# JK-SMD-0805-200L

**Jinrui Electronic Materials Co** · Resettable Fuses · 0805

JK-SMD-0805-200L from Jinrui Electronic Materials Co, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised fuse; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised fuse; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Jinrui Electronic Materials Co |
| Package | 0805 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating temperature |  | -40 |  |  | ℃ |  | 1 |
| Operating temperature |  |  |  | 85 | ℃ |  | 1 |
| Maximum voltage | VMAX |  |  | 6 | V | At rated current | 2 |
| Maximum fault current | IMAX |  |  | 50 | A | At rated voltage | 2 |
| Trip current | IT | 4 |  |  | A | 25℃ still air | 2 |
| Maximum time-to-trip |  |  |  | 2 | Sec | At 10.0 A trip current, 25℃, VMAX | 2 |
| Passive aging resistance change |  | -10 |  | 10 | % | 85℃, 1000 hours | 4 |
| Humidity aging resistance change |  | -5 |  | 5 | % | 85℃/85%RH, 100 hours | 4 |
| Storage maximum ambient temperature |  |  |  | 40 | ℃ | Storage | 7 |
| Storage maximum relative humidity |  |  |  | 70 | % | Storage | 7 |
| Hold current | IH |  | 2 |  | A | 25℃ still air; 30 min, no trip | 2 |
| Thermal shock resistance change |  |  | -30 |  | % | MIL-STD-202 Method 107G, +85℃/-40℃, 20 times | 4 |
| Typical power dissipation | PD |  | 0.7 |  | W | 25℃ still air | 2 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | copper | tin | Terminal Materials Tin-Plated Nickle-copper | 4 |

## CAD (KiCad official)

- Symbol: `JK-SMD-0805-200L`
- Footprint: `Fuse:Fuse_0805_2012Metric`
- 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files: `jk-smd-0805-200l-etched.step` / `jk-smd-0805-200l-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `jk-smd-0805-200l.step` / `jk-smd-0805-200l.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Jinrui Electronic Materials Co datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8589039818013204480) (8 pp, sha256 `d39da45649722a68`, retrieved 2026-10-17, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/jk-smd-0805-200l-datasheet.pdf)