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IXDI630YI

IXYS · Pre-ordered Chips · TO-263-5

IXDI630YI from IXYS, in a TO-263-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage provides power to the device, with absolute maximum 40 V and recommended operation from UVLO to 35 V.
2 IN input Logic input withstands a negative swing of up to -5 V, with VIH minimum 3.5 V and VIL maximum 0.8 V.
3 GND power_in Ground is the common ground reference for the device.
4 OUT output Inverted output sources or sinks up to 30 A peak current to turn a discrete MOSFET or IGBT on or off.
5 NC unconnected Not connected.
6 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer IXYS
Package TO-263-5
Category Interface ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage, High VIH 3.5 V UVLO < VCC < 18V 4
Input Voltage, Low VIL 0.8 V UVLO < VCC < 18V 4
Input Current IIN -10 10 A 0V < VIN < VCC 4
Output Voltage, Low VOL 0.025 V - 4
Output Resistance, High State ROH 0.17 0.4 Ω VCC=18V, IOUT= -100mA 4
Output Resistance, Low State ROL 0.16 0.3 Ω VCC=18V, IOUT=100mA 4
Output Current, Continuous IDC -8 8 A Limited by package power dissipation 4
Rise Time tr 11 20 ns CLOAD=5.6nF, VCC=18V 4
Fall Time tf 11 18 ns CLOAD=5.6nF, VCC=18V 4
On-Time Propagation Delay tondly 46 65 ns CLOAD=5.6nF, VCC=18V 4
Off-Time Propagation Delay toffdly 46 65 ns CLOAD=5.6nF, VCC=18V 4
Power Supply Current ICC 2.5 4 mA VCC=18V, VIN=3.5V 4
Power Supply Current ICC 0.75 mA VCC=18V, VIN=0V 4
Under-Voltage Lockout Threshold, VCC Rising, IXD_630 UVLO 10 12.5 13.5 V VCC Rising, IXD_630 4
Input Voltage, High VIH 4 V UVLO < VCC < 18V 5
Input Voltage, Low VIL 0.8 V UVLO < VCC < 18V 5
Output Resistance, High State ROH 0.6 Ω VCC=18V, IOUT= -100mA 5
Output Resistance, Low State ROL 0.45 Ω VCC=18V, IOUT=100mA 5
Rise Time tr 35 ns CLOAD=5.6nF, VCC=18V 5
Fall Time tf 35 ns CLOAD=5.6nF, VCC=18V 5
On-Time Propagation Delay tondly 100 ns CLOAD=5.6nF, VCC=18V 5
Off-Time Propagation Delay toffdly 100 ns CLOAD=5.6nF, VCC=18V 5
Supply Voltage VCC -0.3 40 V 3
Input Voltage Range VIN, VEN -5 V Maximum VCC+0.3 V 3
Output Current IOUT -30 30 A 3
Junction Temperature TJ -55 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Supply Voltage (recommended) VCC 35 V UVLO to 35 V 4
Operating Temperature Range TA -40 125 °C 4
Thermal Impedance, Junction-to-Ambient (5-Lead TO-263) JA 46 °C/W IXD_630YI (5-Lead TO-263) 5
Thermal Impedance, Junction-to-Case (5-Lead TO-263) JC 2 °C/W IXD_630YI (5-Lead TO-263) 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod 10

CAD (KiCad official)

  • Symbol: IXDI630YI
  • Footprint: Package_TO_SOT_SMD:TO-263-5_TabPin6
  • 3D model: TO-263-5 (KiCad packages3D, STEP)
  • 3D model files: ixdi630yi-etched.step / ixdi630yi-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixdi630yi.step / ixdi630yi.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: IXYS datasheet (12 pp, sha256 cee013af6c2f43a5, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF