component
K121002
Public Made by Adomby adom
KUU Disposable Fuses, 1206. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
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K121002
KUU · Disposable Fuses · 1206
K121002 from KUU, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Fuse terminal 1 (unpolarized); part is rated 2A, with rated voltage of 72V/63V/32V/24V DC and 103-165 mOhm typical cold resistance. |
| 2 | 2 | passive | Fuse terminal 2 (unpolarized); part is rated 2A, with rated voltage of 72V/63V/32V/24V DC and 103-165 mOhm typical cold resistance. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | KUU |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating temperature | -55 | 125 | °C | Operating temperature, with proper correction factor applied (temperature derating curve) | 3 | ||
| Storage temperature | 40 | °C | Packed in original packaging | 4 | |||
| Storage relative humidity | 70 | % RH | Packed in original packaging | 4 | |||
| Typical cold resistance | 103 | 165 | mOhms | DC cold resistance measured at <10% of rated current, ambient 25℃ | 1 | ||
| Time to open at 1.0In | 4 | hour | Rated current 250mA~5A, 1.0In | 1 | |||
| Time to open at 2.5In | 5 | sec | Rated current 250mA~5A, 2.5In | 1 | |||
| Wave solder time in reservoir | 10 | sec | Wave solder, reservoir temperature 260℃ | 2 | |||
| Infrared reflow time | 30 | sec | Infrared reflow, temperature 260℃ | 2 | |||
| Preheat and soak temperature Tsmin | Tsmin | 150 | ℃ | Lead(Pb) free solder reflow profile | 3 | ||
| Preheat and soak temperature Tsmax | Tsmax | 200 | ℃ | Lead(Pb) free solder reflow profile | 3 | ||
| Preheat and soak time Tsmin to Tsmax | tS | 60 | 120 | Seconds | Lead(Pb) free solder reflow profile | 3 | |
| Average ramp up rate Tsmax to Tp | 3 | ℃ / Second | Lead(Pb) free solder reflow profile | 3 | |||
| Time at liquidous | tL | 60 | 150 | Seconds | Lead(Pb) free solder reflow profile, liquidous temperature TL 217℃ | 3 | |
| Average ramp-down rate TP to Tsmax | 6 | ℃ / Second | Lead(Pb) free solder reflow profile | 3 | |||
| Time from 25℃ to peak temperature | 8 | Minutes | Lead(Pb) free solder reflow profile | 3 | |||
| Rated current | 2 | A | Part No. K121002 rated current column | 1 |
CAD (KiCad official)
- Symbol:
K121002 - Footprint:
Fuse:Fuse_1206_3216Metric - 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files:
k121002-etched.step/k121002-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);k121002.step/k121002.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: KUU datasheet (4 pp, sha256
fc8f76d94ef04f38, retrieved 2026-10-17, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# K121002
**KUU** · Disposable Fuses · 1206
K121002 from KUU, in a 1206. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Fuse terminal 1 (unpolarized); part is rated 2A, with rated voltage of 72V/63V/32V/24V DC and 103-165 mOhm typical cold resistance. |
| 2 | 2 | passive | Fuse terminal 2 (unpolarized); part is rated 2A, with rated voltage of 72V/63V/32V/24V DC and 103-165 mOhm typical cold resistance. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | KUU |
| Package | 1206 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating temperature | | -55 | | 125 | °C | Operating temperature, with proper correction factor applied (temperature derating curve) | 3 |
| Storage temperature | | | | 40 | °C | Packed in original packaging | 4 |
| Storage relative humidity | | | | 70 | % RH | Packed in original packaging | 4 |
| Typical cold resistance | | 103 | | 165 | mOhms | DC cold resistance measured at <10% of rated current, ambient 25℃ | 1 |
| Time to open at 1.0In | | 4 | | | hour | Rated current 250mA~5A, 1.0In | 1 |
| Time to open at 2.5In | | | | 5 | sec | Rated current 250mA~5A, 2.5In | 1 |
| Wave solder time in reservoir | | | | 10 | sec | Wave solder, reservoir temperature 260℃ | 2 |
| Infrared reflow time | | | | 30 | sec | Infrared reflow, temperature 260℃ | 2 |
| Preheat and soak temperature Tsmin | Tsmin | 150 | | | ℃ | Lead(Pb) free solder reflow profile | 3 |
| Preheat and soak temperature Tsmax | Tsmax | | | 200 | ℃ | Lead(Pb) free solder reflow profile | 3 |
| Preheat and soak time Tsmin to Tsmax | tS | 60 | | 120 | Seconds | Lead(Pb) free solder reflow profile | 3 |
| Average ramp up rate Tsmax to Tp | | | | 3 | ℃ / Second | Lead(Pb) free solder reflow profile | 3 |
| Time at liquidous | tL | 60 | | 150 | Seconds | Lead(Pb) free solder reflow profile, liquidous temperature TL 217℃ | 3 |
| Average ramp-down rate TP to Tsmax | | | | 6 | ℃ / Second | Lead(Pb) free solder reflow profile | 3 |
| Time from 25℃ to peak temperature | | | | 8 | Minutes | Lead(Pb) free solder reflow profile | 3 |
| Rated current | | | 2 | | A | Part No. K121002 rated current column | 1 |
## CAD (KiCad official)
- Symbol: `K121002`
- Footprint: `Fuse:Fuse_1206_3216Metric`
- 3D model: 1206 (KiCad packages3D, STEP)
- 3D model files: `k121002-etched.step` / `k121002-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `k121002.step` / `k121002.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [KUU datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590191852784947200) (4 pp, sha256 `fc8f76d94ef04f38`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/k121002-datasheet.pdf)