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IXDN609PI

Public Made by Adom

by adom

Littelfuse IXYS Gate Drivers, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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IXDN609PI

Littelfuse IXYS · Gate Drivers · DIP-8

IXDN609PI from Littelfuse IXYS, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage pin that powers the device; the datasheet specifies an operating range of 4.5 V to 35 V and an absolute maximum of 40 V.
2 IN input CMOS-compatible logic input that requires VIH of at least 3.0 V and VIL of at most 0.8 V for 4.5 V < VCC < 18 V, and withstands a negative swing of up to 5 V.
3 NC unconnected Not connected on the IXDN609 PI package; no internal function is assigned to this pin.
4 GND power_in Ground pin that provides the common ground reference for the device.
5 GND power_in Ground pin that provides the common ground reference for the device.
6 OUT output Driver output that sources or sinks current to turn a discrete MOSFET or IGBT on or off, with continuous output current limited by package power dissipation and peak current rated at 9 A.
7 OUT output Driver output that sources or sinks current to turn a discrete MOSFET or IGBT on or off, paralleled with pin 6 for the non-inverting output.
8 VCC power_in Supply voltage pin that powers the device; the datasheet specifies an operating range of 4.5 V to 35 V and an absolute maximum of 40 V.

Key specifications

Parameter Value
Manufacturer Littelfuse IXYS
Package DIP-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VCC -0.3 40 V 3
Output Current IOUT -9 9 A 3
Input Voltage VIN, VEN -5 V 3
Junction Temperature TJ -55 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Supply Voltage VCC 4.5 35 V 3
Operating Temperature Range TA -40 125 °C 3
Input Voltage, High [TA = 25°C] VIH 3 V 4.5V < VCC < 18V 4
Input Voltage, Low [TA = 25°C] VIL 0.8 V 4.5V < VCC < 18V 4
Input Current [TA = 25°C] IIN -10 10 µA 0V < VIN < VCC 4
Output Voltage, Low [TA = 25°C] VOL 0.025 V 4
Output Resistance, High State [TA = 25°C] ROH 0.6 1 Ω VCC=18V, IOUT=-100mA 4
Output Resistance, Low State [TA = 25°C] ROL 0.4 0.8 Ω VCC=18V, IOUT=100mA 4
Output Current, Continuous [TA = 25°C] IDC -2 2 A Limited by package power dissipation 4
Rise Time [TA = 25°C] tr 22 35 ns VCC=18V, CLOAD=10nF 4
Fall Time [TA = 25°C] tf 15 25 ns VCC=18V, CLOAD=10nF 4
On-Time Propagation Delay [TA = 25°C] tondly 40 60 ns VCC=18V, CLOAD=10nF 4
Off-Time Propagation Delay [TA = 25°C] toffdly 42 60 ns VCC=18V, CLOAD=10nF 4
Power Supply Current [TA = 25°C] ICC 1 2 mA VCC=18V, VIN=3.5V 4
Power Supply Current [TA = 25°C] ICC 10 µA VCC=18V, VIN=0V 4
Input Voltage, High [TA = -40°C to +125°C] VIH 3.3 V 4.5V < VCC < 18V 4
Input Voltage, Low [TA = -40°C to +125°C] VIL 0.65 V 4.5V < VCC < 18V 4
Input Current [TA = -40°C to +125°C] IIN -10 10 µA 0V < VIN < VCC 4
Output Voltage, Low [TA = -40°C to +125°C] VOL 0.025 V 4
Output Resistance, High State [TA = -40°C to +125°C] ROH 2 Ω VCC=18V, IOUT=-100mA 4
Output Resistance, Low State [TA = -40°C to +125°C] ROL 1.5 Ω VCC=18V, IOUT=100mA 4
Output Current, Continuous [TA = -40°C to +125°C] IDC -1 1 A Limited by package power dissipation 4
Rise Time [TA = -40°C to +125°C] tr 40 ns VCC=18V, CLOAD=10nF 4
Fall Time [TA = -40°C to +125°C] tf 30 ns VCC=18V, CLOAD=10nF 4
On-Time Propagation Delay [TA = -40°C to +125°C] tondly 75 ns VCC=18V, CLOAD=10nF 4
Off-Time Propagation Delay [TA = -40°C to +125°C] toffdly 75 ns VCC=18V, CLOAD=10nF 4
Power Supply Current [TA = -40°C to +125°C] ICC 2.5 mA VCC=18V, VIN=3.5V 4
Power Supply Current [TA = -40°C to +125°C] ICC 150 µA VCC=18V, VIN=0V 4
Thermal Impedance, Junction-to-Ambient (PI, 8-Pin DIP) JA 125 °C/W PI (8-Pin DIP) 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod 10

CAD (KiCad official)

  • Symbol: IXDN609PI
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: ixdn609pi-etched.step / ixdn609pi-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixdn609pi.step / ixdn609pi.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse IXYS datasheet (14 pp, sha256 f7a2276a0481ea78, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF