JEB03D5
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Jiangsu JieJie Microelectronics ESD Protection Devices, SOD-523. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
JEB03D5
Jiangsu JieJie Microelectronics · ESD Protection Devices · SOD-523
JEB03D5 from Jiangsu JieJie Microelectronics, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Jiangsu JieJie Microelectronics |
| Package | SOD-523 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | PPP | 80 | W | 8/20μs waveform | 2 | ||
| ESD per IEC 61000-4-2 (Air) | VESD | -30 | 30 | kV | IEC 61000-4-2 (Air) | 2 | |
| ESD per IEC 61000-4-2 (Contact) | VESD | -25 | 25 | kV | IEC 61000-4-2 (Contact) | 2 | |
| Lead soldering temperature | TL | 260 | ℃ | 10 sec. | 2 | ||
| Operating junction temperature range | TJ | -55 | 125 | ℃ | 2 | ||
| Storage temperature range | TSTG | -55 | 150 | ℃ | 2 | ||
| Clamping voltage | VC | 6 | 8 | V | IPP=1A, tP=8/20μs | 2 | |
| Clamping voltage | VC | 9 | 12 | V | IPP=7A, tP=8/20μs | 2 | |
| Junction capacitance | CJ | 15 | 20 | pF | VRWM=0V, f=1MHz | 2 | |
| Reverse working voltage | VRWM | 3.3 | V | 2 | |||
| Reverse breakdown voltage | VBR | 3.6 | V | IT=1mA | 2 | ||
| Reverse holding voltage | VH | 3.5 | V | IH=50mA | 2 | ||
| Reverse leakage current | IR | 1 | μA | VRWM=3.3V | 2 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | polyester | resin. The cover tape is a multilayer film(heat activated adhesive in nature)primarily composed of polyester film, | 5 |
CAD (KiCad official)
- Symbol:
JEB03D5 - Footprint:
Diode_SMD:D_SOD-523 - 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files:
jeb03d5-etched.step/jeb03d5-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);jeb03d5.step/jeb03d5.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Jiangsu JieJie Microelectronics datasheet (6 pp, sha256
30473b5cc3484889, retrieved 2026-11-02, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarytwo-terminal convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).
# JEB03D5
**Jiangsu JieJie Microelectronics** · ESD Protection Devices · SOD-523
JEB03D5 from Jiangsu JieJie Microelectronics, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
## Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised bidirectional ESD/TVS diode; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised bidirectional ESD/TVS diode; either orientation. |
## Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Jiangsu JieJie Microelectronics |
| Package | SOD-523 |
| Category | Circuit Protection |
| Pins | 2 |
## Electrical characteristics
Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Peak pulse power dissipation | PPP | | | 80 | W | 8/20μs waveform | 2 |
| ESD per IEC 61000-4-2 (Air) | VESD | -30 | | 30 | kV | IEC 61000-4-2 (Air) | 2 |
| ESD per IEC 61000-4-2 (Contact) | VESD | -25 | | 25 | kV | IEC 61000-4-2 (Contact) | 2 |
| Lead soldering temperature | TL | | | 260 | ℃ | 10 sec. | 2 |
| Operating junction temperature range | TJ | -55 | | 125 | ℃ | | 2 |
| Storage temperature range | TSTG | -55 | | 150 | ℃ | | 2 |
| Clamping voltage | VC | | 6 | 8 | V | IPP=1A, tP=8/20μs | 2 |
| Clamping voltage | VC | | 9 | 12 | V | IPP=7A, tP=8/20μs | 2 |
| Junction capacitance | CJ | | 15 | 20 | pF | VRWM=0V, f=1MHz | 2 |
| Reverse working voltage | VRWM | | 3.3 | | V | | 2 |
| Reverse breakdown voltage | VBR | | 3.6 | | V | IT=1mA | 2 |
| Reverse holding voltage | VH | | 3.5 | | V | IH=50mA | 2 |
| Reverse leakage current | IR | | 1 | | μA | VRWM=3.3V | 2 |
## Materials and finish
As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | polyester | | resin. The cover tape is a multilayer film(heat activated adhesive in nature)primarily composed of polyester film, | 5 |
## CAD (KiCad official)
- Symbol: `JEB03D5`
- Footprint: `Diode_SMD:D_SOD-523`
- 3D model: SOD-523 (KiCad packages3D, STEP)
- 3D model files: `jeb03d5-etched.step` / `jeb03d5-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `jeb03d5.step` / `jeb03d5.glb` are the bare package body.
## Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- **Datasheet:** [Jiangsu JieJie Microelectronics datasheet](docs/jeb03d5-datasheet.pdf) (6 pp, sha256 `30473b5cc3484889`, retrieved 2026-11-02, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).
[Datasheet PDF](docs/jeb03d5-datasheet.pdf)