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Contents

README

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JK-SMD0603-075L(6V)

Jinrui Electronic Materials Co · Resettable Fuses · 0603

JK-SMD0603-075L(6V) from Jinrui Electronic Materials Co, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive First terminal of the non-polarized PPTC (tin-plated nickel-copper); rated 6.0 V max, 0.75 A hold, 1.5 A trip, 50 A max fault current.
2 2 passive Second terminal of the non-polarized PPTC (tin-plated nickel-copper); rated 6.0 V max, 0.75 A hold, 1.5 A trip, 50 A max fault current.

Key specifications

Parameter Value
Manufacturer Jinrui Electronic Materials Co
Package 0603
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Maximum voltage (VMAX) VMAX 6 V Maximum continuous voltage the device can withstand without damage at rated current 2
Maximum fault current (IMAX) IMAX 50 A Maximum fault current at rated voltage (6.0 V) 2
Initial resistance (RiMIN) RiMIN 0.055 Ω In still air at 25℃, prior to tripping 2
Maximum device resistance (R1MAX) R1MAX 0.25 Ω Measured one hour post reflow 2
Maximum time to trip 1 Sec At 8.0 A time-to-trip current, Vmax, 25℃ still air 2
Operating temperature -40 85 ℃ Operating temperature range 1
Passive aging resistance change -10 10 % 85℃, 1000 hours; typical 3
Humidity aging resistance change -5 5 % 85℃/85%RH, 100 hours; typical 3
Thermal shock resistance change -30 % MIL-STD-202 Method 107G, +85℃/-40℃, 20 times; typical 3
Storage maximum ambient temperature 40 ℃ Storage; higher storage temperatures may deform packaging 6
Storage maximum relative humidity 70 %RH Recommended maximum relative humidity for storage 6
Reflow peak classification temperature (TP) TP 260 ℃ Pb-free reflow profile; time within 5℃ of peak 30 s max 4
Reflow average ramp up rate (TsMAX to Tp) 3 ℃/second Pb-free reflow profile 4
Reflow ramp down rate 3 ℃/second Pb-free reflow profile 4
Reflow time 25℃ to peak temperature 8 minutes Pb-free reflow profile 4
Reflow preheat temperature (TsMIN) TsMIN 150 ℃ Pb-free reflow preheat 4
Reflow preheat temperature (TsMAX) TsMAX 200 ℃ Pb-free reflow preheat; TsMIN to TsMAX 60-120 seconds 4
Reflow time above liquidus temperature (TL) TL 217 ℃ Time maintained above TL for 60-150 seconds 4
Hold current (IH) IH 0.75 A Maximum current at which the device will not interrupt, 25℃ still air 2
Trip current (IT) IT 1.5 A Minimum current at which the device goes from low to high resistance, 25℃ still air 2
Typical power dissipation (PD) PD 0.5 W Typical power dissipated in 25℃ still air 2
Time-to-trip current 8 A Specified current used for maximum time to trip, Vmax, 25℃ 2
Derated hold current at -40℃ ambient IH 0.99 A Maximum ambient operating temperature -40℃ 2
Derated hold current at -20℃ ambient IH 0.85 A Maximum ambient operating temperature -20℃ 2
Derated hold current at 0℃ ambient IH 0.79 A Maximum ambient operating temperature 0℃ 2
Derated hold current at 25℃ ambient IH 0.75 A Maximum ambient operating temperature 25℃ 2
Derated hold current at 40℃ ambient IH 0.61 A Maximum ambient operating temperature 40℃ 2
Derated hold current at 50℃ ambient IH 0.44 A Maximum ambient operating temperature 50℃ 2
Derated hold current at 60℃ ambient IH 0.3 A Maximum ambient operating temperature 60℃ 2
Derated hold current at 70℃ ambient IH 0.17 A Maximum ambient operating temperature 70℃ 2
Derated hold current at 85℃ ambient IH 0.07 A Maximum ambient operating temperature 85℃ 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper tin Terminal Materials Tin-Plated Nickle-copper 3

CAD (KiCad official)

  • Symbol: JK-SMD0603-075L(6V)
  • Footprint: Fuse:Fuse_0603_1608Metric
  • 3D model: 0603 (KiCad packages3D, STEP)
  • 3D model files: jk-smd0603-075l-6v-etched.step / jk-smd0603-075l-6v-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); jk-smd0603-075l-6v.step / jk-smd0603-075l-6v.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Jinrui Electronic Materials Co datasheet (6 pp, sha256 69ccb381ab433da9, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF