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IXDN614SI

Public Made by Adom

by adom

Littelfuse IXYS Gate Drivers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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IXDN614SI

Littelfuse IXYS · Gate Drivers · SOIC-8

IXDN614SI from Littelfuse IXYS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage pin that powers the device, recommended range 4.5V to 35V (absolute maximum 40V).
2 IN input Logic input for the non-inverting driver, with threshold VIH min 3.0V and VIL max 0.8V (4.5V<VCC<18V), withstanding down to -5V.
3 NC unconnected Not connected.
4 GND power_in Ground, the common ground reference for the device.
5 GND power_in Ground, the common ground reference for the device.
6 OUT output Driver output that sources or sinks peak current up to 14A to turn on or off a discrete MOSFET or IGBT.
7 OUT output Driver output that sources or sinks peak current up to 14A to turn on or off a discrete MOSFET or IGBT.
8 VCC power_in Supply voltage pin that powers the device, recommended range 4.5V to 35V (absolute maximum 40V).

Key specifications

Parameter Value
Manufacturer Littelfuse IXYS
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage, High (TA=25°C) VIH 3 V 4.5V < VCC < 18V 4
Input Voltage, Low (TA=25°C) VIL 0.8 V 4.5V < VCC < 18V 4
Input Current (TA=25°C) IIN -10 10 µA 0V < VIN < VCC 4
Output Voltage, Low (TA=25°C) VOL 0.025 V 4
Output Resistance, High State (TA=25°C) ROH 0.4 0.8 Ω VCC=18V, IOUT=-100mA 4
Output Resistance, Low State (TA=25°C) ROL 0.3 0.6 Ω VCC=18V, IOUT=100mA 4
Output Current, Continuous (TA=25°C) IDC -4 4 A Limited by package power dissipation 4
Rise Time (TA=25°C) tR 25 35 ns CLOAD=15nF, VCC=18V 4
Fall Time (TA=25°C) tF 18 25 ns CLOAD=15nF, VCC=18V 4
On-Time Propagation Delay (TA=25°C) tONDELAY 50 70 ns CLOAD=15nF, VCC=18V 4
Off-Time Propagation Delay (TA=25°C) tOFFDELAY 50 70 ns CLOAD=15nF, VCC=18V 4
Power Supply Current, VIN=3.5V (TA=25°C) ICC 1 2 mA VCC=18V, VIN=3.5V 4
Power Supply Current, VIN=0V (TA=25°C) ICC 10 µA VCC=18V, VIN=0V 4
Power Supply Current, VIN=VCC (TA=25°C) ICC 10 µA VCC=18V, VIN=VCC 4
Input Voltage, High (TA=-40°C to +125°C) VIH 3.3 V 4.5V < VCC < 18V 5
Input Voltage, Low (TA=-40°C to +125°C) VIL 0.65 V 4.5V < VCC < 18V 5
Input Current (TA=-40°C to +125°C) IIN -10 10 µA 0V < VIN < VCC 5
Output Voltage, Low (TA=-40°C to +125°C) VOL 0.025 V 5
Output Resistance, High State (TA=-40°C to +125°C) ROH 1.5 Ω VCC=18V, IOUT=-100mA 5
Output Resistance, Low State (TA=-40°C to +125°C) ROL 1.2 Ω VCC=18V, IOUT=100mA 5
Output Current, Continuous (TA=-40°C to +125°C) IDC -1 1 A Limited by package power dissipation 5
Rise Time (TA=-40°C to +125°C) tR 50 ns CLOAD=15nF, VCC=18V 5
Fall Time (TA=-40°C to +125°C) tF 40 ns CLOAD=15nF, VCC=18V 5
On-Time Propagation Delay (TA=-40°C to +125°C) tONDELAY 90 ns CLOAD=15nF, VCC=18V 5
Off-Time Propagation Delay (TA=-40°C to +125°C) tOFFDELAY 90 ns CLOAD=15nF, VCC=18V 5
Power Supply Current, VIN=3.5V (TA=-40°C to +125°C) ICC 3 mA VCC=18V, VIN=3.5V 5
Power Supply Current, VIN=0V (TA=-40°C to +125°C) ICC 150 µA VCC=18V, VIN=0V 5
Power Supply Current, VIN=VCC (TA=-40°C to +125°C) ICC 150 µA VCC=18V, VIN=VCC 5
Supply Voltage (Recommended Operating) VCC 4.5 35 V 3
Operating Temperature Range TA -40 125 °C 3
Supply Voltage (Absolute Maximum) VCC -0.3 40 V 3
Input Voltage (Absolute Maximum) VIN, VEN -5 V 3
Output Current (Absolute Maximum) IOUT -14 14 A 3
Junction Temperature (Absolute Maximum) TJ -55 150 °C 3
Storage Temperature (Absolute Maximum) TSTG -65 150 °C 3
Thermal Impedance, Junction-to-Ambient (SI 8-Pin Power SOIC) JA 85 °C/W Package SI (8-Pin Power SOIC) 6
Thermal Impedance, Junction-to-Case (SI 8-Pin Power SOIC) JC 10 °C/W Package SI (8-Pin Power SOIC) 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod 11

CAD (KiCad official)

  • Symbol: IXDN614SI
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ixdn614si-etched.step / ixdn614si-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixdn614si.step / ixdn614si.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse IXYS datasheet (14 pp, sha256 d958e4f5eb8be9b4, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF