component
JK-mSMD010SF
Public Made by Adomby adom
Shenzhen Jinkaisheng Elec Resettable Fuses, 1812. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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JK-mSMD010SF
Shenzhen Jinkaisheng Elec · Resettable Fuses · 1812
JK-mSMD010SF from Shenzhen Jinkaisheng Elec, in a 1812. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | First terminal pad (tin-plated Nickel-Copper) of the non-polarized PTC device, 0.10 A hold, 0.30 A trip, 30 V dc max, 100 A max fault current. |
| 2 | 2 | passive | Second terminal pad (tin-plated Nickel-Copper) of the non-polarized PTC device, 0.10 A hold, 0.30 A trip, 30 V dc max, 100 A max fault current. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen Jinkaisheng Elec |
| Package | 1812 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Maximum operating voltage (Vmax) | Vmax | 30 | V dc | Without damage at rated current (Imax) | 1 | ||
| Maximum fault current (Imax) | Imax | 100 | A | Without damage at rated voltage (Vmax) | 1 | ||
| Hold current (Ihold) | Ihold | 0.1 | A | 25°C still air; device will not trip | 1 | ||
| Trip current (Itrip) | Itrip | 0.3 | A | 25°C still air; device will always trip | 1 | ||
| Minimum resistance prior to tripping (Ri min) | Ri | 0.75 | Ω | 25°C, prior to tripping | 1 | ||
| Maximum resistance post reflow (R1max) | R1 | 15 | Ω | Measured one hour post reflow | 1 | ||
| Ambient operating temperature | Ta | -40 | 85 | °C | Ambient operating conditions | 1 | |
| Maximum surface temperature in tripped state | 125 | °C | Device in the tripped state | 1 | |||
| Passive aging resistance change | -5 | 5 | % | +85°C, 1000 hrs; printed as ±5% typical | 1 | ||
| Humidity aging resistance change | -5 | 5 | % | +85°C, 85% R.H., 168 hours; printed as ±5% typical | 1 | ||
| Thermal shock resistance change | -33 | 33 | % | +85°C to -40°C, 20 times; printed as ±33% typical | 1 | ||
| Time to trip | 1.5 | s | 1 | ||||
| Power dissipation in tripped state (Pd) | Pd | 0.8 | W | Tripped state, 25°C still air, at rated voltage | 1 | ||
| Recommended hold current at ambient -40°C | Ihold | 0.16 | A | Ambient -40°C (thermal derating chart, SMD1812-010SF) | 2 | ||
| Recommended hold current at ambient -20°C | Ihold | 0.14 | A | Ambient -20°C (thermal derating chart, SMD1812-010SF) | 2 | ||
| Recommended hold current at ambient 0°C | Ihold | 0.12 | A | Ambient 0°C (thermal derating chart, SMD1812-010SF) | 2 | ||
| Recommended hold current at ambient 25°C | Ihold | 0.1 | A | Ambient 25°C (thermal derating chart, SMD1812-010SF) | 2 | ||
| Recommended hold current at ambient 40°C | Ihold | 0.08 | A | Ambient 40°C (thermal derating chart, SMD1812-010SF) | 2 | ||
| Recommended hold current at ambient 50°C | Ihold | 0.07 | A | Ambient 50°C (thermal derating chart, SMD1812-010SF) | 2 | ||
| Recommended hold current at ambient 60°C | Ihold | 0.06 | A | Ambient 60°C (thermal derating chart, SMD1812-010SF) | 2 | ||
| Recommended hold current at ambient 70°C | Ihold | 0.05 | A | Ambient 70°C (thermal derating chart, SMD1812-010SF) | 2 | ||
| Recommended hold current at ambient 85°C | Ihold | 0.03 | A | Ambient 85°C (thermal derating chart, SMD1812-010SF) | 2 | ||
| Storage temperature | 0 | 35 | °C | Storage condition | 3 | ||
| Storage relative humidity | 70 | %RH | Storage condition | 3 | |||
| Peak reflow temperature (Tp) | Tp | 260 | °C | Pb-free assembly reflow profile peak | 3 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | Copper | tin | Terminal pad materials：Tin-plated Nickel-Copper | 4 |
CAD (KiCad official)
- Symbol:
JK-mSMD010SF - Footprint:
Fuse:Fuse_1812_4532Metric - 3D model: 1812, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 0.9 mm nominal 1806 height). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions are nominal, not the manufacturer's CAD (STEP)
- 3D model files:
jk-msmd010sf-etched.step/jk-msmd010sf-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);jk-msmd010sf.step/jk-msmd010sf.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen Jinkaisheng Elec datasheet (6 pp, sha256
1b2453224b329474, retrieved 2026-10-19, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).