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IXDN604PI
Public Made by Adomby adom
IXYS Pre-ordered Chips, DIP-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownIXDN604PI
IXYS · Pre-ordered Chips · DIP-8
IXDN604PI from IXYS, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No-connect pin on the IXDN604PI, shown in the pin configuration but not described in the pin definitions table. |
| 2 | INA | input | Channel A logic input, with VIH min 3.0V and VIL max 0.8V at 25°C and an input voltage range of -5V to VCC+0.3V. |
| 3 | GND | power_in | Ground, the common ground reference for the device. |
| 4 | INB | input | Channel B logic input, with VIH min 3.0V and VIL max 0.8V at 25°C and an input voltage range of -5V to VCC+0.3V. |
| 5 | OUTB | output | Channel B output that sources or sinks current (up to 4A) to turn a discrete MOSFET or IGBT on or off. |
| 6 | VCC | power_in | Supply voltage that powers the device, recommended 4.5V to 35V with an absolute maximum of 40V. |
| 7 | OUTA | output | Channel A output that sources or sinks current (up to 4A) to turn a discrete MOSFET or IGBT on or off. |
| 8 | NC | unconnected | No-connect pin on the IXDN604PI, shown in the pin configuration but not described in the pin definitions table. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | IXYS |
| Package | DIP-8 |
| Category | Interface ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | -0.3 | 40 | V | 3 | ||
| Output Current | IOUT | -4 | 4 | A | 3 | ||
| Output Pulsed Current (0.5s) | Iout_pulsed | -5 | 5 | A | 0.5s | 3 | |
| Junction Temperature | TJ | -55 | 150 | °C | 3 | ||
| Storage Temperature | TSTG | -65 | 150 | °C | 3 | ||
| Input Voltage | VINx, VENx | -5 | V | VCC+0.3 maximum as printed | 3 | ||
| Supply Voltage | VCC | 4.5 | 35 | V | 3 | ||
| Operating Temperature Range | TA | -40 | 125 | °C | 3 | ||
| Input Voltage, High (25°C) | VIH | 3 | V | 4.5V < VCC < 18V | 4 | ||
| Input Voltage, Low (25°C) | VIL | -0.8 | V | 4.5V < VCC < 18V | 4 | ||
| Input Current (25°C) | IIN | -10 | 10 | µA | 0V < VIN < VCC | 4 | |
| Output Voltage, Low (25°C) | VOL | 0.025 | V | 4 | |||
| Output Resistance, High State (25°C) | ROH | 1.3 | 2.5 | Ω | VCC=18V, IOUT=-10mA | 4 | |
| Output Resistance, Low State (25°C) | ROL | 1.1 | 2 | Ω | VCC=18V, IOUT=10mA | 4 | |
| Output Current, Continuous (25°C) | IDC | -1 | 1 | A | Limited by package power dissipation | 4 | |
| Rise Time (25°C) | tr | 9 | 16 | ns | VCC=18V, CLOAD=1000pF | 4 | |
| Fall Time (25°C) | tf | 8 | 14 | ns | VCC=18V, CLOAD=1000pF | 4 | |
| On-Time Propagation Delay (25°C) | tondly | 29 | 50 | ns | VCC=18V, CLOAD=1000pF | 4 | |
| Off-Time Propagation Delay (25°C) | toffdly | 35 | 50 | ns | VCC=18V, CLOAD=1000pF | 4 | |
| Power Supply Current (25°C), VIN=3.5V | ICC | 1 | 3 | mA | VCC=18V, VIN=3.5V | 4 | |
| Power Supply Current (25°C), VIN=0V | ICC | 10 | µA | VCC=18V, VIN=0V | 4 | ||
| Power Supply Current (25°C), VIN=VCC | ICC | 10 | µA | VCC=18V, VIN=VCC | 4 | ||
| Input Voltage, High (-40°C to +125°C) | VIH | 3.3 | V | 4.5V < VCC < 18V | 4 | ||
| Input Voltage, Low (-40°C to +125°C) | VIL | -0.65 | V | 4.5V < VCC < 18V | 4 | ||
| Input Current (-40°C to +125°C) | IIN | -10 | 10 | µA | 0V < VIN < VCC | 4 | |
| Output Voltage, Low (-40°C to +125°C) | VOL | 0.025 | V | 4 | |||
| Output Resistance, High State (-40°C to +125°C) | ROH | 3 | Ω | VCC=18V, IOUT=-10mA | 4 | ||
| Output Resistance, Low State (-40°C to +125°C) | ROL | 2.5 | Ω | VCC=18V, IOUT=10mA | 4 | ||
| Output Current, Continuous (-40°C to +125°C) | IDC | -1 | 1 | A | Limited by package power dissipation | 4 | |
| Rise Time (-40°C to +125°C) | tr | 16 | ns | VCC=18V, CLOAD=1000pF | 4 | ||
| Fall Time (-40°C to +125°C) | tf | 14 | ns | VCC=18V, CLOAD=1000pF | 4 | ||
| On-Time Propagation Delay (-40°C to +125°C) | tondly | 65 | ns | VCC=18V, CLOAD=1000pF | 4 | ||
| Off-Time Propagation Delay (-40°C to +125°C) | toffdly | 65 | ns | VCC=18V, CLOAD=1000pF | 4 | ||
| Power Supply Current (-40°C to +125°C), VIN=3.5V | ICC | 3.5 | mA | VCC=18V, VIN=3.5V | 4 | ||
| Power Supply Current (-40°C to +125°C), VIN=0V | ICC | 150 | µA | VCC=18V, VIN=0V | 4 | ||
| Power Supply Current (-40°C to +125°C), VIN=VCC | ICC | 150 | µA | VCC=18V, VIN=VCC | 4 | ||
| Thermal Resistance, Junction-to-Ambient (PI, 8-Pin DIP) | JA | 125 | °C/W | PI (8-Pin DIP) package | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod | 10 |
CAD (KiCad official)
- Symbol:
IXDN604PI - Footprint:
Package_DIP:DIP-8_W7.62mm - 3D model: DIP-8 (KiCad packages3D, STEP)
- 3D model files:
ixdn604pi-etched.step/ixdn604pi-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ixdn604pi.step/ixdn604pi.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: IXYS datasheet (13 pp, sha256
25fcf3039d3740fc, retrieved 2026-11-02, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).