component

IXFA12N50P

Public Made by Adom

by adom

IXYS MOSFETs, TO-263. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

componenttriode-mos tube-transistorixfa12n50pfactory-2.0.0extractor-text

Verified IXFA12N50P

by Ray · last 31 Oct 2026 · 1 record · files match
SymbolFootprint3D modelPins

Verification log 1 record

31 Oct 2026RayPublished by the parts factory: tier lcsc, 3 pinsfiles match
SymbolFootprint3D modelPinsfor all variants
  • ✓component-page-verify: PASS
  • ✓cad_props: Datasheet, MPN and distributor properties match page.json
  • ✓component: IXFA12N50P · TO-263 · 3 pins
  • ✓copper: 3 copper pads, none touching another net
  • ✓datasheet: all 3 pin names found in the 6-page datasheet
  • ✓distributor: lcsc C3281612, digikey IXFA12N50P-ND, mouser 747-IXFA12N50P
  • ✓family: TO-263-2
  • ✓files: 7 declared files present
  • ✓hero: docs/hero.png 4000x2500
  • ✓lbr: OK: /tmp/cpv-su32f00e/x.lbr is a valid EAGLE .lbr with complete deviceset
  • ✓license: CC-BY-SA-4.0
  • ✓models_3d: 2 records
  • •package_fit (skip): no component.package_dims on the page: the model is unchecked against the datasheet drawing
  • ✓pads: 3 pins = 3 pads
  • ✓pose: 2 STEP(s) Z-up, seated, centred
  • ✓symbol: 3 pins agree
  • ✓visibility: public, source open
Evidencedatasheet
Verified files✓ ixfa12n50p.kicad_sym✓ ixfa12n50p.kicad_mod✓ ixfa12n50p.step
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Generated by kicad-footprint-generator · KiCad file format 20260206
Name Last commit message Last updated
docs Publish 0.1.0 · Ray 7d ago
viewers ixfa12n50p: viewers · Ray 7d ago
ixfa12n50p-etched.glb Publish 0.1.0 · Ray 7d ago
ixfa12n50p-etched.step ixfa12n50p: factory component page (tier=lcsc) · Ray 7d ago
ixfa12n50p-hero.glb ixfa12n50p: hero GLB from the etched model (keeps the MPN mark) · Ray 7d ago
ixfa12n50p-hero.overlay.json Publish 0.1.0 · Ray 7d ago
ixfa12n50p.glb Publish 0.1.0 · Ray 7d ago
ixfa12n50p.kicad_mod Publish 0.1.0 · Ray 7d ago
ixfa12n50p.kicad_sym Publish 0.1.0 · Ray 7d ago
ixfa12n50p.lbr Publish 0.1.0 · Ray 7d ago
ixfa12n50p.step Publish 0.1.0 · Ray 7d ago
package.json Publish 0.1.0 · Ray 7d ago
page.json Set visibility: public · Ray 7d ago
README.md Publish 0.1.0 · Ray 7d ago
verification.json Verified: Published by the parts factory: tier lcsc, 3 pins · Ray 7d ago

IXFA12N50P

IXYS · MOSFETs · TO-263

IXFA12N50P from IXYS, in a TO-263. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limited to ±30 V continuous and ±40 V transient, with VGS(th) of 3.0 to 5.5 V at ID = 1 mA.
2 D passive Drain, also connected to the TAB; VDSS is 500 V and ID25 is 12 A at TC = 25°C.
3 S passive Source; continuous source current IS is 12 A (VGS = 0 V) with body diode VSD up to 1.5 V.

Key specifications

Parameter Value
Manufacturer IXYS
Package TO-263
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Voltage VDSS 500 V TJ = 25°C to 150°C 1
Drain-Gate Voltage VDGR 500 V TJ = 25°C to 150°C, RGS = 1MΩ 1
Gate-Source Voltage Continuous VGSS -30 30 V Continuous 1
Gate-Source Voltage Transient VGSM -40 40 V Transient 1
Drain Current ID25 12 A TC = 25°C 1
Pulsed Drain Current IDM 30 A TC = 25°C, pulse width limited by TJM 1
Avalanche Current IA 12 A TC = 25°C 1
Single Pulse Avalanche Energy EAS 600 mJ TC = 25°C 1
Peak Diode Recovery dV/dt dV/dt 20 V/ns IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C 1
Power Dissipation PD 200 W TC = 25°C 1
Junction Temperature TJ -55 150 °C 1
Maximum Junction Temperature TJM 150 °C 1
Storage Temperature Tstg -55 150 °C 1
Lead Temperature TL 300 °C 1.6mm (0.062) from case for 10s 1
Soldering Temperature TSOLD 260 °C Plastic body for 10s 1
Drain-Source Breakdown Voltage BVDSS 500 V VGS = 0V, ID = 250μA 1
Gate Threshold Voltage VGS(th) 3 5.5 V VDS = VGS, ID = 1mA 1
Gate Leakage Current IGSS -100 100 nA VGS = ±30V, VDS = 0V 1
Drain Leakage Current IDSS 5 μA VDS = VDSS, VGS = 0V 1
Drain Leakage Current at 125°C IDSS 250 μA VDS = VDSS, VGS = 0V, TJ = 125°C 1
Static Drain-Source On-Resistance RDS(on) 500 mΩ VGS = 10V, ID = 0.5 • ID25, Note 1 1
Transconductance gfs 7.5 13 S VDS = 20V, ID = 0.5 • ID25, Note 1 2
Thermal Resistance Junction to Case RthJC 0.62 °C/W 2
Case-to-Sink Thermal Resistance (TO-220) RthCS 0.5 °C/W TO-220 2
Source Current (Diode) IS 12 A VGS = 0V 2
Source Current Pulsed (Diode) ISM 48 A Repetitive, pulse width limited by TJM 2
Diode Forward Voltage VSD 1.5 V IF = IS, VGS = 0V, Note 1 2
Input Capacitance Ciss 1830 pF VGS = 0V, VDS = 25V, f = 1MHz 2
Output Capacitance Coss 182 pF VGS = 0V, VDS = 25V, f = 1MHz 2
Reverse Transfer Capacitance Crss 16 pF VGS = 0V, VDS = 25V, f = 1MHz 2
Turn-On Delay Time td(on) 22 ns Resistive switching, VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25, RG = 50Ω (External) 2
Rise Time tr 27 ns Resistive switching, VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25, RG = 50Ω (External) 2
Turn-Off Delay Time td(off) 65 ns Resistive switching, VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25, RG = 50Ω (External) 2
Fall Time tf 20 ns Resistive switching, VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25, RG = 50Ω (External) 2
Total Gate Charge Qg(on) 29 nC VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 2
Gate-Source Charge Qgs 11 nC VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 2
Gate-Drain Charge Qgd 10 nC VGS = 10V, VDS = 0.5 • VDSS, ID = 0.5 • ID25 2
Reverse Recovery Time trr 300 ns IF = 6A, -di/dt = 150A/μs, VR = 100V, VGS = 0V 2
Reverse Recovery Charge QRM 2.8 μC IF = 6A, -di/dt = 150A/μs, VR = 100V, VGS = 0V 2
Reverse Recovery Current IRM 18.2 A IF = 6A, -di/dt = 150A/μs, VR = 100V, VGS = 0V 2

CAD (KiCad official)

  • Symbol: IXFA12N50P
  • Footprint: Package_TO_SOT_SMD:TO-263-2
  • 3D model: TO-263 (KiCad packages3D, STEP)
  • 3D model files: ixfa12n50p-etched.step / ixfa12n50p-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixfa12n50p.step / ixfa12n50p.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: IXYS datasheet (6 pp, sha256 fdfa167dc8b74a2d, retrieved 2026-10-31, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF