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Contents

README

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JER2512F3R007

jieerrui · Current Sense Resistors / Shunt Resistors · 2512

JER2512F3R007 from jieerrui, in a 2512. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised resistor; either orientation.
2 2 passive Terminal 2 of an unpolarised resistor; either orientation.

Key specifications

Parameter Value
Manufacturer jieerrui
Package 2512
Category Resistors
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Resistance tolerance -1 1 % Tolerance letter F = ±1% per part-numbering table 1
Temperature coefficient of resistance TCR -50 50 ppm/°C 2mΩ-500mΩ range (2512); IEC60115-1 4.8, room temperature vs +125°C or +155°C 2
Rated power 3 W Rated power code 3 = 3W; 2512 maximum rated power 3W 2
Resistance range 0.5 500 mΩ 2512 resistance range (large/small electrode variants) 2
Insulation resistance 100 MΩ 2
Operating temperature range -55 170 °C 3
Short time overload resistance change ΔR -1 1 % 5.0 times rated power for 5 s, IEC60115-1 4.13 6
Temperature cycling resistance change ΔR -1 1 % JESD22 JA-104, -55°C/+125°C, 1000 cycles, measured 24±4 h after test 6
High temperature exposure resistance change ΔR -1 1 % MIL-STD-202 108, 125°C, 1000 h, measured 24±4 h after test 6
Low temperature operation resistance change ΔR -1 1 % IEC60115-1 4.23.4, -55°C, 45 min 6
Biased humidity resistance change ΔR -1 1 % MIL-STD-202 103, 85°C/85%RH, 1000 h, 10% of operating power, measured 24±4 h after test 6
Solderability terminal coverage 95 % J-STD-002B test B, 245±5°C dip for 2-3 s; new solder coverage of electrode (min 95% coverage) 6
Operational life resistance change ΔR -1 1 % MIL-STD-202 108, 70±2°C, rated current 1.5 h on / 0.5 h off, 1000 +48/-0 h 7
Vibration resistance change ΔR -1 1 % MIL-STD-202 204, 5g, 10-2000 Hz, 12 cycles, 20 min 7
Resistance to solder heat resistance change ΔR -1 1 % IEC60115-1 4.18, 260±5°C solder bath, 10±1 s 7
Terminal bending resistance change ΔR -1 1 % AEC-Q200-005, 2 mm deflection, 60 s 7
Mechanical shock resistance change ΔR -1 1 % MIL-STD-202 213, 100g, half sine, 6 ms 7
Terminal strength resistance change ΔR -1 1 % AEC-Q200-006, 17.7 N (1.8 kg) for 60±1 s 7
Thermal shock resistance change ΔR -1 1 % MIL-STD-202 107, -55/+125°C, 300 cycles, 15 min dwell 7
ESD resistance change ΔR -1 1 % AEC-Q200-002, 2 kV, 2 times, 1 s interval 7

CAD (KiCad official)

  • Symbol: JER2512F3R007
  • Footprint: Resistor_SMD:R_2512_6332Metric
  • 3D model: 2512 (KiCad packages3D, STEP)
  • 3D model files: jer2512f3r007-etched.step / jer2512f3r007-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); jer2512f3r007.step / jer2512f3r007.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: jieerrui datasheet (7 pp, sha256 6c0d359d39546b43, retrieved 2026-10-17, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF