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IXDN609SIA

Public Made by Adom

by adom

Littelfuse IXYS MOSFETs, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

Also listed as IXDN609SIATR

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IXDN609SIA

Littelfuse IXYS · MOSFETs · SOIC-8

IXDN609SIA from Littelfuse IXYS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage pin that powers the device, recommended 4.5V to 35V (absolute maximum 40V).
2 IN input Logic input, CMOS compatible, withstands down to -5V and up to VCC+0.3V, with VIH min 3.0V and VIL max 0.8V at 25°C for 4.5V<VCC<18V.
3 NC unconnected Not connected internally on the IXDN609.
4 GND power_in Ground, common ground reference for the device.
5 GND power_in Ground, common ground reference for the device.
6 OUT output Output that sources or sinks up to 9A peak current to turn on or off a discrete MOSFET or IGBT (non-inverting, follows IN).
7 OUT output Output that sources or sinks up to 9A peak current to turn on or off a discrete MOSFET or IGBT (non-inverting, follows IN).
8 VCC power_in Supply voltage pin that powers the device, recommended 4.5V to 35V (absolute maximum 40V).

Key specifications

Parameter Value
Manufacturer Littelfuse IXYS
Package SOIC-8
Category Transistors/Thyristors
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 40 V 3
Input Voltage VIN, VEN -5 V 3
Output Current IOUT -9 9 A 3
Junction Temperature TJ -55 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Supply Voltage VCC 4.5 35 V 3
Operating Temperature Range TA -40 125 °C 3
Input Voltage, High VIH 3 V 4.5V < VCC < 18V, TA = 25°C 4
Input Voltage, Low VIL -0.8 V 4.5V < VCC < 18V, TA = 25°C 4
Input Current IIN -10 10 µA 0V < VIN < VCC, TA = 25°C 4
Output Voltage, Low VOL 0.025 V TA = 25°C 4
Output Resistance, High State ROH 0.6 1 Ω VCC=18V, IOUT=-100mA, TA = 25°C 4
Output Resistance, Low State ROL 0.4 0.8 Ω VCC=18V, IOUT=100mA, TA = 25°C 4
Output Current, Continuous IDC -2 2 A Limited by package power dissipation, TA = 25°C 4
Rise Time tr 22 35 ns VCC=18V, CLOAD=10nF, TA = 25°C 4
Fall Time tf 15 25 ns VCC=18V, CLOAD=10nF, TA = 25°C 4
On-Time Propagation Delay tondly 40 60 ns VCC=18V, CLOAD=10nF, TA = 25°C 4
Off-Time Propagation Delay toffdly 42 60 ns VCC=18V, CLOAD=10nF, TA = 25°C 4
Power Supply Current ICC 1 2 mA VCC=18V, VIN=3.5V, TA = 25°C 4
Power Supply Current ICC 10 µA VCC=18V, VIN=0V, TA = 25°C 4
Input Voltage, High VIH 3.3 V 4.5V < VCC < 18V, TA = -40°C to +125°C 4
Input Voltage, Low VIL 0.65 V 4.5V < VCC < 18V, TA = -40°C to +125°C 4
Output Resistance, High State ROH 2 Ω VCC=18V, IOUT=-100mA, TA = -40°C to +125°C 4
Output Resistance, Low State ROL 1.5 Ω VCC=18V, IOUT=100mA, TA = -40°C to +125°C 4
Output Current, Continuous IDC -1 1 A Limited by package power dissipation, TA = -40°C to +125°C 4
Rise Time tr 40 ns VCC=18V, CLOAD=10nF, TA = -40°C to +125°C 4
Fall Time tf 30 ns VCC=18V, CLOAD=10nF, TA = -40°C to +125°C 4
On-Time Propagation Delay tondly 75 ns VCC=18V, CLOAD=10nF, TA = -40°C to +125°C 4
Off-Time Propagation Delay toffdly 75 ns VCC=18V, CLOAD=10nF, TA = -40°C to +125°C 4
Power Supply Current ICC 2.5 mA VCC=18V, VIN=3.5V, TA = -40°C to +125°C 4
Power Supply Current ICC 150 µA VCC=18V, VIN=0V, TA = -40°C to +125°C 4
Thermal Impedance, Junction-to-Ambient (8-Pin SOIC, SIA) θJA 120 °C/W 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod 10

CAD (KiCad official)

  • Symbol: IXDN609SIA
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ixdn609sia-etched.step / ixdn609sia-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixdn609sia.step / ixdn609sia.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse IXYS datasheet (14 pp, sha256 f7a2276a0481ea78, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF