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JSM66302
Public Made by Adomby adom
JSMSEMI RFID ICs, QFN-32-EP(5x5). Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownJSM66302
JSMSEMI · RFID ICs · QFN-32-EP(5x5)
JSM66302 from JSMSEMI, in a QFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | TDO / OUT0 | output | Test data output for the boundary scan interface, or general purpose output 0 when enabled via PinEn. |
| 2 | TDI / OUT1 | input | Test data input for the boundary scan interface, or general purpose output 1 when enabled via PinEn. |
| 3 | TMS / OUT2 | input | Test mode select for the boundary scan interface, or general purpose output 2 when enabled via PinEn. |
| 4 | TCK / OUT3 | input | Test clock for the boundary scan interface, or general purpose output 3 when enabled via PinEn. |
| 5 | SIGIN/OUT7 | input | Listed as contactless communication interface output in the description, but typed as input in the table; general purpose output 7 when enabled via PinEn. |
| 6 | SIGOUT | output | Listed as contactless communication interface input in the description, but typed as output in the table; configurable via SigOut register (3-state, 0, 1 or internal signal monitor). |
| 7 | DVDD | power_out | Digital power supply buffer; this pin is used for connection of a buffer capacitor and connecting a supply voltage may damage the device. |
| 8 | VDD | power_in | Power supply; VDD must always be the same or higher voltage than PVDD, with a 3.0 V to 5.5 V supply range in the quick reference. |
| 9 | AVDD | power_out | Analog power supply buffer; this pin is used for connection of a buffer capacitor and connecting a supply voltage may damage the device. |
| 10 | AUX1 | output | Auxiliary output used for analog test signals. |
| 11 | AUX2 | output | Auxiliary output used for analog test signals. |
| 12 | RXP | input | Receiver input pin for the received RF signal. |
| 13 | RXN | input | Receiver input pin for the received RF signal. |
| 14 | VMID | power_out | Internal receiver reference voltage; used for connection of a buffer capacitor and connecting a supply voltage may damage the device. |
| 15 | TX2 | output | Transmitter 2 output delivering the modulated 13.56 MHz carrier. |
| 16 | TVSS | power_in | Transmitter ground supplying the output stage of TX1 and TX2. |
| 17 | TX1 | output | Transmitter 1 output delivering the modulated 13.56 MHz carrier. |
| 18 | TVDD | power_in | Transmitter voltage supply; 3.0 V to 5.5 V per the quick reference data. |
| 19 | XTAL1 | input | Crystal oscillator input to the inverting amplifier; also the input for an externally generated 27.12 MHz clock. |
| 20 | XTAL2 | output | Crystal oscillator output from the inverting amplifier of the oscillator. |
| 21 | PDOWN | input | Power down (reset) input; the power-down current is specified with this pin pulled HIGH. |
| 22 | CLKOUT / OUT6 | output | Clock output, or general purpose output 6 when enabled via PinEn. |
| 23 | SCL | output | Serial clock line for the host I2C interface (typed as output in the table). |
| 24 | SDA | bidirectional | Serial data line for the host I2C interface. |
| 25 | PVDD | power_in | Pad power supply; must always be the same or lower voltage than VDD. |
| 26 | IFSEL0 / OUT4 | input | Host interface selection 0, or general purpose output 4 when enabled via PinEn. |
| 27 | IFSEL1 / OUT5 | input | Host interface selection 1, or general purpose output 5 when enabled via PinEn. |
| 28 | IF0 | bidirectional | Multifunction host interface pin that can be assigned to RS232, SPI, I2C or I2CL. |
| 29 | IF1 | bidirectional | Multifunction host interface pin that can be assigned to SPI, I2C or I2CL. |
| 30 | IF2 | bidirectional | Multifunction host interface pin that can be assigned to RS232, SPI, I2C or I2CL. |
| 31 | IF3 | bidirectional | Multifunction host interface pin that can be assigned to RS232, SPI, I2C or I2CL. |
| 32 | IRQ | output | Interrupt request output signalling an interrupt event. |
| 33 | VSS | power_in | Ground and heat sink connection (exposed pad). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | JSMSEMI |
| Package | QFN-32-EP(5x5) |
| Category | RF And Wireless |
| Pins | 33 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (absolute maximum) | VDD | -0.5 | 6 | V | 116 | ||
| PVDD supply voltage (absolute maximum) | VDD(PVDD) | -0.5 | 6 | V | 116 | ||
| TVDD supply voltage (absolute maximum) | VDD(TVDD) | -0.5 | 6 | V | 116 | ||
| TVDD supply current (absolute maximum) | IDD(TVDD) | 250 | mA | JSM66302 | 116 | ||
| Input voltage on pin RXP (absolute maximum) | Vi(RXP) | -0.5 | 2 | V | 116 | ||
| Input voltage on pin RXN (absolute maximum) | Vi(RXN) | -0.5 | 2 | V | 116 | ||
| Total power dissipation per package (absolute maximum) | Ptot | 1125 | mW | 116 | |||
| ESD voltage Human Body Model (absolute maximum) | VESD(HBM) | -2000 | 2000 | V | Human Body Model (HBM); 1500 , 100 pF; JESD22-A114-B | 116 | |
| ESD voltage Charge Device Model (absolute maximum) | VESD(CDM) | -500 | 500 | V | Charge Device Model (CDM) | 116 | |
| Maximum junction temperature (absolute maximum) | Tj(max) | 125 | °C | 116 | |||
| Storage temperature (absolute maximum) | Tstg | -55 | 150 | °C | no supply voltage applied | 116 | |
| VDD supply voltage (recommended) | VDD | 3 | 5 | 5.5 | V | 116 | |
| TVDD supply voltage (recommended) | VDD(TVDD) | 3 | 5 | 5.5 | V | Note [1]: VDD(PVDD) must always be the same or lower than VDD | 116 |
| PVDD supply voltage (recommended) | VDD(PVDD) | 3 | 5 | 5.5 | V | 116 | |
| Operating ambient temperature (recommended) | Tamb | -25 | 25 | 85 | °C | in still air with exposed pin soldered on a 4 layer JEDEC PCB | 116 |
| Storage temperature (recommended) | Tstg | -40 | 25 | 125 | °C | no supply voltage applied, relative humidity 45...75% | 116 |
| Supply current, modem on | IDD | 17 | 20 | mA | IDD = AVDD+DVDD; modem on (transmitter and receiver are switched on) | 117 | |
| Supply current, modem off | IDD | 0.45 | 0.5 | mA | IDD = AVDD+DVDD; modem off (transmitter and receiver are switched off) | 117 | |
| PVDD supply current | IDD(PVDD) | 0.5 | 5 | A | no load on digital pins, leakage current only | 117 | |
| TVDD supply current | IDD(TVDD) | 100 | 250 | mA | JSM66302 | 117 | |
| Power-down current, ambient +25 °C | Ipd | 40 | 400 | nA | All OUTx pins floating; ambient temp = +25 °C | 117 | |
| Power-down current, ambient -40 °C to +85 °C | Ipd | 1.5 | 2.1 | A | All OUTx pins floating; ambient temp = -40°C...+85°C | 117 | |
| Standby current, ambient 25 °C | Istby | 3 | 6 | A | All OUTx pins floating; ambient temp = 25 °C; Istby = IVDD+ITVDD+ IPVDD | 117 | |
| Standby current, ambient -40 °C to +105 °C | Istby | 5.25 | 26 | A | All OUTx pins floating; ambient temp = -40°C...+105°C; Istby = IVDD+ITVDD+ IPVDD | 117 | |
| LPCD sleep current | ILPCD(sleep) | 3.3 | 6.3 | A | All OUTx pins floating; LFO active, no RF field on; ambient temp = 25 °C | 118 | |
| External buffer capacitor AVDD | CL | 220 | 470 | nF | 118 | ||
| External buffer capacitor DVDD | CL | 220 | 470 | nF | 118 | ||
| Input leakage current, I/O pins | ILI | 0 | 50 | 500 | nA | output disabled | 118 |
| LOW-level input voltage, I/O pins | VIL | -0.5 | V | 118 | |||
| LOW-level output voltage, I/O pins | VOL | 0 | 0 | 0.4 | V | 118 | |
| Input capacitance, I/O pins | Ci | 0 | 2.5 | 4.5 | pF | 118 | |
| LOW-level input voltage, PDOWN pin | VIL | 0 | 0 | 0.4 | V | 118 | |
| Pull-up resistance TCK, TMS, TDI, IF2 | Rpu | 50 | 72 | 120 | K | 118 | |
| Output voltage AUX 1, AUX 2 | Vo | 0 | 1.8 | V | 118 | ||
| Load capacitance AUX 1, AUX 2 | CL | 0 | 400 | pF | 118 | ||
| Input voltage RXP, RXN | Vpp | 0 | 1.65 | 1.8 | V | 118 | |
| Input capacitance RXP, RXN | Ci | 2 | 3.5 | 5 | pF | 118 | |
| Input voltage XTAL1 | Vi | 0 | 1.8 | V | pin XTAL1 | 119 | |
| Equivalent series resistance (crystal) | ESR | 50 | 100 | 119 | |||
| Crystal power dissipation | Pxtal | 50 | 100 | W | 119 | ||
| Input leakage current, IF3-SDA (I2C) | ILI | 2 | 100 | nA | output disabled | 119 | |
| LOW-level input voltage, IF3-SDA (I2C) | VIL | -0.5 | V | 119 | |||
| LOW-level output voltage, IF3-SDA (I2C) | VOL | 0.3 | V | IOL = 3 mA | 119 | ||
| LOW-level output current, IF3-SDA (VOL = 0.4 V) | IOL | 4 | mA | VOL = 0.4 V; Standard mode, Fast mode | 119 | ||
| LOW-level output current, IF3-SDA (VOL = 0.6 V) | IOL | 6 | mA | VOL = 0.6 V; Standard mode, Fast mode | 119 | ||
| Output fall time, IF3-SDA | tf(o) | 250 | ns | Standard mode, Fast mode, CL < 400 pF | 119 | ||
| Output fall time, IF3-SDA, Fast mode+ | tf(o) | 120 | ns | Fast mode +; CL < 550 pF | 119 | ||
| Pulse width of spikes suppressed by input filter | tSP | 0 | 50 | ns | 119 | ||
| Input capacitance, IF3-SDA | Ci | 3.5 | 5 | pF | 119 | ||
| Load capacitance, standard mode | CL | 400 | pF | Standard mode | 120 | ||
| Load capacitance, fast mode | CL | 550 | pF | Fast mode | 120 | ||
| EEPROM data retention time | tEER | 10 | year | Tamb = +55 °C | 120 | ||
| SCK LOW time (SPI) | tSCKL | 50 | ns | 120 | |||
| SCK HIGH time (SPI) | tSCKH | 50 | ns | 120 | |||
| SCK HIGH to data input hold time (SPI) | th(SCKH-D) | 25 | ns | SCK to changing MOSI | 120 | ||
| Data input to SCK HIGH set-up time (SPI) | tsu(D-SCKH) | 25 | ns | changing MOSI to SCK | 120 | ||
| SCK LOW to data output hold time (SPI) | th(SCKL-Q) | 25 | ns | SCK to changing MISO | 120 | ||
| SCK LOW to NSS HIGH time (SPI) | t(SCKL-NSSH) | 0 | ns | 120 | |||
| Thermal resistance junction to ambient (HVQFN32) | Rth(j-a) | 40 | K/W | in still air with exposed pin soldered on a 4 layer JEDEC PCB | 117 |
CAD (KiCad official)
- Symbol:
JSM66302 - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: QFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files:
jsm66302-etched.step/jsm66302-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);jsm66302.step/jsm66302.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: JSMSEMI datasheet (139 pp, sha256
ce86b9e73e03cbc2, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).