# JSM500R

**JSMSEMI** · RF Transceiver ICs · SSOP-16-150mil

JSM500R from JSMSEMI, in a SSOP-16-150mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RO1 | input | External crystal reference input for the frequency synthesizer, with reference input amplitude 0.2 to 1.5 VP-P and fREF of 13.52313 MHz at 433 MHz or 9.81713 MHz at 315 MHz. |
| 2 | GND | power_in | Ground reference; all device voltages are referenced to GND. |
| 3 | ANT | input | RF input; recommended maximum input power is 0 dBm, absolute maximum is 10 dBm, and DC voltage must stay between -0.3 V and VDD+0.3 V. |
| 4 | GND | power_in | Ground reference; all device voltages are referenced to GND. |
| 5 | VDD | power_in | Supply voltage, recommended 2.0 V to 5.0 V; absolute maximum rating is 6 V. |
| 6 | SQ | input | Squelch enable: low enables the squelch function, which suppresses DO output for signals whose code rate exceeds the squelch threshold; high disables squelch. |
| 7 | SEL0 | input | Bit-rate select bit 0; together with SEL1 it sets the recommended maximum code rate, and it selects the recommended CAGC capacitor value. |
| 8 | SHDN | input | Power-save enable: high puts the device in power-save mode with total current below 1 µA; low gives normal operation. |
| 9 | GND | power_in | Ground reference; all device voltages are referenced to GND. |
| 10 | DO | output | Decoded data output; output is specified at 0.8*VDD high (235 µA) and 0.2*VDD low (400 µA), with rise time 600 ns and fall time 250 ns at 15 pF load. |
| 11 | SEL1 | input | Bit-rate select bit 1; together with SEL0 it sets the recommended maximum code rate, and it selects the recommended CAGC capacitor value. |
| 12 | CTH | passive | Reference voltage terminal; the datasheet test conditions use a 0.1 µF capacitor on this pin. |
| 13 | CAGC | passive | AGC capacitor terminal; charged with 120 µA at power-up and discharged with 600 µA during fast stabilization, with recommended value 4.7 µF at SEL1:SEL0 = 00 down to 0.47 µF at SEL1:SEL0 = 11. |
| 14 | RSSI | output | Received signal strength indicator output, with output voltage 0.5 V to 1 V and typical output current 400 µA. |
| 15 | NC | unconnected | No connection; the pin is listed as empty ('空') in the pin definition table. |
| 16 | RO2 | input | External crystal reference input 2; the datasheet gives no separate electrical limits for this pin. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | JSMSEMI |
| Package | SSOP-16-150mil |
| Category | RF And Wireless |
| Pins | 16 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage |  |  |  | 6 | V |  | 2 |
| Storage temperature |  | -65 |  | 150 | ℃ |  | 2 |
| DC voltage on ANT, SQ, SEL0, SEL1, SHDN |  | -0.3 |  |  | V |  | 2 |
| Maximum input power |  |  |  | 10 | dBm |  | 2 |
| Lead soldering temperature |  |  |  | 250 | ℃ | soldering, 10s | 2 |
| Junction temperature |  |  |  | 150 | ℃ |  | 2 |
| Supply voltage |  | 2 |  | 5 | V |  | 3 |
| Operating temperature range |  | -40 |  | 85 | ℃ |  | 3 |
| DC voltage on ANT, SQ, SEL0, SEL1, SHDN |  | -0.3 |  |  | V |  | 3 |
| Maximum input power |  |  |  | 0 | dBm |  | 3 |
| Modulation duty cycle |  | 20 |  | 80 |  |  | 3 |
| Frequency range |  | 300 |  | 450 | MHz |  | 3 |
| Supply current (fRF=315MHz) | ICC |  | 4.5 | 6 | mA | fRF=315MHz | 3 |
| Supply current (fRF=433MHz) | ICC |  | 5.5 | 6 | mA | fRF=433MHz | 3 |
| Supply current in power-down mode | ICC |  |  | 1 | μA | SHDN="1" | 3 |
| Operating frequency | fRF | 300 |  | 450 | MHz |  | 3 |
| Reference signal input amplitude | VREF | 0.2 |  | 1.5 | VP-P |  | 3 |
| Bit rate | BR |  |  | 20 | Kbps |  | 3 |
| RSSI output voltage | VRSSI | 0.5 |  | 1 | V |  | 3 |

## CAD (KiCad official)

- Symbol: `JSM500R`
- Footprint: `Package_SO:SSOP-16_5.3x6.2mm_P0.65mm`
- 3D model: SSOP-16-150mil (KiCad packages3D, STEP)
- 3D model files: `jsm500r-etched.step` / `jsm500r-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `jsm500r.step` / `jsm500r.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [JSMSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588904246742171648) (10 pp, sha256 `bcfd15cd41cc9705`, retrieved 2026-10-18, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/jsm500r-datasheet.pdf)