component
JSM2134
Public Made by Adomby adom
JSMSEMI Gate Drivers, TSSOP-20. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownJSM2134
JSMSEMI · Gate Drivers · TSSOP-20
JSM2134 from JSMSEMI, in a TSSOP-20. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | HIN1 | input | Phase 1 high-side logic input, compatible with 3.3 V or 5 V logic (VIH min 2.5 V, VIL max 0.8 V), with an internal 800 kΩ resistor and pulse widths below 1 µs not reliably transmitted. |
| 2 | HIN2 | input | Phase 2 high-side logic input, compatible with 3.3 V or 5 V logic (VIH min 2.5 V, VIL max 0.8 V), with an internal 800 kΩ resistor and pulse widths below 1 µs not reliably transmitted. |
| 3 | HIN3 | input | Phase 3 high-side logic input, compatible with 3.3 V or 5 V logic (VIH min 2.5 V, VIL max 0.8 V), with an internal 800 kΩ resistor and pulse widths below 1 µs not reliably transmitted. |
| 4 | LIN1 | input | Phase 1 low-side logic input, compatible with 3.3 V or 5 V logic (VIH min 2.5 V, VIL max 0.8 V), with an internal 800 kΩ resistor and pulse widths below 1 µs not reliably transmitted. |
| 5 | LIN2 | input | Phase 2 low-side logic input, compatible with 3.3 V or 5 V logic (VIH min 2.5 V, VIL max 0.8 V), with an internal 800 kΩ resistor and pulse widths below 1 µs not reliably transmitted. |
| 6 | LIN3 | input | Phase 3 low-side logic input, compatible with 3.3 V or 5 V logic (VIH min 2.5 V, VIL max 0.8 V), with an internal 800 kΩ resistor and pulse widths below 1 µs not reliably transmitted. |
| 7 | VCC | power_in | Low-side supply voltage, recommended 8 V to 20 V referenced to COM (absolute maximum −0.3 V to 25 V), with low-side UVLO thresholds of 6.6 V to 7.0 V. |
| 8 | COM | power_in | Ground reference for all supply, input and low-side output voltages, and the connection point for the thermal pad. |
| 9 | LO3 | output | Phase 3 low-side gate drive output referenced to COM, typically sourcing 1.5 A and sinking 1.8 A peak (pulse ≤10 µs). |
| 10 | LO2 | output | Phase 2 low-side gate drive output referenced to COM, typically sourcing 1.5 A and sinking 1.8 A peak (pulse ≤10 µs). |
| 11 | LO1 | output | Phase 1 low-side gate drive output referenced to COM, typically sourcing 1.5 A and sinking 1.8 A peak (pulse ≤10 µs). |
| 12 | VS3 | power_in | Phase 3 high-side floating ground (switch node), recommended −9 V to 250 V, tolerating a −9 V, 50 ns negative pulse and dV/dt up to 50 V/ns. |
| 13 | HO3 | output | Phase 3 high-side gate drive output referenced to VS3, typically sourcing 1.5 A and sinking 1.8 A peak (pulse ≤10 µs). |
| 14 | VB3 | power_in | Phase 3 high-side floating bootstrap supply, recommended VS + 8 V to VS + 20 V (absolute maximum 275 V relative to COM). |
| 15 | VS2 | power_in | Phase 2 high-side floating ground (switch node), recommended −9 V to 250 V, tolerating a −9 V, 50 ns negative pulse and dV/dt up to 50 V/ns. |
| 16 | HO2 | output | Phase 2 high-side gate drive output referenced to VS2, typically sourcing 1.5 A and sinking 1.8 A peak (pulse ≤10 µs). |
| 17 | VB2 | power_in | Phase 2 high-side floating bootstrap supply, recommended VS + 8 V to VS + 20 V (absolute maximum 275 V relative to COM). |
| 18 | VS1 | power_in | Phase 1 high-side floating ground (switch node), recommended −9 V to 250 V, tolerating a −9 V, 50 ns negative pulse and dV/dt up to 50 V/ns. |
| 19 | HO1 | output | Phase 1 high-side gate drive output referenced to VS1, typically sourcing 1.5 A and sinking 1.8 A peak (pulse ≤10 µs). |
| 20 | VB1 | power_in | Phase 1 high-side floating bootstrap supply, recommended VS + 8 V to VS + 20 V (absolute maximum 275 V relative to COM). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | JSMSEMI |
| Package | TSSOP-20 |
| Category | Motor Driver ICs |
| Pins | 20 |
CAD (KiCad official)
- Symbol:
JSM2134 - Footprint:
Package_SO:TSSOP-20_4.4x6.5mm_P0.65mm - 3D model: TSSOP-20 (KiCad packages3D, STEP)
- 3D model files:
jsm2134-etched.step/jsm2134-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);jsm2134.step/jsm2134.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: JSMSEMI datasheet (12 pp, sha256
73cad847c92b6d49, retrieved 2026-10-09, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).