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IXDD614PI

Littelfuse IXYS · Gate Drivers · DIP-8

IXDD614PI from Littelfuse IXYS, in a DIP-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VCC power_in Supply voltage input powering the device, recommended 4.5V to 35V (absolute maximum 40V).
2 IN input Logic input; VIH min 3.0V and VIL max 0.8V at 25°C (4.5V<VCC<18V), withstands down to -5V.
3 EN input Output enable; drive low (below 1/3 VCC) to disable the output and force it to a high-impedance state, high is 2/3 VCC or above, with an internal 200k pull-up (typ).
4 GND power_in Ground, common ground reference for the device.
5 GND power_in Ground, common ground reference for the device.
6 OUT tri_state Output that sources or sinks up to 14A peak current to turn on or off a discrete MOSFET or IGBT, high impedance when EN is low.
7 OUT tri_state Output that sources or sinks up to 14A peak current to turn on or off a discrete MOSFET or IGBT, high impedance when EN is low.
8 VCC power_in Supply voltage input powering the device, recommended 4.5V to 35V (absolute maximum 40V).

Key specifications

Parameter Value
Manufacturer Littelfuse IXYS
Package DIP-8
Category Motor Driver ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Input Voltage, High VIH 3 V TA=25°C; 4.5V < VCC < 18V 4
Input Voltage, Low VIL 0.8 V TA=25°C; 4.5V < VCC < 18V 4
Input Current IIN -10 10 µA TA=25°C; 0V < VIN < VCC 4
Output Voltage, Low VOL 0.025 V TA=25°C 4
Output Resistance, High State ROH 0.4 0.8 Ω TA=25°C; VCC=18V, IOUT=-100mA 4
Output Resistance, Low State ROL 0.3 0.6 Ω TA=25°C; VCC=18V, IOUT=100mA 4
Output Current, Continuous IDC -4 4 A TA=25°C; Limited by package power dissipation 4
Rise Time tR 25 35 ns TA=25°C; CLOAD=15nF, VCC=18V 4
Fall Time tF 18 25 ns TA=25°C; CLOAD=15nF, VCC=18V 4
On-Time Propagation Delay tONDELAY 50 70 ns TA=25°C; CLOAD=15nF, VCC=18V 4
Off-Time Propagation Delay tOFFDELAY 50 70 ns TA=25°C; CLOAD=15nF, VCC=18V 4
Enable to Output-High Delay Time tENOH 31 60 ns TA=25°C; IXDD614 only 4
Disable to High Impedance State Delay Time tDOLD 44 70 ns TA=25°C; IXDD614 only 4
Power Supply Current ICC 1 2 mA TA=25°C; VCC=18V, VIN=3.5V 4
Power Supply Current ICC 10 µA TA=25°C; VCC=18V, VIN=0V 4
Input Voltage, High VIH 3.3 V TA=-40°C to +125°C; 4.5V < VCC < 18V 5
Input Voltage, Low VIL 0.65 V TA=-40°C to +125°C; 4.5V < VCC < 18V 5
Input Current IIN -10 10 µA TA=-40°C to +125°C; 0V < VIN < VCC 5
Output Voltage, Low VOL 0.025 V TA=-40°C to +125°C 5
Output Resistance, High State ROH 1.5 Ω TA=-40°C to +125°C; VCC=18V, IOUT=-100mA 5
Output Resistance, Low State ROL 1.2 Ω TA=-40°C to +125°C; VCC=18V, IOUT=100mA 5
Output Current, Continuous IDC -1 1 A TA=-40°C to +125°C; Limited by package power dissipation 5
Rise Time tR 50 ns TA=-40°C to +125°C; CLOAD=15nF, VCC=18V 5
Fall Time tF 40 ns TA=-40°C to +125°C; CLOAD=15nF, VCC=18V 5
On-Time Propagation Delay tONDELAY 90 ns TA=-40°C to +125°C; CLOAD=15nF, VCC=18V 5
Off-Time Propagation Delay tOFFDELAY 90 ns TA=-40°C to +125°C; CLOAD=15nF, VCC=18V 5
Enable to Output-High Delay Time tENOH 75 ns TA=-40°C to +125°C; IXDD614 only 5
Disable to High Impedance State Delay Time tDOLD 85 ns TA=-40°C to +125°C; IXDD614 only 5
Power Supply Current ICC 3 mA TA=-40°C to +125°C; VCC=18V, VIN=3.5V 5
Power Supply Current ICC 150 µA TA=-40°C to +125°C; VCC=18V, VIN=0V 5
Supply Voltage VCC -0.3 40 V 3
Input Voltage VIN, VEN -5 V 3
Output Current IOUT -14 14 A 3
Junction Temperature TJ -55 150 °C 3
Storage Temperature TSTG -65 150 °C 3
Supply Voltage VCC 4.5 35 V 3
Operating Temperature Range TA -40 125 °C 3
Thermal Impedance, Junction-to-Ambient (PI 8-Pin DIP) JA 125 °C/W PI (8-Pin DIP) 6

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC Circuits Division classifies its plastic encapsulated devices for moisture sensitivity according to the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of prod 11

CAD (KiCad official)

  • Symbol: IXDD614PI
  • Footprint: Package_DIP:DIP-8_W7.62mm
  • 3D model: DIP-8 (KiCad packages3D, STEP)
  • 3D model files: ixdd614pi-etched.step / ixdd614pi-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ixdd614pi.step / ixdd614pi.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Littelfuse IXYS datasheet (14 pp, sha256 d958e4f5eb8be9b4, retrieved 2026-10-15, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF