# IXDN604SIATR

**Littelfuse IXYS** · Gate Drivers · SOIC-8

IXDN604SIATR from Littelfuse IXYS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connect on the IXDN604 SIA package; the pin has no internal function. |
| 2 | INA | input | Channel A logic input (non-inverting), rated -5V to VCC+0.3V with VIH min 3.0V and VIL max 0.8V at 25°C. |
| 3 | GND | power_in | Ground, the common ground reference for the device. |
| 4 | INB | input | Channel B logic input (non-inverting), rated -5V to VCC+0.3V with VIH min 3.0V and VIL max 0.8V at 25°C. |
| 5 | OUTB | output | Channel B output that sources or sinks up to 4A to turn a discrete MOSFET or IGBT on or off (±1A continuous). |
| 6 | VCC | power_in | Supply voltage that powers the device, recommended 4.5V to 35V (absolute maximum 40V). |
| 7 | OUTA | output | Channel A output that sources or sinks up to 4A to turn a discrete MOSFET or IGBT on or off (±1A continuous). |
| 8 | NC | unconnected | No connect on the IXDN604 SIA package; the pin has no internal function. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | Littelfuse IXYS |
| Package | SOIC-8 |
| Category | Motor Driver ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage, High | VIH | 3 |  |  | V | 4.5V < VCC < 18V (TA = 25°C table) | 4 |
| Input Voltage, Low | VIL |  |  | -0.8 | V | 4.5V < VCC < 18V (TA = 25°C table) | 4 |
| Input Current | IIN | -10 |  | 10 | µA | 0V < VIN < VCC (TA = 25°C table) | 4 |
| Output Voltage, Low | VOL |  |  | 0.025 | V |  | 4 |
| Output Resistance, High State | ROH |  | 1.3 | 2.5 | Ω | VCC=18V, IOUT=-10mA (TA = 25°C table) | 4 |
| Output Resistance, Low State | ROL |  | 1.1 | 2 | Ω | VCC=18V, IOUT=10mA (TA = 25°C table) | 4 |
| Output Current, Continuous | IDC | -1 |  | 1 | A | Limited by package power dissipation | 4 |
| Rise Time | tr |  | 9 | 16 | ns | VCC=18V, CLOAD=1000pF (TA = 25°C table) | 4 |
| Fall Time | tf |  | 8 | 14 | ns | VCC=18V, CLOAD=1000pF (TA = 25°C table) | 4 |
| On-Time Propagation Delay | tondly |  | 29 | 50 | ns | VCC=18V, CLOAD=1000pF (TA = 25°C table) | 4 |
| Off-Time Propagation Delay | toffdly |  | 35 | 50 | ns | VCC=18V, CLOAD=1000pF (TA = 25°C table) | 4 |
| Power Supply Current | ICC |  | 1 | 3 | mA | VCC=18V, VIN=3.5V (TA = 25°C table) | 4 |
| Power Supply Current | ICC |  |  | 10 | µA | VCC=18V, VIN=0V (TA = 25°C table) | 4 |
| Input Voltage, High | VIH | 3.3 |  |  | V | 4.5V < VCC < 18V (-40°C to +125°C table) | 4 |
| Input Voltage, Low | VIL |  |  | 0.65 | V | 4.5V < VCC < 18V (-40°C to +125°C table) | 4 |
| Output Resistance, High State | ROH |  |  | 3 | Ω | VCC=18V, IOUT=-10mA (-40°C to +125°C table) | 4 |
| Output Resistance, Low State | ROL |  |  | 2.5 | Ω | VCC=18V, IOUT=10mA (-40°C to +125°C table) | 4 |
| Rise Time | tr |  |  | 16 | ns | VCC=18V, CLOAD=1000pF (-40°C to +125°C table) | 4 |
| Fall Time | tf |  |  | 14 | ns | VCC=18V, CLOAD=1000pF (-40°C to +125°C table) | 4 |
| On-Time Propagation Delay | tondly |  |  | 65 | ns | VCC=18V, CLOAD=1000pF (-40°C to +125°C table) | 4 |
| Off-Time Propagation Delay | toffdly |  |  | 65 | ns | VCC=18V, CLOAD=1000pF (-40°C to +125°C table) | 4 |
| Power Supply Current | ICC |  |  | 3.5 | mA | VCC=18V, VIN=3.5V (-40°C to +125°C table) | 4 |
| Power Supply Current | ICC |  |  | 150 | µA | VCC=18V, VIN=0V (-40°C to +125°C table) | 4 |
| Supply Voltage | VCC | 4.5 |  | 35 | V |  | 3 |
| Operating Temperature Range | TA | -40 |  | 125 | °C |  | 3 |
| Supply Voltage | VCC | -0.3 |  | 40 | V |  | 3 |
| Input Voltage | VINx, VENx | -5 |  |  | V |  | 3 |
| Output Current | IOUT | -4 |  | 4 | A |  | 3 |
| Output Pulsed Current | Iout_pulsed | -5 |  | 5 | A | 0.5s | 3 |
| Junction Temperature | TJ | -55 |  | 150 | °C |  | 3 |
| Storage Temperature | TSTG | -65 |  | 150 | °C |  | 3 |
| Thermal Resistance, Junction-to-Ambient (SIA 8-Pin SOIC) | θJA |  | 120 |  | °C/W | SIA (8-Pin SOIC) package | 5 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC |  | Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod | 10 |

## CAD (KiCad official)

- Symbol: `IXDN604SIATR`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `ixdn604siatr-etched.step` / `ixdn604siatr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ixdn604siatr.step` / `ixdn604siatr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [Littelfuse IXYS datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588911225899503616) (13 pp, sha256 `25fcf3039d3740fc`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ixdn604siatr-datasheet.pdf)