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IXDI602SIATR

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Littelfuse IXYS Gate Drivers, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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IXDI602SIATR

Littelfuse IXYS · Gate Drivers · SOIC-8

IXDI602SIATR from Littelfuse IXYS, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected No connection.
2 INA input Channel A logic input, CMOS compatible, withstands negative swing down to -5.0V and up to VCC+0.3V; the IXDI602 inverts it at OUTA.
3 GND power_in Ground - common ground reference for the device.
4 INB input Channel B logic input, CMOS compatible, withstands negative swing down to -5.0V and up to VCC+0.3V; the IXDI602 inverts it at OUTB.
5 OUTB output Channel B output - sources or sinks current (2A peak, ±1A continuous) to turn on or off a discrete MOSFET or IGBT.
6 VCC power_in Supply voltage - provides power to the device, 4.5V to 35V recommended (40V absolute maximum).
7 OUTA output Channel A output - sources or sinks current (2A peak, ±1A continuous) to turn on or off a discrete MOSFET or IGBT.
8 NC unconnected No connection.

Key specifications

Parameter Value
Manufacturer Littelfuse IXYS
Package SOIC-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage (Sec 1.4 Recommended Operating Conditions) VCC 4.5 35 V 3
Operating Temperature Range (Sec 1.4 Recommended Operating Conditions) TA -40 125 °C 3
Supply Voltage (Sec 1.3 Absolute Maximum Ratings) VCC -0.3 40 V 3
Input Voltage (Sec 1.3 Absolute Maximum Ratings) VIN -5 V 3
Output Current (Sec 1.3 Absolute Maximum Ratings) IOUT -2 2 A 3
Junction Temperature (Sec 1.3 Absolute Maximum Ratings) TJ -55 150 °C 3
Storage Temperature (Sec 1.3 Absolute Maximum Ratings) TSTG -65 150 °C 3
Input Voltage, High (Sec 1.5, TA = 25°C) VIH 3 V 4.5V < VCC < 18V 4
Input Voltage, Low (Sec 1.5, TA = 25°C) VIL 0.8 V 4.5V < VCC < 18V 4
Input Current (Sec 1.5, TA = 25°C) IIN -10 10 μA 0V < VIN < VCC 4
Output Voltage, Low (Sec 1.5, TA = 25°C) VOL 0.025 V 4
Output Resistance, High State (Sec 1.5, TA = 25°C) ROH 2.5 4 Ω VCC=18V, IOUT=-10mA 4
Output Resistance, Low State (Sec 1.5, TA = 25°C) ROL 1.5 3 Ω VCC=18V, IOUT=10mA 4
Output Current, Continuous (Sec 1.5, TA = 25°C) IDC -1 1 A Limited by package power dissipation 4
Rise Time (Sec 1.5, TA = 25°C) tr 7.5 15 ns VCC=18V, CLOAD=1000pF 4
Fall Time (Sec 1.5, TA = 25°C) tf 6.5 15 ns VCC=18V, CLOAD=1000pF 4
On-Time Propagation Delay (Sec 1.5, TA = 25°C) tondly 35 60 ns VCC=18V, CLOAD=1000pF 4
Off-Time Propagation Delay (Sec 1.5, TA = 25°C) toffdly 38 60 ns VCC=18V, CLOAD=1000pF 4
Power Supply Current (Sec 1.5, TA = 25°C) ICC 1 3 mA VCC=18V, VIN=3.5V 4
Power Supply Current (Sec 1.5, TA = 25°C) ICC 10 μA VCC=18V, VIN=0V 4
Input Voltage, High (Sec 1.6, TA = -40°C to +125°C) VIH 3.3 V 4.5V < VCC < 18V 4
Input Voltage, Low (Sec 1.6, TA = -40°C to +125°C) VIL 0.65 V 4.5V < VCC < 18V 4
Input Current (Sec 1.6, TA = -40°C to +125°C) IIN -10 10 μA 0V < VIN < VCC 4
Output Voltage, Low (Sec 1.6, TA = -40°C to +125°C) VOL 0.025 V 4
Output Resistance, High State (Sec 1.6, TA = -40°C to +125°C) ROH 6 Ω VCC=18V, IOUT=-10mA 4
Output Resistance, Low State (Sec 1.6, TA = -40°C to +125°C) ROL 5 Ω VCC=18V, IOUT=10mA 4
Output Current, Continuous (Sec 1.6, TA = -40°C to +125°C) IDC -1 1 A Limited by package power dissipation 4
Rise Time (Sec 1.6, TA = -40°C to +125°C) tr 18 ns VCC=18V, CLOAD=1000pF 4
Fall Time (Sec 1.6, TA = -40°C to +125°C) tf 18 ns VCC=18V, CLOAD=1000pF 4
On-Time Propagation Delay (Sec 1.6, TA = -40°C to +125°C) tondly 75 ns VCC=18V, CLOAD=1000pF 4
Off-Time Propagation Delay (Sec 1.6, TA = -40°C to +125°C) toffdly 75 ns VCC=18V, CLOAD=1000pF 4
Power Supply Current (Sec 1.6, TA = -40°C to +125°C) ICC 3.5 mA VCC=18V, VIN=3.5V 4
Power Supply Current (Sec 1.6, TA = -40°C to +125°C) ICC 150 μA VCC=18V, VIN=0V 4
Thermal Resistance, Junction-to-Ambient (8-Pin SOIC, IXD_602SIA) JA 120 °C/W 8-Pin SOIC (IXD_602SIA) 5

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod 10

CAD (KiCad official)

  • Symbol: IXDI602SIATR
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8 (KiCad packages3D, STEP)
  • 3D model files: ixdi602siatr-etched.step / ixdi602siatr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixdi602siatr.step / ixdi602siatr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse IXYS datasheet (13 pp, sha256 9c4eda3c9dd0b7f0, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF