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JEB05D3U

Public Made by Adom

by adom

Jiangsu JieJie Microelectronics ESD Protection Devices, SOD-323. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.

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JEB05D3U

Jiangsu JieJie Microelectronics · ESD Protection Devices · SOD-323

JEB05D3U from Jiangsu JieJie Microelectronics, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised fuse; either orientation.
2 2 passive Terminal 2 of an unpolarised fuse; either orientation.

Key specifications

Parameter Value
Manufacturer Jiangsu JieJie Microelectronics
Package SOD-323
Category TVS/Fuse/Board Level Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Peak pulse power dissipation PPP 2000 W 8/20μs waveform 2
ESD per IEC 61000-4-2 (Air) VESD -30 30 kV ESD per IEC 61000-4-2 (Air) 2
ESD per IEC 61000-4-2 (Contact) VESD -30 30 kV ESD per IEC 61000-4-2 (Contact) 2
Lead soldering temperature TL 260 ℃ 10 sec. 2
Operating junction temperature range TJ -55 125 ℃ 2
Storage temperature range TSTG -55 150 ℃ 2
Reverse breakdown voltage VBR 5.3 6.3 8 V IT=1mA 2
Reverse working voltage VRWM 5 V 2
Reverse leakage current IR 0.1 μA VRWM =5V 2
Peak pulse current IPP 135 A tP=8/20μs 2
Clamping voltage VC 12.5 16 V IPP=135A, tP =8/20μs 2
Junction capacitance CJ 400 450 pF VRWM=0V, f=1MHz 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing polyester cover tape is a multilayer film(heat activated adhesive in nature)primarily composed of polyester film, adhesive layer, 5

CAD (KiCad official)

  • Symbol: JEB05D3U
  • Footprint: Diode_SMD:D_SOD-323
  • 3D model: SOD-323 (KiCad packages3D, STEP)
  • 3D model files: jeb05d3u-etched.step / jeb05d3u-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); jeb05d3u.step / jeb05d3u.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Jiangsu JieJie Microelectronics datasheet (6 pp, sha256 a8ba54b25b95e9e9, retrieved 2026-10-28, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF