component
IXDN602SIA
Public Made by Adomby adom
Littelfuse IXYS Gate Drivers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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Contents
README
markdownIXDN602SIA
Littelfuse IXYS · Gate Drivers · SOIC-8
IXDN602SIA from Littelfuse IXYS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No connection. |
| 2 | INA | input | Channel A logic input, CMOS compatible, VIH min 3.0V and VIL max 0.8V for 4.5V<VCC<18V, withstands negative swing of up to 5V. |
| 3 | GND | power_in | Ground, common ground reference for the device. |
| 4 | INB | input | Channel B logic input, CMOS compatible, VIH min 3.0V and VIL max 0.8V for 4.5V<VCC<18V, withstands negative swing of up to 5V. |
| 5 | OUTB | output | Channel B non-inverting output that sources or sinks up to 2A peak (1A continuous) to turn a discrete MOSFET or IGBT on or off. |
| 6 | VCC | power_in | Supply voltage powering the device, recommended 4.5V to 35V (absolute maximum 40V). |
| 7 | OUTA | output | Channel A non-inverting output that sources or sinks up to 2A peak (1A continuous) to turn a discrete MOSFET or IGBT on or off. |
| 8 | NC | unconnected | No connection. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Littelfuse IXYS |
| Package | SOIC-8 |
| Category | Motor Driver ICs |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | 4.5 | 35 | V | 3 | ||
| Operating Temperature Range | TA | -40 | 125 | °C | 3 | ||
| Supply Voltage | VCC | -0.3 | 40 | V | 3 | ||
| Input Voltage | VIN | -5 | V | 3 | |||
| Output Current | IOUT | -2 | 2 | A | 3 | ||
| Junction Temperature | TJ | -55 | 150 | °C | 3 | ||
| Storage Temperature | TSTG | -65 | 150 | °C | 3 | ||
| Input Voltage, High | VIH | 3 | V | TA = 25°C; 4.5V < VCC < 18V | 4 | ||
| Input Voltage, Low | VIL | 0.8 | V | TA = 25°C; 4.5V < VCC < 18V | 4 | ||
| Input Current | IIN | -10 | 10 | A | TA = 25°C; 0V < VIN < VCC | 4 | |
| Output Voltage, Low | VOL | 0.025 | V | TA = 25°C | 4 | ||
| Output Resistance, High State | ROH | 2.5 | 4 | Ω | TA = 25°C; VCC=18V, IOUT=-10mA | 4 | |
| Output Resistance, Low State | ROL | 1.5 | 3 | Ω | TA = 25°C; VCC=18V, IOUT=10mA | 4 | |
| Output Current, Continuous | IDC | -1 | 1 | A | TA = 25°C; Limited by package power dissipation | 4 | |
| Rise Time | tr | 7.5 | 15 | ns | TA = 25°C; VCC=18V, CLOAD=1000pF | 4 | |
| Fall Time | tf | 6.5 | 15 | ns | TA = 25°C; VCC=18V, CLOAD=1000pF | 4 | |
| On-Time Propagation Delay | tondly | 35 | 60 | ns | TA = 25°C; VCC=18V, CLOAD=1000pF | 4 | |
| Off-Time Propagation Delay | toffdly | 38 | 60 | ns | TA = 25°C; VCC=18V, CLOAD=1000pF | 4 | |
| Power Supply Current | ICC | 1 | 3 | mA | TA = 25°C; VCC=18V, VIN=3.5V | 4 | |
| Power Supply Current | ICC | 10 | A | TA = 25°C; VCC=18V, VIN=0V | 4 | ||
| Input Voltage, High | VIH | 3.3 | V | TA = -40°C to +125°C; 4.5V < VCC < 18V | 4 | ||
| Input Voltage, Low | VIL | 0.65 | V | TA = -40°C to +125°C; 4.5V < VCC < 18V | 4 | ||
| Output Resistance, High State | ROH | 6 | Ω | TA = -40°C to +125°C; VCC=18V, IOUT=-10mA | 4 | ||
| Output Resistance, Low State | ROL | 5 | Ω | TA = -40°C to +125°C; VCC=18V, IOUT=10mA | 4 | ||
| Rise Time | tr | 18 | ns | TA = -40°C to +125°C; VCC=18V, CLOAD=1000pF | 4 | ||
| Fall Time | tf | 18 | ns | TA = -40°C to +125°C; VCC=18V, CLOAD=1000pF | 4 | ||
| On-Time Propagation Delay | tondly | 75 | ns | TA = -40°C to +125°C; VCC=18V, CLOAD=1000pF | 4 | ||
| Off-Time Propagation Delay | toffdly | 75 | ns | TA = -40°C to +125°C; VCC=18V, CLOAD=1000pF | 4 | ||
| Power Supply Current | ICC | 3.5 | mA | TA = -40°C to +125°C; VCC=18V, VIN=3.5V | 4 | ||
| Power Supply Current | ICC | 150 | A | TA = -40°C to +125°C; VCC=18V, VIN=0V | 4 | ||
| Thermal Resistance, Junction-to-Ambient | θJA | 120 | °C/W | IXD_602SIA (8-Pin SOIC) | 5 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC | Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time | 10 |
CAD (KiCad official)
- Symbol:
IXDN602SIA - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
ixdn602sia-etched.step/ixdn602sia-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);ixdn602sia.step/ixdn602sia.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Littelfuse IXYS datasheet (13 pp, sha256
f4ccbeeeae296e60, retrieved 2026-10-18, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).