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Made with kicad-footprint-generator 10.0 · KiCad file format 20260206
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JK-mSMD300L-6

Jinrui Electronic Materials Co · Resettable Fuses · 1812

JK-mSMD300L-6 from Jinrui Electronic Materials Co, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer Jinrui Electronic Materials Co
Package 1812
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Initial resistance minimum (RiMIN) RiMIN 0.003 Ω In still air at 25℃ 2
Maximum device resistance (measured one hour post reflow) R1MAX 0.022 Ω 2
Maximum continuous voltage device can withstand without damage (rated voltage) VMAX 6 V 2
Maximum fault current device can withstand without damage (at rated voltage) IMAX 50 A 2
Hold current (maximum current at which device will not interrupt, 25℃ still air) IH 3 A 30min, at IH, 25℃ (holding current test: no trip) 4
Trip current (minimum current at which device switches to high resistance, 25℃ still air) IT 6 A 2
Maximum time to trip at assigned current (15.0 A column) 2 sec Specified current 15.0 A, VMAX, 25℃ 2
Typical power dissipation in 25℃ still air PD 1.5 W 2
Passive aging resistance change (typical) -10 10 % 85℃, 1000 hours 5
Humidity aging resistance change (typical) -5 5 % 85℃/85%RH, 100 hours 5
Thermal shock resistance change (typical) -30 % MIL-STD-202 Method 107G, +85℃/-40℃, 20 times 5
Operating temperature range -40 85 ℃ 1
Average ramp up rate (TsMAX to Tp), Pb-free reflow 3 ℃/second Pb-free assembly reflow profile 6
Peak/classification temperature (TP), Pb-free reflow TP 260 ℃ Pb-free assembly reflow profile 6
Time within 5℃ of actual peak temperature (TP), Pb-free reflow 30 seconds Pb-free assembly reflow profile 6
Time 25℃ to peak temperature, Pb-free reflow 8 minutes Pb-free assembly reflow profile 6
Ramp down rate, Pb-free reflow 3 ℃/second Pb-free assembly reflow profile 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts copper tin Terminal Materials Tin-Plated Nickle-copper 4

CAD (KiCad official)

  • Symbol: JK-mSMD300L-6
  • Footprint: Fuse:Fuse_1812_4532Metric
  • 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
  • 3D model files: jk-msmd300l-6-etched.step / jk-msmd300l-6-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); jk-msmd300l-6.step / jk-msmd300l-6.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Jinrui Electronic Materials Co datasheet (8 pp, sha256 e67a941ead1377dd, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF