# IXDD614SITR

**IXYS** · Pre-ordered Chips · SOIC-8-EP

IXDD614SITR from IXYS, in a SOIC-8-EP. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | VCC | power_in | Supply voltage pin that powers the device, recommended range 4.5V to 35V (absolute maximum 40V). |
| 2 | IN | input | Logic input; VIH min 3.0V and VIL max 0.8V at 25°C, and it withstands a negative swing of up to 5V. |
| 3 | EN | input | Output enable; drive low to disable the output and force it to a high-impedance state, with VENH of 2/3VCC and VENL of 1/3VCC and a 200k internal pull-up. |
| 4 | GND | power_in | Ground, the common ground reference for the device. |
| 5 | GND | power_in | Ground, the common ground reference for the device. |
| 6 | OUT | output | Output that sources or sinks up to 14A peak current to turn on or off a discrete MOSFET or IGBT. |
| 7 | OUT | output | Output that sources or sinks up to 14A peak current to turn on or off a discrete MOSFET or IGBT. |
| 8 | VCC | power_in | Supply voltage pin that powers the device, recommended range 4.5V to 35V (absolute maximum 40V). |
| 9 | EP | passive | Exposed pad (from the footprint; not named in the datasheet pin table). |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | IXYS |
| Package | SOIC-8-EP |
| Category | Interface ICs |
| Pins | 9 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply Voltage | VCC | -0.3 |  | 40 | V |  | 3 |
| Input Voltage | VIN, VEN | -5 |  |  | V |  | 3 |
| Output Current | IOUT | -14 |  | 14 | A |  | 3 |
| Junction Temperature | TJ | -55 |  | 150 | °C |  | 3 |
| Storage Temperature | TSTG | -65 |  | 150 | °C |  | 3 |
| Supply Voltage | VCC | 4.5 |  | 35 | V |  | 3 |
| Operating Temperature Range | TA | -40 |  | 125 | °C |  | 3 |
| Input Voltage, High | VIH | 3 |  |  | V | 4.5V < VCC < 18V | 4 |
| Input Voltage, Low | VIL |  |  | 0.8 | V | 4.5V < VCC < 18V | 4 |
| Input Current | IIN | -10 |  | 10 | A | 0V < VIN < VCC | 4 |
| Output Voltage, Low | VOL |  |  | 0.025 | V |  | 4 |
| Output Resistance, High State | ROH |  | 0.4 | 0.8 | Ω | VCC=18V, IOUT=-100mA | 4 |
| Output Resistance, Low State | ROL |  | 0.3 | 0.6 | Ω | VCC=18V, IOUT=100mA | 4 |
| Output Current, Continuous | IDC | -4 |  | 4 | A | Limited by package power dissipation | 4 |
| Rise Time | tR |  | 25 | 35 | ns | CLOAD=15nF, VCC=18V | 4 |
| Fall Time | tF |  | 18 | 25 | ns | CLOAD=15nF, VCC=18V | 4 |
| On-Time Propagation Delay | tONDELAY |  | 50 | 70 | ns | CLOAD=15nF, VCC=18V | 4 |
| Off-Time Propagation Delay | tOFFDELAY |  | 50 | 70 | ns | CLOAD=15nF, VCC=18V | 4 |
| Enable to Output-High Delay Time | tENOH |  | 31 | 60 | ns | IXDD614 only | 4 |
| Disable to High Impedance State Delay Time | tDOLD |  | 44 | 70 | ns | IXDD614 only | 4 |
| Power Supply Current | ICC |  | 1 | 2 | mA | VCC=18V, VIN=3.5V | 4 |
| Power Supply Current | ICC |  |  | 10 | A | VCC=18V, VIN=0V | 4 |
| Input Voltage, High | VIH | 3.3 |  |  | V | 4.5V < VCC < 18V | 5 |
| Input Voltage, Low | VIL |  |  | 0.65 | V | 4.5V < VCC < 18V | 5 |
| Input Current | IIN | -10 |  | 10 | A | 0V < VIN < VCC | 5 |
| Output Voltage, Low | VOL |  |  | 0.025 | V |  | 5 |
| Output Resistance, High State | ROH |  |  | 1.5 | Ω | VCC=18V, IOUT=-100mA | 5 |
| Output Resistance, Low State | ROL |  |  | 1.2 | Ω | VCC=18V, IOUT=100mA | 5 |
| Output Current, Continuous | IDC | -1 |  | 1 | A | Limited by package power dissipation | 5 |
| Rise Time | tR |  |  | 50 | ns | CLOAD=15nF, VCC=18V | 5 |
| Fall Time | tF |  |  | 40 | ns | CLOAD=15nF, VCC=18V | 5 |
| On-Time Propagation Delay | tONDELAY |  |  | 90 | ns | CLOAD=15nF, VCC=18V | 5 |
| Off-Time Propagation Delay | tOFFDELAY |  |  | 90 | ns | CLOAD=15nF, VCC=18V | 5 |
| Enable to Output-High Delay Time | tENOH |  |  | 75 | ns | IXDD614 only | 5 |
| Disable to High Impedance State Delay Time | tDOLD |  |  | 85 | ns | IXDD614 only | 5 |
| Power Supply Current | ICC |  |  | 3 | mA | VCC=18V, VIN=3.5V | 5 |
| Power Supply Current | ICC |  |  | 150 | A | VCC=18V, VIN=0V | 5 |
| Enable Pull-Up Resistor | REN |  | 200 |  | k | IXDD614 only | 4 |
| Thermal Impedance, Junction-to-Ambient (SI 8-Pin Power SOIC) | JA |  | 85 |  | °C/W |  | 6 |
| Thermal Impedance, Junction-to-Case (SI 8-Pin Power SOIC) | JC |  | 10 |  | °C/W |  | 6 |

## Materials and finish

As the datasheet states them (page.json `metadata.appearance`; the 3D model's colours follow it).

| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| housing | PC |  | Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod | 11 |

## CAD (KiCad official)

- Symbol: `IXDD614SITR`
- Footprint: `Package_SO:SOIC-8-1EP_3.9x4.9mm_P1.27mm_EP2.29x3mm`
- 3D model: SOIC-8-EP (KiCad packages3D, STEP)
- 3D model files: `ixdd614sitr-etched.step` / `ixdd614sitr-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `ixdd614sitr.step` / `ixdd614sitr.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [IXYS datasheet](docs/ixdd614sitr-datasheet.pdf) (14 pp, sha256 `d958e4f5eb8be9b4`, retrieved 2026-10-28, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-haiku-5-5` (text), consensus `claude-sonnet-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/ixdd614sitr-datasheet.pdf)