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JFC0603-0750FS
Public Made by Adomby adom
Shenzhen JDT Fuse Disposable Fuses, 0603. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownJFC0603-0750FS
Shenzhen JDT Fuse · Disposable Fuses · 0603
JFC0603-0750FS from Shenzhen JDT Fuse, in a 0603. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Fuse terminal 1 (unpolarized end cap); 0.750 A rated, 32V DC rated voltage, 50A DC breaking capacity, interchangeable with terminal 2. |
| 2 | 2 | passive | Fuse terminal 2 (unpolarized end cap); 0.750 A rated, 32V DC rated voltage, 50A DC breaking capacity, interchangeable with terminal 1. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JDT Fuse |
| Package | 0603 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Operating temperature | -55 | °C | with proper correction factor applied | 3 | |||
| Operating temperature | 150 | °C | with proper correction factor applied | 3 | |||
| Opening (no-open) time | 4 | hour | at 1.0Ih (as printed) | 2 | |||
| Opening time | 5 | sec | at 2.5Ih (as printed) | 2 | |||
| Preheat temperature (Tsmin) | Tsmin | 150 | °C | IR reflow, lead-free profile | 4 | ||
| Preheat temperature (Tsmax) | Tsmax | 200 | °C | IR reflow, lead-free profile | 4 | ||
| Preheat and soak time (tS) | tS | 60 | 150 | Secs | Time from Tsmin to Tsmax, lead-free profile | 4 | |
| Average ramp-up rate (Tsmax to Tp) | 3 | °C/Secs | IR reflow, lead-free profile | 4 | |||
| Time above liquidus (tL) | tL | 60 | 120 | Secs | IR reflow, lead-free profile | 4 | |
| Peak package body temperature (TP) | TP | 260 | °C | IR reflow, lead-free profile | 4 | ||
| Average ramp-down rate (TP to Tsmax) | 6 | °C/Secs | IR reflow, lead-free profile | 4 | |||
| Time from 25°C to peak temperature | 8 | Minutes | IR reflow | 4 | |||
| Time in wave solder reservoir | 10 | Secs | Wave solder, reservoir at 260°C | 4 | |||
| Liquidus temperature (TL) | TL | 217 | °C | IR reflow, lead-free profile | 4 | ||
| Rated current | 0.75 | A | JFC0603-0750FS | 3 | |||
| Typical cold resistance | 470 | mΩ | measured at <10% of rated current, ambient 25°C | 3 | |||
| Typical voltage drop | 427 | mV | 3 | ||||
| Typical pre-arcing I2t | I2t | 0.009 | A2Sec | measured at 10In current | 3 | ||
| Breaking capacity (DC interrupting rating) | 50 | A | measured at rated voltage, time constant of less than 50 microseconds, battery source | 3 |
CAD (KiCad official)
- Symbol:
JFC0603-0750FS - Footprint:
Fuse:Fuse_0603_1608Metric - 3D model: 0603 (KiCad packages3D, STEP)
- 3D model files:
jfc0603-0750fs-etched.step/jfc0603-0750fs-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);jfc0603-0750fs.step/jfc0603-0750fs.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Shenzhen JDT Fuse datasheet (4 pp, sha256
51c33a5e4e1ad242, retrieved 2026-10-14, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).