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IXDD614YI

Public Made by Adom

by adom

IXYS Gate Drive ICs, TO-263-5. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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Contents

README

markdown

IXDD614YI

IXYS · Gate Drive ICs · TO-263-5

IXDD614YI from IXYS, in a TO-263-5. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage pin that powers the device, with a recommended range of 4.5V to 35V (absolute maximum 40V).
2 OUT output Driver output that sources or sinks up to 14A peak to turn a discrete MOSFET or IGBT on or off.
3 GND power_in Ground, the common ground reference for the device.
4 IN input Logic input, with VIH of 3.0V min and VIL of 0.8V max at 25°C, and it withstands a negative swing down to -5V.
5 EN input Output enable for the IXDD614: drive low (below 1/3 VCC) to disable the output and force it to a high-impedance state, with VENH at 2/3 VCC min and an internal pull-up of about 200kΩ.
6 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer IXYS
Package TO-263-5
Category Power Management ICs
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage, High VIH 3 V TA=25°C, 4.5V < VCC < 18V 4
Input Voltage, Low VIL 0.8 V TA=25°C, 4.5V < VCC < 18V 4
Input Current IIN -10 10 µA TA=25°C, 0V < VIN < VCC 4
Output Voltage, Low VOL 0.025 V TA=25°C 4
Output Resistance, High State ROH 0.4 0.8 Ω TA=25°C, VCC=18V, IOUT=-100mA 4
Output Resistance, Low State ROL 0.3 0.6 Ω TA=25°C, VCC=18V, IOUT=100mA 4
Output Current, Continuous IDC -4 4 A TA=25°C, limited by package power dissipation 4
Rise Time tR 25 35 ns TA=25°C, CLOAD=15nF, VCC=18V 4
Fall Time tF 18 25 ns TA=25°C, CLOAD=15nF, VCC=18V 4
On-Time Propagation Delay tONDELAY 50 70 ns TA=25°C, CLOAD=15nF, VCC=18V 4
Off-Time Propagation Delay tOFFDELAY 50 70 ns TA=25°C, CLOAD=15nF, VCC=18V 4
Enable to Output-High Delay Time tENOH 31 60 ns TA=25°C, IXDD614 only 4
Disable to High Impedance State Delay Time tDOLD 44 70 ns TA=25°C, IXDD614 only 4
Power Supply Current ICC 1 2 mA TA=25°C, VCC=18V, VIN=3.5V 4
Power Supply Current ICC 10 µA TA=25°C, VCC=18V, VIN=0V (typ <1) 4
Input Voltage, High VIH 3.3 V TA=-40°C to +125°C, 4.5V < VCC < 18V 5
Input Voltage, Low VIL 0.65 V TA=-40°C to +125°C, 4.5V < VCC < 18V 5
Input Current IIN -10 10 µA TA=-40°C to +125°C, 0V < VIN < VCC 5
Output Voltage, Low VOL 0.025 V TA=-40°C to +125°C 5
Output Resistance, High State ROH 1.5 Ω TA=-40°C to +125°C, VCC=18V, IOUT=-100mA 5
Output Resistance, Low State ROL 1.2 Ω TA=-40°C to +125°C, VCC=18V, IOUT=100mA 5
Output Current, Continuous IDC -1 1 A TA=-40°C to +125°C, limited by package power dissipation 5
Rise Time tR 50 ns TA=-40°C to +125°C, CLOAD=15nF, VCC=18V 5
Fall Time tF 40 ns TA=-40°C to +125°C, CLOAD=15nF, VCC=18V 5
On-Time Propagation Delay tONDELAY 90 ns TA=-40°C to +125°C, CLOAD=15nF, VCC=18V 5
Off-Time Propagation Delay tOFFDELAY 90 ns TA=-40°C to +125°C, CLOAD=15nF, VCC=18V 5
Enable to Output-High Delay Time tENOH 75 ns TA=-40°C to +125°C, IXDD614 only 5
Disable to High Impedance State Delay Time tDOLD 85 ns TA=-40°C to +125°C, IXDD614 only 5
Power Supply Current ICC 3 mA TA=-40°C to +125°C, VCC=18V, VIN=3.5V 5
Power Supply Current ICC 150 µA TA=-40°C to +125°C, VCC=18V, VIN=0V 5
Supply Voltage VCC -0.3 40 V 3
Input Voltage VIN, VEN -5 V max printed as VCC+0.3 3
Output Current IOUT -14 14 A 3
Junction Temperature TJ -55 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Supply Voltage VCC 4.5 35 V 3
Operating Temperature Range TA -40 125 °C 3
Thermal Impedance, Junction-to-Ambient θJA 46 °C/W YI (5-Pin TO-263) 6
Thermal Impedance, Junction-to-Case θJC 2 °C/W YI (5-Pin TO-263) 6
Enable Pull-Up Resistor REN 200 kΩ TA=25°C, IXDD614 only 4

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod 11

CAD (KiCad official)

  • Symbol: IXDD614YI
  • Footprint: Package_TO_SOT_SMD:TO-263-5_TabPin6
  • 3D model: TO-263-5 (KiCad packages3D, STEP)
  • 3D model files: ixdd614yi-etched.step / ixdd614yi-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixdd614yi.step / ixdd614yi.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: IXYS datasheet (14 pp, sha256 d958e4f5eb8be9b4, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF