 | kV | ESD per IEC 61000-4-2 (Air) | 2 |
| Operating Temperature | TOPT | -55 | | 125 | C | | 2 |
| Storage Temperature | TSTG | -55 | | 150 | C | | 2 |
| Reverse Working Voltage | VRWM | | | 5 | V | Any I/O pin to GND | 2 |
| Reverse Breakdown Voltage | VBR | 6 | | 9 | V | IT = 1mA, Any I/O pin to GND | 2 |
| Reverse Leakage Current | IR | | | 1 | μA | VRWM = 5V, Any I/O pin to GND | 2 |
| Clamping Voltage | VC | | | 10 | V | IPP = 1A, tp = 8/20μs, Any I/O pin to GND | 2 |
| Clamping Voltage | VC | | | 15 | V | IPP = 4A, tp = 8/20μs, Any I/O pin to GND | 2 |
| Parasitic Capacitance | CESD | | 0.2 | 0.3 | pF | VR = 0V, f = 1MHz, Between I/O and I/O | 2 |
| Parasitic Capacitance | CESD | | 0.45 | 0.5 | pF | VR = 0V, f = 1MHz, Between I/O and GND | 2 |
| Parasitic Capacitance | CESD | | | 0.8 | pF | VR = 0V, f = 1MHz, Between Vcc and GND | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | | tin | Terminal: Matte tin plated. High temperature soldering guaranteed: | 1 |
## CAD (KiCad official)
- Symbol: `KSRV05-4MR6T1G`
- Footprint: `Package_TO_SOT_SMD:SOT-23-6`
- 3D model: SOT-23-6L (KiCad packages3D, STEP)
- 3D model files: `ksrv05-4mr6t1g-etched.step` / `ksrv05-4mr6t1g-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ksrv05-4mr6t1g.step` / `ksrv05-4mr6t1g.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [KUU datasheet](docs/ksrv05-4mr6t1g-datasheet.pdf) (4 pp, sha256 `c6d8227217c8f418`, retrieved 2026-10-27, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/ksrv05-4mr6t1g-datasheet.pdf)