# IXDI609SIATR

**IXYS** · Pre-ordered Chips · SOIC-8

IXDI609SIATR from IXYS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Supply voltage pin that powers the device, recommended 4.5V to 35V (absolute maximum 40V). |
| 2 | IN | input | Logic input (CMOS compatible); IXDI609 is inverting, so IN high drives OUT low, and the input withstands -5V to VCC+0.3V. |
| 3 | NC | unconnected | Not connected internally on the IXDI609 (this pin is EN only on the IXDD609). |
| 4 | GND | power_in | Ground, common ground reference for the device. |
| 5 | GND | power_in | Ground, common ground reference for the device. |
| 6 | OUT | output | Output that sources or sinks up to 9A peak (2A continuous at 25°C) to turn a discrete MOSFET or IGBT on or off. |
| 7 | OUT | output | Output that sources or sinks up to 9A peak (2A continuous at 25°C) to turn a discrete MOSFET or IGBT on or off. |
| 8 | VCC | power_in | Supply voltage pin that powers the device, recommended 4.5V to 35V (absolute maximum 40V). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | IXYS |
| Package | SOIC-8 |
| Category | Interface ICs |
| Pins | 8 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Input Voltage, High (TA = 25°C table) | VIH | 3 |  |  | V | 4.5V < VCC < 18V | 4 |
| Input Voltage, Low (TA = 25°C table) | VIL |  |  | -0.8 | V | 4.5V < VCC < 18V | 4 |
| Input Current (TA = 25°C table) | IIN | -10 |  | 10 | µA | 0V < VIN < VCC | 4 |
| Output Voltage, Low (TA = 25°C table) | VOL |  |  | 0.025 | V | - | 4 |
| Output Resistance, High State (TA = 25°C table) | ROH |  | 0.6 | 1 | Ω | VCC=18V, IOUT=-100mA | 4 |
| Output Resistance, Low State (TA = 25°C table) | ROL |  | 0.4 | 0.8 | Ω | VCC=18V, IOUT=100mA | 4 |
| Output Current, Continuous (TA = 25°C table) | IDC | -2 |  | 2 | A | Limited by package power dissipation | 4 |
| Rise Time (TA = 25°C table) | tr |  | 22 | 35 | ns | VCC=18V, CLOAD=10nF | 4 |
| Fall Time (TA = 25°C table) | tf |  | 15 | 25 | ns | VCC=18V, CLOAD=10nF | 4 |
| On-Time Propagation Delay (TA = 25°C table) | tondly |  | 40 | 60 | ns | VCC=18V, CLOAD=10nF | 4 |
| Off-Time Propagation Delay (TA = 25°C table) | toffdly |  | 42 | 60 | ns | VCC=18V, CLOAD=10nF | 4 |
| Power Supply Current (TA = 25°C table) | ICC |  | 1 | 2 | mA | VCC=18V, VIN=3.5V | 4 |
| Power Supply Current (TA = 25°C table) | ICC |  |  | 10 | µA | VCC=18V, VIN=0V | 4 |
| Input Voltage, High (TA = -40°C to +125°C table) | VIH | 3.3 |  |  | V | 4.5V < VCC < 18V | 4 |
| Input Voltage, Low (TA = -40°C to +125°C table) | VIL |  |  | -0.65 | V | 4.5V < VCC < 18V | 4 |
| Input Current (TA = -40°C to +125°C table) | IIN | -10 |  | 10 | µA | 0V < VIN < VCC | 4 |
| Output Voltage, Low (TA = -40°C to +125°C table) | VOL |  |  | 0.025 | V | - | 4 |
| Output Resistance, High State (TA = -40°C to +125°C table) | ROH |  |  | 2 | Ω | VCC=18V, IOUT=-100mA | 4 |
| Output Resistance, Low State (TA = -40°C to +125°C table) | ROL |  |  | 1.5 | Ω | VCC=18V, IOUT=100mA | 4 |
| Output Current, Continuous (TA = -40°C to +125°C table) | IDC | -1 |  | 1 | A | Limited by package power dissipation | 4 |
| Rise Time (TA = -40°C to +125°C table) | tr |  |  | 40 | ns | VCC=18V, CLOAD=10nF | 4 |
| Fall Time (TA = -40°C to +125°C table) | tf |  |  | 30 | ns | VCC=18V, CLOAD=10nF | 4 |
| On-Time Propagation Delay (TA = -40°C to +125°C table) | tondly |  |  | 75 | ns | VCC=18V, CLOAD=10nF | 4 |
| Off-Time Propagation Delay (TA = -40°C to +125°C table) | toffdly |  |  | 75 | ns | VCC=18V, CLOAD=10nF | 4 |
| Power Supply Current (TA = -40°C to +125°C table) | ICC |  |  | 2.5 | mA | VCC=18V, VIN=3.5V | 4 |
| Power Supply Current (TA = -40°C to +125°C table) | ICC |  |  | 150 | µA | VCC=18V, VIN=0V | 4 |
| Supply Voltage | VCC | 4.5 |  | 35 | V |  | 3 |
| Operating Temperature Range | TA | -40 |  | 125 | °C |  | 3 |
| Supply Voltage | VCC | -0.3 |  | 40 | V |  | 3 |
| Input Voltage | VIN | -5 |  |  | V |  | 3 |
| Output Current | IOUT | -9 |  | 9 | A |  | 3 |
| Junction Temperature | TJ | -55 |  | 150 | °C |  | 3 |
| Storage Temperature | TSTG | -65 |  | 150 | °C |  | 3 |
| Thermal Impedance, Junction-to-Ambient (8-Pin SOIC, SIA) | θJA |  | 120 |  | °C/W | SIA (8-Pin SOIC) | 5 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC |  | Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod | 10 |

## CAD (KiCad official)

- Symbol: `IXDI609SIATR`
- Footprint: `Package_SO:SOIC-8_3.9x4.9mm_P1.27mm`
- 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files: `ixdi609siatr-etched.step` / `ixdi609siatr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ixdi609siatr.step` / `ixdi609siatr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [IXYS datasheet](docs/ixdi609siatr-datasheet.pdf) (14 pp, sha256 `f7a2276a0481ea78`, retrieved 2026-10-30, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ixdi609siatr-datasheet.pdf)