component
JK-SMD075SF
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Shenzhen Jinkaisheng Elec Resettable Fuses, 0805. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
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JK-SMD075SF
Shenzhen Jinkaisheng Elec · Resettable Fuses · 0805
JK-SMD075SF from Shenzhen Jinkaisheng Elec, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen Jinkaisheng Elec |
| Package | 0805 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (Vmax) | Vmax | 6 | V dc | without damage at rated current (Imax) | 1 | ||
| Maximum fault current (Imax) | Imax | 40 | A | without damage at rated voltage (Vmax) | 1 | ||
| Minimum device resistance prior to tripping (Ri min) | Ri min | 0.09 | Ω | at 25°C | 1 | ||
| Maximum device resistance one hour post reflow (R1max) | R1max | 0.385 | Ω | measured one hour post reflow | 1 | ||
| Hold current (I hold) | I hold | 0.75 | A | 25°C still air; maximum current device will not trip | 1 | ||
| Trip current (I trip) | I trip | 1.5 | A | 25°C still air; minimum current at which device will always trip | 1 | ||
| Power dissipation in tripped state (Pd) | Pd | 0.6 | W | tripped state, 25°C still air, at rated voltage | 1 | ||
| Time to trip | 0.2 | Sec | at 8.0 A | 1 | |||
| Ambient operating temperature | -40 | 85 | °C | ambient operating conditions | 1 | ||
| Maximum surface temperature in tripped state | 125 | °C | device in tripped state | 1 | |||
| Resistance change, passive aging | -5 | 5 | % | +85°C, 1000 hrs; typical | 1 | ||
| Resistance change, humidity aging | -5 | 5 | % | +85°C, 85% R.H., 168 hours; typical | 1 | ||
| Resistance change, thermal shock | -33 | 33 | % | +85°C to -40°C, 20 times; typical | 1 | ||
| Recommended hold current at -40°C ambient | 1 | A | ambient temperature -40°C | 2 | |||
| Recommended hold current at -20°C ambient | 0.9 | A | ambient temperature -20°C | 2 | |||
| Recommended hold current at 0°C ambient | 0.79 | A | ambient temperature 0°C | 2 | |||
| Recommended hold current at 25°C ambient | 0.75 | A | ambient temperature 25°C | 2 | |||
| Recommended hold current at 40°C ambient | 0.63 | A | ambient temperature 40°C | 2 | |||
| Recommended hold current at 50°C ambient | 0.57 | A | ambient temperature 50°C | 2 | |||
| Recommended hold current at 60°C ambient | 0.53 | A | ambient temperature 60°C | 2 | |||
| Recommended hold current at 70°C ambient | 0.41 | A | ambient temperature 70°C | 2 | |||
| Recommended hold current at 85°C ambient | 0.34 | A | ambient temperature 85°C | 2 | |||
| Preheat temperature | Ts | 150 | 200 | ℃ | Pb-free assembly reflow profile, Ts min to Ts max | 3 | |
| Preheat time (Ts min to Ts max) | ts | 60 | 180 | seconds | Pb-free assembly reflow profile | 3 | |
| Time maintained above liquidus temperature (TL) | tL | 60 | 150 | seconds | above TL = 217℃, Pb-free assembly | 3 | |
| Peak temperature (Tp) | Tp | 260 | ℃ | Pb-free assembly reflow profile | 3 | ||
| Average ramp-up rate (Ts max to Tp) | 3 | ℃/second | Pb-free assembly; max | 3 | |||
| Ramp-down rate | 6 | ℃/second | Pb-free assembly; max | 3 | |||
| Time from 25℃ to peak temperature | 8 | minutes | Pb-free assembly; max | 3 | |||
| Storage temperature | 0 | 35 | ℃ | storage condition, ≤70%RH | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal pad materials：Tin-plated Nickel-Copper | 4 |
CAD (KiCad official)
- Symbol:
JK-SMD075SF - Footprint:
Fuse:Fuse_0805_2012Metric - 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files:
jk-smd075sf-etched.step/jk-smd075sf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);jk-smd075sf.step/jk-smd075sf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen Jinkaisheng Elec datasheet (6 pp, sha256
b906c8f2facbfd72, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# JK-SMD075SF
**Shenzhen Jinkaisheng Elec** · Resettable Fuses · 0805
JK-SMD075SF from Shenzhen Jinkaisheng Elec, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen Jinkaisheng Elec |
| Package | 0805 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (Vmax) | Vmax | | | 6 | V dc | without damage at rated current (Imax) | 1 |
| Maximum fault current (Imax) | Imax | | | 40 | A | without damage at rated voltage (Vmax) | 1 |
| Minimum device resistance prior to tripping (Ri min) | Ri min | 0.09 | | | Ω | at 25°C | 1 |
| Maximum device resistance one hour post reflow (R1max) | R1max | | | 0.385 | Ω | measured one hour post reflow | 1 |
| Hold current (I hold) | I hold | | | 0.75 | A | 25°C still air; maximum current device will not trip | 1 |
| Trip current (I trip) | I trip | 1.5 | | | A | 25°C still air; minimum current at which device will always trip | 1 |
| Power dissipation in tripped state (Pd) | Pd | | 0.6 | | W | tripped state, 25°C still air, at rated voltage | 1 |
| Time to trip | | | 0.2 | | Sec | at 8.0 A | 1 |
| Ambient operating temperature | | -40 | | 85 | °C | ambient operating conditions | 1 |
| Maximum surface temperature in tripped state | | | | 125 | °C | device in tripped state | 1 |
| Resistance change, passive aging | | -5 | | 5 | % | +85°C, 1000 hrs; typical | 1 |
| Resistance change, humidity aging | | -5 | | 5 | % | +85°C, 85% R.H., 168 hours; typical | 1 |
| Resistance change, thermal shock | | -33 | | 33 | % | +85°C to -40°C, 20 times; typical | 1 |
| Recommended hold current at -40°C ambient | | | 1 | | A | ambient temperature -40°C | 2 |
| Recommended hold current at -20°C ambient | | | 0.9 | | A | ambient temperature -20°C | 2 |
| Recommended hold current at 0°C ambient | | | 0.79 | | A | ambient temperature 0°C | 2 |
| Recommended hold current at 25°C ambient | | | 0.75 | | A | ambient temperature 25°C | 2 |
| Recommended hold current at 40°C ambient | | | 0.63 | | A | ambient temperature 40°C | 2 |
| Recommended hold current at 50°C ambient | | | 0.57 | | A | ambient temperature 50°C | 2 |
| Recommended hold current at 60°C ambient | | | 0.53 | | A | ambient temperature 60°C | 2 |
| Recommended hold current at 70°C ambient | | | 0.41 | | A | ambient temperature 70°C | 2 |
| Recommended hold current at 85°C ambient | | | 0.34 | | A | ambient temperature 85°C | 2 |
| Preheat temperature | Ts | 150 | | 200 | ℃ | Pb-free assembly reflow profile, Ts min to Ts max | 3 |
| Preheat time (Ts min to Ts max) | ts | 60 | | 180 | seconds | Pb-free assembly reflow profile | 3 |
| Time maintained above liquidus temperature (TL) | tL | 60 | | 150 | seconds | above TL = 217℃, Pb-free assembly | 3 |
| Peak temperature (Tp) | Tp | | 260 | | ℃ | Pb-free assembly reflow profile | 3 |
| Average ramp-up rate (Ts max to Tp) | | | | 3 | ℃/second | Pb-free assembly; max | 3 |
| Ramp-down rate | | | | 6 | ℃/second | Pb-free assembly; max | 3 |
| Time from 25℃ to peak temperature | | | | 8 | minutes | Pb-free assembly; max | 3 |
| Storage temperature | | 0 | | 35 | ℃ | storage condition, ≤70%RH | 3 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal pad materials：Tin-plated Nickel-Copper | 4 |
## CAD (KiCad official)
- Symbol: `JK-SMD075SF`
- Footprint: `Fuse:Fuse_0805_2012Metric`
- 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files: `jk-smd075sf-etched.step` / `jk-smd075sf-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `jk-smd075sf.step` / `jk-smd075sf.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Shenzhen Jinkaisheng Elec datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588903781476417536) (6 pp, sha256 `b906c8f2facbfd72`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/jk-smd075sf-datasheet.pdf)