component
IXDN604SITR
Public Made by Adomby adom
IXYS Gate Drive ICs, SOIC-8-EP. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
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IXDN604SITR
IXYS · Gate Drive ICs · SOIC-8-EP
IXDN604SITR from IXYS, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No internal connection on the IXDN604 (pin 1 is NC in the pin configuration). |
| 2 | INA | input | Channel A logic input; VIH min 3.0V and VIL max 0.8V at 4.5V<VCC<18V, withstands -5V to VCC+0.3V. |
| 3 | GND | power_in | Ground, the common ground reference for the device. |
| 4 | INB | input | Channel B logic input; VIH min 3.0V and VIL max 0.8V at 4.5V<VCC<18V, withstands -5V to VCC+0.3V. |
| 5 | OUTB | output | Channel B output that sources or sinks up to 4A to turn a discrete MOSFET or IGBT on or off (non-inverting). |
| 6 | VCC | power_in | Supply voltage powering the device, recommended 4.5V to 35V (absolute maximum 40V). |
| 7 | OUTA | output | Channel A output that sources or sinks up to 4A to turn a discrete MOSFET or IGBT on or off (non-inverting). |
| 8 | NC | unconnected | No internal connection on the IXDN604 (pin 8 is NC in the pin configuration). |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | IXYS |
| Package | SOIC-8-EP |
| Category | Power Management ICs |
| Pins | 9 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage, High | VIH | 3 | V | 4.5V < VCC < 18V, TA=25°C | 4 | ||
| Input Voltage, Low | VIL | 0.8 | V | 4.5V < VCC < 18V, TA=25°C | 4 | ||
| Input Current | IIN | -10 | 10 | µA | 0V < VIN < VCC, TA=25°C | 4 | |
| Output Voltage, Low | VOL | 0.025 | V | TA=25°C | 4 | ||
| Output Resistance, High State | ROH | 1.3 | 2.5 | Ω | VCC=18V, IOUT=-10mA, TA=25°C | 4 | |
| Output Resistance, Low State | ROL | 1.1 | 2 | Ω | VCC=18V, IOUT=10mA, TA=25°C | 4 | |
| Output Current, Continuous | IDC | -1 | 1 | A | Limited by package power dissipation, TA=25°C | 4 | |
| Rise Time | tr | 9 | 16 | ns | VCC=18V, CLOAD=1000pF, TA=25°C | 4 | |
| Fall Time | tf | 8 | 14 | ns | VCC=18V, CLOAD=1000pF, TA=25°C | 4 | |
| On-Time Propagation Delay | tondly | 29 | 50 | ns | VCC=18V, CLOAD=1000pF, TA=25°C | 4 | |
| Off-Time Propagation Delay | toffdly | 35 | 50 | ns | VCC=18V, CLOAD=1000pF, TA=25°C | 4 | |
| Power Supply Current, VIN=3.5V | ICC | 1 | 3 | mA | VCC=18V, VIN=3.5V, TA=25°C | 4 | |
| Power Supply Current, VIN=0V | ICC | 10 | µA | VCC=18V, VIN=0V, TA=25°C | 4 | ||
| Power Supply Current, VIN=VCC | ICC | 10 | µA | VCC=18V, VIN=VCC, TA=25°C | 4 | ||
| Input Voltage, High (full temp) | VIH | 3.3 | V | 4.5V < VCC < 18V, -40°C < TA < +125°C | 4 | ||
| Input Voltage, Low (full temp) | VIL | 0.65 | V | 4.5V < VCC < 18V, -40°C < TA < +125°C | 4 | ||
| Input Current (full temp) | IIN | -10 | 10 | µA | 0V < VIN < VCC, -40°C < TA < +125°C | 4 | |
| Output Voltage, Low (full temp) | VOL | 0.025 | V | -40°C < TA < +125°C | 4 | ||
| Output Resistance, High State (full temp) | ROH | 3 | Ω | VCC=18V, IOUT=-10mA, -40°C < TA < +125°C | 4 | ||
| Output Resistance, Low State (full temp) | ROL | 2.5 | Ω | VCC=18V, IOUT=10mA, -40°C < TA < +125°C | 4 | ||
| Output Current, Continuous (full temp) | IDC | -1 | 1 | A | Limited by package power dissipation, -40°C < TA < +125°C | 4 | |
| Rise Time (full temp) | tr | 16 | ns | VCC=18V, CLOAD=1000pF, -40°C < TA < +125°C | 4 | ||
| Fall Time (full temp) | tf | 14 | ns | VCC=18V, CLOAD=1000pF, -40°C < TA < +125°C | 4 | ||
| On-Time Propagation Delay (full temp) | tondly | 65 | ns | VCC=18V, CLOAD=1000pF, -40°C < TA < +125°C | 4 | ||
| Off-Time Propagation Delay (full temp) | toffdly | 65 | ns | VCC=18V, CLOAD=1000pF, -40°C < TA < +125°C | 4 | ||
| Power Supply Current, VIN=3.5V (full temp) | ICC | 3.5 | mA | VCC=18V, VIN=3.5V, -40°C < TA < +125°C | 4 | ||
| Power Supply Current, VIN=0V (full temp) | ICC | 150 | µA | VCC=18V, VIN=0V, -40°C < TA < +125°C | 4 | ||
| Power Supply Current, VIN=VCC (full temp) | ICC | 150 | µA | VCC=18V, VIN=VCC, -40°C < TA < +125°C | 4 | ||
| Supply Voltage (abs max) | VCC | -0.3 | 40 | V | 25°C | 3 | |
| Input Voltage (abs max) | VINx, VENx | -5 | V | Max is VCC+0.3 | 3 | ||
| Output Current (abs max) | IOUT | 4 | A | printed ±4 | 3 | ||
| Output Pulsed Current (abs max) | Iout_pulsed | 5 | A | 0.5µs, printed ±5 | 3 | ||
| Junction Temperature | TJ | -55 | 150 | °C | 3 | ||
| Storage Temperature | TSTG | -65 | 150 | °C | 3 | ||
| Supply Voltage (recommended) | VCC | 4.5 | 35 | V | 3 | ||
| Operating Temperature Range | TA | -40 | 125 | °C | 3 | ||
| Thermal Resistance, Junction-to-Ambient | θJA | 85 | °C/W | SI (8-Pin Power SOIC) | 5 | ||
| Thermal Resistance, Junction-to-Case | θJC | 10 | °C/W | SI (8-Pin Power SOIC) | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod | 10 |
CAD (KiCad official)
- Symbol:
IXDN604SITR - Footprint:
Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm - 3D model: SOIC-8-EP (KiCad packages3D, STEP)
- 3D model files:
ixdn604sitr-etched.step/ixdn604sitr-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ixdn604sitr.step/ixdn604sitr.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: IXYS datasheet (13 pp, sha256
25fcf3039d3740fc, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).