# JED323-3.3V-LC

**Shenzhen JDT Fuse** · ESD And Surge Protection (TVS/ESD) · SOD-323

JED323-3.3V-LC from Shenzhen JDT Fuse, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Shenzhen JDT Fuse |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Reverse Working Voltage | VRWM |  |  | 3.3 | V | TA=25°C | 2 |
| Punch-Through Voltage | VPT | 3.5 |  |  | V | IT=2μA | 2 |
| Snap-Back Voltage | VBR | 2.8 |  |  | V | IR=50mA;TA=25°C | 2 |
| Reverse Leakage Current | IR |  |  | 0.2 | μA | VRWM=3.3V;TA=25°C | 2 |
| Clamping Voltage | VC |  |  | 5 | V | IPP=1A(8x20μs pulse) | 2 |
| Clamping Voltage | VC |  |  | 16 | V | IPP=21A(8x20μs pulse) | 2 |
| Junction Capacitance | CJ |  | 1 | 2 | pF | VR=0V,f=1 MHZ | 2 |
| Electrostatic Discharge Voltage, Contact | VESD | -30 |  | 30 | kV | IEC 61000-4-2;Contact Discharge | 2 |
| Electrostatic Discharge Voltage, Air | VESD | -30 |  | 30 | kV | IEC 61000-4-2;Air Discharge | 2 |
| Peak Pulse Power | PPk |  |  | 340 | W | tP=8/20μs | 2 |
| Peak Pulse Current | IPP |  |  | 21 | A | tP=8/20μs | 2 |
| Operating Temperature Range | TJ | -55 |  | 125 | °C |  | 2 |
| Storage Temperature Range | Tstg | -55 |  | 150 | °C |  | 2 |

## CAD (KiCad official)

- Symbol: `JED323-3.3V-LC`
- Footprint: `Diode_SMD:D_SOD-323`
- 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files: `jed323-3-3v-lc-etched.step` / `jed323-3-3v-lc-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `jed323-3-3v-lc.step` / `jed323-3-3v-lc.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Shenzhen JDT Fuse datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8590227556386570241) (5 pp, sha256 `d6d506f644c3086a`, retrieved 2026-10-22, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `cathode-band convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/jed323-3-3v-lc-datasheet.pdf)